SEALING METHOD OF BEAR CHIP

SEALING METHOD OF BEAR CHIP

PURPOSE:To improve reliabilty at the time of sealing in the case of bear chip mounting, by spreading highly viscous sealing agent around the bear chip, and spreading low viscous sealing agent around the region surrounded by the highly viscous sealing agent. CONSTITUTION:A bear chip 2 is mounted on a...

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1. Verfasser: IKETAKI KENJI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PURPOSE:To improve reliabilty at the time of sealing in the case of bear chip mounting, by spreading highly viscous sealing agent around the bear chip, and spreading low viscous sealing agent around the region surrounded by the highly viscous sealing agent. CONSTITUTION:A bear chip 2 is mounted on a substrate 1 by die bonding. Metal wires 4 of gold, aluminum, etc., protruding from the die of the bear chip 2 are connected with pads 3 formed at specified positions on the substrate 1. For the bear chip 2 and the wires 4, highly viscous sealing agent 6 being epoxy system resin is spread so as to cover the periphery of the bear chip 2, outside the wires 4. After that, low viscous sealing agent 5 being the same epoxy system resin is spread on the region surrounded by the highly viscous sealing resin 6. In order to restrain the generation of air bubble to as little as possible when the low viscous sealing agent 5 is spread, ultrasonic vibration is applied.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEALING METHOD OF BEAR CHIP
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