NONSLIP VARNISH, NONSLIP PROCESSING METHOD USING SAID VARNISH AND MANUFACTURE OF CORRUGATED BOARD APPLYING SAID PROCESSING

PURPOSE:To improve the antiblocking performance, abrasion resistance and heat resistance by adding a prescribed quantity of the inorganic minute particle fillers into the slide preventing varnish in which the aqeous sticking agent and the alkali-soluble water-soluble resin having a certain glass tra...

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Hauptverfasser: KODAIKU MASANORI, HIGASHINAKA FUSAO, KOJIMA MITSURU
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creator KODAIKU MASANORI
HIGASHINAKA FUSAO
KOJIMA MITSURU
description PURPOSE:To improve the antiblocking performance, abrasion resistance and heat resistance by adding a prescribed quantity of the inorganic minute particle fillers into the slide preventing varnish in which the aqeous sticking agent and the alkali-soluble water-soluble resin having a certain glass transition temperature are compounded in each prescribed ratio. CONSTITUTION:Nonslip varnish is adjusted by compounding 40-100 wt. parts of alkali-soluble water-soluble resin having a glass transition temperature of 80 deg.C or more, e.g., styrene/maleic acid copolymer having a molecular weight of 5,000-60,000 into 100 wt. parts of aqueous sticking agent such as ethylene/vinyl acetate copolymer emulsion. Further, the inorganic minute particle fillers, e.g., silica powder having a particle diametre of 1-20 mu is added in 2-10 wt.% (solid portion) into the nonslip varnish. After this varnish is applied to the surface of a paper container, etc., a corrugated board is formed by a corrugator machine. With this constitution, the antiblocking performance, abrasion resistance and heat resistance can be improved.
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CONSTITUTION:Nonslip varnish is adjusted by compounding 40-100 wt. parts of alkali-soluble water-soluble resin having a glass transition temperature of 80 deg.C or more, e.g., styrene/maleic acid copolymer having a molecular weight of 5,000-60,000 into 100 wt. parts of aqueous sticking agent such as ethylene/vinyl acetate copolymer emulsion. Further, the inorganic minute particle fillers, e.g., silica powder having a particle diametre of 1-20 mu is added in 2-10 wt.% (solid portion) into the nonslip varnish. After this varnish is applied to the surface of a paper container, etc., a corrugated board is formed by a corrugator machine. 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CONSTITUTION:Nonslip varnish is adjusted by compounding 40-100 wt. parts of alkali-soluble water-soluble resin having a glass transition temperature of 80 deg.C or more, e.g., styrene/maleic acid copolymer having a molecular weight of 5,000-60,000 into 100 wt. parts of aqueous sticking agent such as ethylene/vinyl acetate copolymer emulsion. Further, the inorganic minute particle fillers, e.g., silica powder having a particle diametre of 1-20 mu is added in 2-10 wt.% (solid portion) into the nonslip varnish. After this varnish is applied to the surface of a paper container, etc., a corrugated board is formed by a corrugator machine. With this constitution, the antiblocking performance, abrasion resistance and heat resistance can be improved.</abstract><oa>free_for_read</oa></addata></record>
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subjects ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
CORRECTING FLUIDS
DYES
EQUIPMENT FOR SHIPPING
FILLING PASTES
HANDLING THIN OR FILAMENTARY MATERIAL
IMPREGNATING OR COATING OF PAPER
INKS
LINING MACHINES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PACKAGES
PACKAGING ELEMENTS
PACKING
PAINTS
PAPER NOT OTHERWISE PROVIDED FOR
PAPER-MAKING
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D
PRINTING
PRINTING MACHINES OR PRESSES
PRODUCTION OF CELLULOSE
PULP COMPOSITIONS
RELATED EQUIPMENT
SHIPS OR OTHER WATERBORNE VESSELS
STAMPS
STORING
TEXTILES
TRANSPORTING
TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G
TYPEWRITERS
USE OF MATERIALS THEREFOR
WOODSTAINS
title NONSLIP VARNISH, NONSLIP PROCESSING METHOD USING SAID VARNISH AND MANUFACTURE OF CORRUGATED BOARD APPLYING SAID PROCESSING
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