COATING COMPOSITION
PURPOSE:To prepare a coating compsn. which gives a cured product excellent in the heat resistance and insulating properties by compounding an epoxy resin and a specific imide compd. as essential components. CONSTITUTION:An epoxy resin and an image compd. of the formula (wherein X is NH2 or OH; Ar1 a...
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creator | UEDA YOICHI KAMIO KUNIMASA |
description | PURPOSE:To prepare a coating compsn. which gives a cured product excellent in the heat resistance and insulating properties by compounding an epoxy resin and a specific imide compd. as essential components. CONSTITUTION:An epoxy resin and an image compd. of the formula (wherein X is NH2 or OH; Ar1 and Ar2 are each an arom. residue; R1 is 1-10C alkyl; R2 is H, 1-20C alkyl, alkoxy, or OH; and m and n are each 0-30) are compounded as essential components to give a coating compsn. The resulting coating compsn. can give a cured product having excellent heat resistance and insulating properties which have been unobtainable so far. A conventional epoxy resin coating compsn. using a curing agent such as an aliph. amine, arom. amine, polyamide resin, imidazole compd., acid anhydride, and polyphenol gives a cured product with a poor heat resistance, and its properties are degraded at 150 deg.C or higher; such a problem can be solved by using said resulting coating compsn. |
format | Patent |
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CONSTITUTION:An epoxy resin and an image compd. of the formula (wherein X is NH2 or OH; Ar1 and Ar2 are each an arom. residue; R1 is 1-10C alkyl; R2 is H, 1-20C alkyl, alkoxy, or OH; and m and n are each 0-30) are compounded as essential components to give a coating compsn. The resulting coating compsn. can give a cured product having excellent heat resistance and insulating properties which have been unobtainable so far. A conventional epoxy resin coating compsn. using a curing agent such as an aliph. amine, arom. amine, polyamide resin, imidazole compd., acid anhydride, and polyphenol gives a cured product with a poor heat resistance, and its properties are degraded at 150 deg.C or higher; such a problem can be solved by using said resulting coating compsn.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901004&DB=EPODOC&CC=JP&NR=H02248478A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901004&DB=EPODOC&CC=JP&NR=H02248478A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEDA YOICHI</creatorcontrib><creatorcontrib>KAMIO KUNIMASA</creatorcontrib><title>COATING COMPOSITION</title><description>PURPOSE:To prepare a coating compsn. which gives a cured product excellent in the heat resistance and insulating properties by compounding an epoxy resin and a specific imide compd. as essential components. CONSTITUTION:An epoxy resin and an image compd. of the formula (wherein X is NH2 or OH; Ar1 and Ar2 are each an arom. residue; R1 is 1-10C alkyl; R2 is H, 1-20C alkyl, alkoxy, or OH; and m and n are each 0-30) are compounded as essential components to give a coating compsn. The resulting coating compsn. can give a cured product having excellent heat resistance and insulating properties which have been unobtainable so far. A conventional epoxy resin coating compsn. using a curing agent such as an aliph. amine, arom. amine, polyamide resin, imidazole compd., acid anhydride, and polyphenol gives a cured product with a poor heat resistance, and its properties are degraded at 150 deg.C or higher; such a problem can be solved by using said resulting coating compsn.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB29ncM8fRzV3D29w3wD_YM8fT342FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgZGRiYWJuYWjsbEqAEAbnMeuw</recordid><startdate>19901004</startdate><enddate>19901004</enddate><creator>UEDA YOICHI</creator><creator>KAMIO KUNIMASA</creator><scope>EVB</scope></search><sort><creationdate>19901004</creationdate><title>COATING COMPOSITION</title><author>UEDA YOICHI ; KAMIO KUNIMASA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH02248478A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>UEDA YOICHI</creatorcontrib><creatorcontrib>KAMIO KUNIMASA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEDA YOICHI</au><au>KAMIO KUNIMASA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COATING COMPOSITION</title><date>1990-10-04</date><risdate>1990</risdate><abstract>PURPOSE:To prepare a coating compsn. which gives a cured product excellent in the heat resistance and insulating properties by compounding an epoxy resin and a specific imide compd. as essential components. CONSTITUTION:An epoxy resin and an image compd. of the formula (wherein X is NH2 or OH; Ar1 and Ar2 are each an arom. residue; R1 is 1-10C alkyl; R2 is H, 1-20C alkyl, alkoxy, or OH; and m and n are each 0-30) are compounded as essential components to give a coating compsn. The resulting coating compsn. can give a cured product having excellent heat resistance and insulating properties which have been unobtainable so far. A conventional epoxy resin coating compsn. using a curing agent such as an aliph. amine, arom. amine, polyamide resin, imidazole compd., acid anhydride, and polyphenol gives a cured product with a poor heat resistance, and its properties are degraded at 150 deg.C or higher; such a problem can be solved by using said resulting coating compsn.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
title | COATING COMPOSITION |
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