POSITIONING MECHANISM FOR BLOCK IN SURFACE POLISHING DEVICE
PURPOSE:To separate a block from a center roller simply and to execute polishing with good accuracy of the work held on the block without damaging or deforming the center roller and a guide roller by the block by providing a recessed part on the center roller. CONSTITUTION:A block 5 is fed one by on...
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| creator | FURUSAWA SHIRO |
| description | PURPOSE:To separate a block from a center roller simply and to execute polishing with good accuracy of the work held on the block without damaging or deforming the center roller and a guide roller by the block by providing a recessed part on the center roller. CONSTITUTION:A block 5 is fed one by one onto a surface plate 2 by holding a center roller 7 at the positioning position, this block is moved by rotating the surface plate, guide rollers 21a-21d are turned to a support position selectively as well, the block is supported in order by the abutting part of the guide roller and center roller and the positioning of each block is executed. After completion of this positioning, the center roller is turned to a work position and the recessed part 11b of the center roller is opposed to the block. The center roller and block are mutually separated by this recessed part and the block is released from the friction state with the center roller. The work held on the block is then subjected to polishing by the difference in the peripheral speeds of the inner and outer peripheries of the surface plate 2. |
| format | Patent |
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CONSTITUTION:A block 5 is fed one by one onto a surface plate 2 by holding a center roller 7 at the positioning position, this block is moved by rotating the surface plate, guide rollers 21a-21d are turned to a support position selectively as well, the block is supported in order by the abutting part of the guide roller and center roller and the positioning of each block is executed. After completion of this positioning, the center roller is turned to a work position and the recessed part 11b of the center roller is opposed to the block. The center roller and block are mutually separated by this recessed part and the block is released from the friction state with the center roller. The work held on the block is then subjected to polishing by the difference in the peripheral speeds of the inner and outer peripheries of the surface plate 2.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900823&DB=EPODOC&CC=JP&NR=H02212072A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900823&DB=EPODOC&CC=JP&NR=H02212072A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FURUSAWA SHIRO</creatorcontrib><title>POSITIONING MECHANISM FOR BLOCK IN SURFACE POLISHING DEVICE</title><description>PURPOSE:To separate a block from a center roller simply and to execute polishing with good accuracy of the work held on the block without damaging or deforming the center roller and a guide roller by the block by providing a recessed part on the center roller. CONSTITUTION:A block 5 is fed one by one onto a surface plate 2 by holding a center roller 7 at the positioning position, this block is moved by rotating the surface plate, guide rollers 21a-21d are turned to a support position selectively as well, the block is supported in order by the abutting part of the guide roller and center roller and the positioning of each block is executed. After completion of this positioning, the center roller is turned to a work position and the recessed part 11b of the center roller is opposed to the block. The center roller and block are mutually separated by this recessed part and the block is released from the friction state with the center roller. The work held on the block is then subjected to polishing by the difference in the peripheral speeds of the inner and outer peripheries of the surface plate 2.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAO8A_2DPH09_P0c1fwdXX2cPTzDPZVcPMPUnDy8Xf2VvD0UwgODXJzdHZVCPD38Qz2ACl0cQ3zdHblYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBkZGhkYG5kaOxsSoAQDgSilb</recordid><startdate>19900823</startdate><enddate>19900823</enddate><creator>FURUSAWA SHIRO</creator><scope>EVB</scope></search><sort><creationdate>19900823</creationdate><title>POSITIONING MECHANISM FOR BLOCK IN SURFACE POLISHING DEVICE</title><author>FURUSAWA SHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH02212072A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FURUSAWA SHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FURUSAWA SHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POSITIONING MECHANISM FOR BLOCK IN SURFACE POLISHING DEVICE</title><date>1990-08-23</date><risdate>1990</risdate><abstract>PURPOSE:To separate a block from a center roller simply and to execute polishing with good accuracy of the work held on the block without damaging or deforming the center roller and a guide roller by the block by providing a recessed part on the center roller. CONSTITUTION:A block 5 is fed one by one onto a surface plate 2 by holding a center roller 7 at the positioning position, this block is moved by rotating the surface plate, guide rollers 21a-21d are turned to a support position selectively as well, the block is supported in order by the abutting part of the guide roller and center roller and the positioning of each block is executed. After completion of this positioning, the center roller is turned to a work position and the recessed part 11b of the center roller is opposed to the block. The center roller and block are mutually separated by this recessed part and the block is released from the friction state with the center roller. The work held on the block is then subjected to polishing by the difference in the peripheral speeds of the inner and outer peripheries of the surface plate 2.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH02212072A |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POSITIONING MECHANISM FOR BLOCK IN SURFACE POLISHING DEVICE |
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