WASHING DEVICE FOR SEMICONDUCTOR SUBSTRATE
PURPOSE:To enable fine foreign objects, dust, etc., to be removed efficiently by rotary-driving a semiconductor substrate in both left and right directions and by spraying a fluid or a gas matching to the rotation onto the front and rear surfaces of the semiconductor substrate. CONSTITUTION:A semico...
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creator | FUJITA YOSHIMOTO HIGUCHI TOMIO |
description | PURPOSE:To enable fine foreign objects, dust, etc., to be removed efficiently by rotary-driving a semiconductor substrate in both left and right directions and by spraying a fluid or a gas matching to the rotation onto the front and rear surfaces of the semiconductor substrate. CONSTITUTION:A semiconductor substrate 46 is supported by a rotary-drive pulley 43 and two supporting guide pulleys 42, rotation of a motor for rotary- driving wafer 41 is transmitted to the rotary-drive pulley 43 by the drive belt 42, thus enabling the semiconductor substrate 46 to rotate at high speed. Then, each fluid is sprayed out of a pressurized water, a chemical solution, and an inactive gas jet-out port 44 and is sprayed over the semiconductor substrate 46. Thus, the semiconductor substrate 46 is fitted vertically and the front and rear surfaces of the substrate 46 are washed simultaneously while being rotated so that the rear surface can be washed simultaneously. Also, foreign objects, dust, etc., separated from the semiconductor substrate 46 by the fluid drop effectively and do not remain on the surface of the semiconductor substrate. |
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CONSTITUTION:A semiconductor substrate 46 is supported by a rotary-drive pulley 43 and two supporting guide pulleys 42, rotation of a motor for rotary- driving wafer 41 is transmitted to the rotary-drive pulley 43 by the drive belt 42, thus enabling the semiconductor substrate 46 to rotate at high speed. Then, each fluid is sprayed out of a pressurized water, a chemical solution, and an inactive gas jet-out port 44 and is sprayed over the semiconductor substrate 46. Thus, the semiconductor substrate 46 is fitted vertically and the front and rear surfaces of the substrate 46 are washed simultaneously while being rotated so that the rear surface can be washed simultaneously. Also, foreign objects, dust, etc., separated from the semiconductor substrate 46 by the fluid drop effectively and do not remain on the surface of the semiconductor substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901012&DB=EPODOC&CC=JP&NR=H02253620A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901012&DB=EPODOC&CC=JP&NR=H02253620A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJITA YOSHIMOTO</creatorcontrib><creatorcontrib>HIGUCHI TOMIO</creatorcontrib><title>WASHING DEVICE FOR SEMICONDUCTOR SUBSTRATE</title><description>PURPOSE:To enable fine foreign objects, dust, etc., to be removed efficiently by rotary-driving a semiconductor substrate in both left and right directions and by spraying a fluid or a gas matching to the rotation onto the front and rear surfaces of the semiconductor substrate. CONSTITUTION:A semiconductor substrate 46 is supported by a rotary-drive pulley 43 and two supporting guide pulleys 42, rotation of a motor for rotary- driving wafer 41 is transmitted to the rotary-drive pulley 43 by the drive belt 42, thus enabling the semiconductor substrate 46 to rotate at high speed. Then, each fluid is sprayed out of a pressurized water, a chemical solution, and an inactive gas jet-out port 44 and is sprayed over the semiconductor substrate 46. Thus, the semiconductor substrate 46 is fitted vertically and the front and rear surfaces of the substrate 46 are washed simultaneously while being rotated so that the rear surface can be washed simultaneously. Also, foreign objects, dust, etc., separated from the semiconductor substrate 46 by the fluid drop effectively and do not remain on the surface of the semiconductor substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKdwz28PRzV3BxDfN0dlVw8w9SCHb19XT293MJdQ4B8UKdgkOCHENceRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvFeAh4GRkamxmZGBozExagBnkCT_</recordid><startdate>19901012</startdate><enddate>19901012</enddate><creator>FUJITA YOSHIMOTO</creator><creator>HIGUCHI TOMIO</creator><scope>EVB</scope></search><sort><creationdate>19901012</creationdate><title>WASHING DEVICE FOR SEMICONDUCTOR SUBSTRATE</title><author>FUJITA YOSHIMOTO ; HIGUCHI TOMIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH02253620A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJITA YOSHIMOTO</creatorcontrib><creatorcontrib>HIGUCHI TOMIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJITA YOSHIMOTO</au><au>HIGUCHI TOMIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WASHING DEVICE FOR SEMICONDUCTOR SUBSTRATE</title><date>1990-10-12</date><risdate>1990</risdate><abstract>PURPOSE:To enable fine foreign objects, dust, etc., to be removed efficiently by rotary-driving a semiconductor substrate in both left and right directions and by spraying a fluid or a gas matching to the rotation onto the front and rear surfaces of the semiconductor substrate. CONSTITUTION:A semiconductor substrate 46 is supported by a rotary-drive pulley 43 and two supporting guide pulleys 42, rotation of a motor for rotary- driving wafer 41 is transmitted to the rotary-drive pulley 43 by the drive belt 42, thus enabling the semiconductor substrate 46 to rotate at high speed. Then, each fluid is sprayed out of a pressurized water, a chemical solution, and an inactive gas jet-out port 44 and is sprayed over the semiconductor substrate 46. Thus, the semiconductor substrate 46 is fitted vertically and the front and rear surfaces of the substrate 46 are washed simultaneously while being rotated so that the rear surface can be washed simultaneously. Also, foreign objects, dust, etc., separated from the semiconductor substrate 46 by the fluid drop effectively and do not remain on the surface of the semiconductor substrate.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | WASHING DEVICE FOR SEMICONDUCTOR SUBSTRATE |
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