CALCULATION OF ANGLE OF BONDING COMPONENT

PURPOSE:To determine the angle of inclination of a bonding component by a method wherein the lengths between a plurality of points along the sides of the bonding component and the reference coordinate point are calculated and the found length to each coordinate point is added. CONSTITUTION:In refere...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NISHIMAKI KOUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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