ADHERING METHOD OF COPPER TO RESIN
PURPOSE:To heighten the adhesion strength of copper to resin and its acid resistance by a method in which when copper is stuck to resin, the process forming a copper oxide-layer on the surface of copper and the process reducing the formed copper oxide-layer to metallic copper by the acid reducing so...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OKI NOBUAKI NOHARA SHOZO WAJIMA MOTOYO FURUKAWA KIYONORI AKABOSHI HARUO |
| description | PURPOSE:To heighten the adhesion strength of copper to resin and its acid resistance by a method in which when copper is stuck to resin, the process forming a copper oxide-layer on the surface of copper and the process reducing the formed copper oxide-layer to metallic copper by the acid reducing solution with at most a specified value of E16 A, are used. CONSTITUTION:When copper is stuck to resin, after the copper oxide layer formed on the surface of the copper has been reduced to metallic copper by the acid reducing solution with at most 7.0 of E 16 A, if they are pressure bonded under heating, excellent acid resistance and adhesion strength may be obtained. Since acid reducing solution is used, the water cleaning effect after dipping is excellent, and its fatty layer is not deteriorated. As the copper oxide layer-forming method, the water solution containing oxidizing agent is preferably used. In order to reduce the formed copper oxide layer to metal, the acid solution in which at least one kind in amine boran group shown by the general formula of BH3.NHRR'(R,R':H, CH3, CH2, CH3) is mixed with the chemical of boron group, is preferably used. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0349932A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0349932A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0349932A3</originalsourceid><addsrcrecordid>eNrjZFBydPFwDfL0c1fwdQ3x8HdR8HdTcPYPCHANUgjxVwhyDfb042FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHgbGJpaWxkaOxkQoAQDipCIK</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADHERING METHOD OF COPPER TO RESIN</title><source>esp@cenet</source><creator>OKI NOBUAKI ; NOHARA SHOZO ; WAJIMA MOTOYO ; FURUKAWA KIYONORI ; AKABOSHI HARUO</creator><creatorcontrib>OKI NOBUAKI ; NOHARA SHOZO ; WAJIMA MOTOYO ; FURUKAWA KIYONORI ; AKABOSHI HARUO</creatorcontrib><description>PURPOSE:To heighten the adhesion strength of copper to resin and its acid resistance by a method in which when copper is stuck to resin, the process forming a copper oxide-layer on the surface of copper and the process reducing the formed copper oxide-layer to metallic copper by the acid reducing solution with at most a specified value of E16 A, are used. CONSTITUTION:When copper is stuck to resin, after the copper oxide layer formed on the surface of the copper has been reduced to metallic copper by the acid reducing solution with at most 7.0 of E 16 A, if they are pressure bonded under heating, excellent acid resistance and adhesion strength may be obtained. Since acid reducing solution is used, the water cleaning effect after dipping is excellent, and its fatty layer is not deteriorated. As the copper oxide layer-forming method, the water solution containing oxidizing agent is preferably used. In order to reduce the formed copper oxide layer to metal, the acid solution in which at least one kind in amine boran group shown by the general formula of BH3.NHRR'(R,R':H, CH3, CH2, CH3) is mixed with the chemical of boron group, is preferably used.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910304&DB=EPODOC&CC=JP&NR=H0349932A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910304&DB=EPODOC&CC=JP&NR=H0349932A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKI NOBUAKI</creatorcontrib><creatorcontrib>NOHARA SHOZO</creatorcontrib><creatorcontrib>WAJIMA MOTOYO</creatorcontrib><creatorcontrib>FURUKAWA KIYONORI</creatorcontrib><creatorcontrib>AKABOSHI HARUO</creatorcontrib><title>ADHERING METHOD OF COPPER TO RESIN</title><description>PURPOSE:To heighten the adhesion strength of copper to resin and its acid resistance by a method in which when copper is stuck to resin, the process forming a copper oxide-layer on the surface of copper and the process reducing the formed copper oxide-layer to metallic copper by the acid reducing solution with at most a specified value of E16 A, are used. CONSTITUTION:When copper is stuck to resin, after the copper oxide layer formed on the surface of the copper has been reduced to metallic copper by the acid reducing solution with at most 7.0 of E 16 A, if they are pressure bonded under heating, excellent acid resistance and adhesion strength may be obtained. Since acid reducing solution is used, the water cleaning effect after dipping is excellent, and its fatty layer is not deteriorated. As the copper oxide layer-forming method, the water solution containing oxidizing agent is preferably used. In order to reduce the formed copper oxide layer to metal, the acid solution in which at least one kind in amine boran group shown by the general formula of BH3.NHRR'(R,R':H, CH3, CH2, CH3) is mixed with the chemical of boron group, is preferably used.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBydPFwDfL0c1fwdQ3x8HdR8HdTcPYPCHANUgjxVwhyDfb042FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHgbGJpaWxkaOxkQoAQDipCIK</recordid><startdate>19910304</startdate><enddate>19910304</enddate><creator>OKI NOBUAKI</creator><creator>NOHARA SHOZO</creator><creator>WAJIMA MOTOYO</creator><creator>FURUKAWA KIYONORI</creator><creator>AKABOSHI HARUO</creator><scope>EVB</scope></search><sort><creationdate>19910304</creationdate><title>ADHERING METHOD OF COPPER TO RESIN</title><author>OKI NOBUAKI ; NOHARA SHOZO ; WAJIMA MOTOYO ; FURUKAWA KIYONORI ; AKABOSHI HARUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0349932A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>OKI NOBUAKI</creatorcontrib><creatorcontrib>NOHARA SHOZO</creatorcontrib><creatorcontrib>WAJIMA MOTOYO</creatorcontrib><creatorcontrib>FURUKAWA KIYONORI</creatorcontrib><creatorcontrib>AKABOSHI HARUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKI NOBUAKI</au><au>NOHARA SHOZO</au><au>WAJIMA MOTOYO</au><au>FURUKAWA KIYONORI</au><au>AKABOSHI HARUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHERING METHOD OF COPPER TO RESIN</title><date>1991-03-04</date><risdate>1991</risdate><abstract>PURPOSE:To heighten the adhesion strength of copper to resin and its acid resistance by a method in which when copper is stuck to resin, the process forming a copper oxide-layer on the surface of copper and the process reducing the formed copper oxide-layer to metallic copper by the acid reducing solution with at most a specified value of E16 A, are used. CONSTITUTION:When copper is stuck to resin, after the copper oxide layer formed on the surface of the copper has been reduced to metallic copper by the acid reducing solution with at most 7.0 of E 16 A, if they are pressure bonded under heating, excellent acid resistance and adhesion strength may be obtained. Since acid reducing solution is used, the water cleaning effect after dipping is excellent, and its fatty layer is not deteriorated. As the copper oxide layer-forming method, the water solution containing oxidizing agent is preferably used. In order to reduce the formed copper oxide layer to metal, the acid solution in which at least one kind in amine boran group shown by the general formula of BH3.NHRR'(R,R':H, CH3, CH2, CH3) is mixed with the chemical of boron group, is preferably used.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH0349932A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | ADHERING METHOD OF COPPER TO RESIN |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T15%3A00%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OKI%20NOBUAKI&rft.date=1991-03-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0349932A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |