MANUFACTURE OF SEMICONDUCTOR CERAMIC ELECTRONIC PART

MANUFACTURE OF SEMICONDUCTOR CERAMIC ELECTRONIC PART

PURPOSE:To prevent development of corrosion of silver solder and migration by forming an electroless plated layer which is a first external electrode layer and a silver thick film layer which is a second external electrode layer, by providing thereafter a catalytic metal on the silver thick film lay...

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Hauptverfasser: FUJIWARA HIROTO, NUMATA SOTOSHI, MAKINO SATOAKI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
RESISTORS
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creator FUJIWARA HIROTO
NUMATA SOTOSHI
MAKINO SATOAKI
description PURPOSE:To prevent development of corrosion of silver solder and migration by forming an electroless plated layer which is a first external electrode layer and a silver thick film layer which is a second external electrode layer, by providing thereafter a catalytic metal on the silver thick film layer and by forming an electroless plated layer which is a third external electrode layer through electroless plating. CONSTITUTION:After the first external electrode layer of an electroless plated layer and a second external electrode layer of a silver thick film layer are formed, a semiconductor ceramic element body 2 is immersed in water solution of palladium chloride-chlorine. Then, the palladium absorbed to an exposed surface of the semiconductor ceramic element body 2 is cleaned and removed by cleaning solution to provide the palladium 10 only on silver thick film layers 7, 8. Electroless plating is applied using the palladium 10 on the silver thick film layers 7, 8 as a catalyzer to form electroless plated layers 11, 12 of a third external electrode layer which consists of nickel on silver thick film layers 5, 6. Thereby, corrosion of silver solder and migration become hard to develop.
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CONSTITUTION:After the first external electrode layer of an electroless plated layer and a second external electrode layer of a silver thick film layer are formed, a semiconductor ceramic element body 2 is immersed in water solution of palladium chloride-chlorine. Then, the palladium absorbed to an exposed surface of the semiconductor ceramic element body 2 is cleaned and removed by cleaning solution to provide the palladium 10 only on silver thick film layers 7, 8. Electroless plating is applied using the palladium 10 on the silver thick film layers 7, 8 as a catalyzer to form electroless plated layers 11, 12 of a third external electrode layer which consists of nickel on silver thick film layers 5, 6. 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CONSTITUTION:After the first external electrode layer of an electroless plated layer and a second external electrode layer of a silver thick film layer are formed, a semiconductor ceramic element body 2 is immersed in water solution of palladium chloride-chlorine. Then, the palladium absorbed to an exposed surface of the semiconductor ceramic element body 2 is cleaned and removed by cleaning solution to provide the palladium 10 only on silver thick film layers 7, 8. Electroless plating is applied using the palladium 10 on the silver thick film layers 7, 8 as a catalyzer to form electroless plated layers 11, 12 of a third external electrode layer which consists of nickel on silver thick film layers 5, 6. 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CONSTITUTION:After the first external electrode layer of an electroless plated layer and a second external electrode layer of a silver thick film layer are formed, a semiconductor ceramic element body 2 is immersed in water solution of palladium chloride-chlorine. Then, the palladium absorbed to an exposed surface of the semiconductor ceramic element body 2 is cleaned and removed by cleaning solution to provide the palladium 10 only on silver thick film layers 7, 8. Electroless plating is applied using the palladium 10 on the silver thick film layers 7, 8 as a catalyzer to form electroless plated layers 11, 12 of a third external electrode layer which consists of nickel on silver thick film layers 5, 6. Thereby, corrosion of silver solder and migration become hard to develop.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
RESISTORS
title MANUFACTURE OF SEMICONDUCTOR CERAMIC ELECTRONIC PART
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