METHOD FOR MOLDING THERMOPLASTIC SYNTHETIC RESIN BY HIGH FREQUENCY INDUCTION HEATING

PURPOSE:To effectively melt a material in a mixed state without fluidizing said material to mold the same by holding a synthetic resin material between upper and lower electrodes under pressure and applying a high frequency current to the synthetic resin material under this pressure condition to mel...

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1. Verfasser: KURAKI ITSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To effectively melt a material in a mixed state without fluidizing said material to mold the same by holding a synthetic resin material between upper and lower electrodes under pressure and applying a high frequency current to the synthetic resin material under this pressure condition to melt the whole of said resin and integrally molding the molten resin. CONSTITUTION:Heating means 3, 4 such as heaters or panel heaters are respectively provided to the upper and lower electrodes 1, 2 of a high frequency induction heating apparatus so as to be capable of heating at least the opposed surfaces of the electrodes to high temp. A retaining mold 5 is placed on the lower electrode 2 and a synthetic resin material A can be held in said mold. This retaining mold 5 holds a synthetic resin material A having a granular form or other form in a non-melted state so as not to scatter the same and prevents the outflow of said resin material to the outside in a molten state and may have a structure generating no discharge.