ETCHING DEVICE
PURPOSE:To accurately and uniformly etch bodies to be treated by fitting plural power supply points on a carrier holding the bodies and by impressing branched electric power from an external power source to generate plasma between the carrier and counter electrodes. CONSTITUTION:A carrier 1 holding...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NAGAIKE SADAKUNI SAWASE FUMIHIKO OTA SAKAE HASHIWAKI HIRONAO HONDA YOSHINORI |
| description | PURPOSE:To accurately and uniformly etch bodies to be treated by fitting plural power supply points on a carrier holding the bodies and by impressing branched electric power from an external power source to generate plasma between the carrier and counter electrodes. CONSTITUTION:A carrier 1 holding plural substrates 4 and counter electrodes 2 are arranged in a vacuum vessel, power supply points 5 are fitted on both sides of the carrier 1 at cater-cornered positions and the branched impressing parts 3 of an RF power source are separately connected to the points 5. The electrodes 2 are earthed and electric power is impressed on the carrier 1 from the RF power source through the points 5 to generate plasma between the carrier 1 and the electrodes 2. The surfaces of the substrates having large area are uniformly and accurately etched with the plasma. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH01298182A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH01298182A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH01298182A3</originalsourceid><addsrcrecordid>eNrjZOBzDXH28PRzV3BxDfN0duVhYE1LzClO5YXS3AyKbiAVuqkF-fGpxQWJyal5qSXxXgEeBoZGlhaGFkaOxsSoAQDBLh0H</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ETCHING DEVICE</title><source>esp@cenet</source><creator>NAGAIKE SADAKUNI ; SAWASE FUMIHIKO ; OTA SAKAE ; HASHIWAKI HIRONAO ; HONDA YOSHINORI</creator><creatorcontrib>NAGAIKE SADAKUNI ; SAWASE FUMIHIKO ; OTA SAKAE ; HASHIWAKI HIRONAO ; HONDA YOSHINORI</creatorcontrib><description>PURPOSE:To accurately and uniformly etch bodies to be treated by fitting plural power supply points on a carrier holding the bodies and by impressing branched electric power from an external power source to generate plasma between the carrier and counter electrodes. CONSTITUTION:A carrier 1 holding plural substrates 4 and counter electrodes 2 are arranged in a vacuum vessel, power supply points 5 are fitted on both sides of the carrier 1 at cater-cornered positions and the branched impressing parts 3 of an RF power source are separately connected to the points 5. The electrodes 2 are earthed and electric power is impressed on the carrier 1 from the RF power source through the points 5 to generate plasma between the carrier 1 and the electrodes 2. The surfaces of the substrates having large area are uniformly and accurately etched with the plasma.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891201&DB=EPODOC&CC=JP&NR=H01298182A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891201&DB=EPODOC&CC=JP&NR=H01298182A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAIKE SADAKUNI</creatorcontrib><creatorcontrib>SAWASE FUMIHIKO</creatorcontrib><creatorcontrib>OTA SAKAE</creatorcontrib><creatorcontrib>HASHIWAKI HIRONAO</creatorcontrib><creatorcontrib>HONDA YOSHINORI</creatorcontrib><title>ETCHING DEVICE</title><description>PURPOSE:To accurately and uniformly etch bodies to be treated by fitting plural power supply points on a carrier holding the bodies and by impressing branched electric power from an external power source to generate plasma between the carrier and counter electrodes. CONSTITUTION:A carrier 1 holding plural substrates 4 and counter electrodes 2 are arranged in a vacuum vessel, power supply points 5 are fitted on both sides of the carrier 1 at cater-cornered positions and the branched impressing parts 3 of an RF power source are separately connected to the points 5. The electrodes 2 are earthed and electric power is impressed on the carrier 1 from the RF power source through the points 5 to generate plasma between the carrier 1 and the electrodes 2. The surfaces of the substrates having large area are uniformly and accurately etched with the plasma.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBzDXH28PRzV3BxDfN0duVhYE1LzClO5YXS3AyKbiAVuqkF-fGpxQWJyal5qSXxXgEeBoZGlhaGFkaOxsSoAQDBLh0H</recordid><startdate>19891201</startdate><enddate>19891201</enddate><creator>NAGAIKE SADAKUNI</creator><creator>SAWASE FUMIHIKO</creator><creator>OTA SAKAE</creator><creator>HASHIWAKI HIRONAO</creator><creator>HONDA YOSHINORI</creator><scope>EVB</scope></search><sort><creationdate>19891201</creationdate><title>ETCHING DEVICE</title><author>NAGAIKE SADAKUNI ; SAWASE FUMIHIKO ; OTA SAKAE ; HASHIWAKI HIRONAO ; HONDA YOSHINORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH01298182A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAIKE SADAKUNI</creatorcontrib><creatorcontrib>SAWASE FUMIHIKO</creatorcontrib><creatorcontrib>OTA SAKAE</creatorcontrib><creatorcontrib>HASHIWAKI HIRONAO</creatorcontrib><creatorcontrib>HONDA YOSHINORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAIKE SADAKUNI</au><au>SAWASE FUMIHIKO</au><au>OTA SAKAE</au><au>HASHIWAKI HIRONAO</au><au>HONDA YOSHINORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ETCHING DEVICE</title><date>1989-12-01</date><risdate>1989</risdate><abstract>PURPOSE:To accurately and uniformly etch bodies to be treated by fitting plural power supply points on a carrier holding the bodies and by impressing branched electric power from an external power source to generate plasma between the carrier and counter electrodes. CONSTITUTION:A carrier 1 holding plural substrates 4 and counter electrodes 2 are arranged in a vacuum vessel, power supply points 5 are fitted on both sides of the carrier 1 at cater-cornered positions and the branched impressing parts 3 of an RF power source are separately connected to the points 5. The electrodes 2 are earthed and electric power is impressed on the carrier 1 from the RF power source through the points 5 to generate plasma between the carrier 1 and the electrodes 2. The surfaces of the substrates having large area are uniformly and accurately etched with the plasma.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH01298182A |
| source | esp@cenet |
| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE |
| title | ETCHING DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T08%3A34%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAGAIKE%20SADAKUNI&rft.date=1989-12-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH01298182A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |