COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR DEVICE

PURPOSE:To manufacture the title copper alloy having excellent mechanical characteristics, heat resistance, corrosion resistance, etc., by adding each specific amt. of Zn and specific elements such as Mg and B to Cu. CONSTITUTION:A Cu-Zn alloy contg., by weight, 2.0-7.0% Zn and total 0.01-1.0% of on...

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Hauptverfasser:	TSUJI MASAHIRO, TOE TAMIO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS METALLURGY TREATMENT OF ALLOYS OR NON-FERROUS METALS
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creator	TSUJI MASAHIRO TOE TAMIO
description	PURPOSE:To manufacture the title copper alloy having excellent mechanical characteristics, heat resistance, corrosion resistance, etc., by adding each specific amt. of Zn and specific elements such as Mg and B to Cu. CONSTITUTION:A Cu-Zn alloy contg., by weight, 2.0-7.0% Zn and total 0.01-1.0% of one or more kinds selected from the group of P, B, Al, Fe, Cr, Co, Ni, Mn, Si, Mg, Be, Ti, Zr, In, Te, Y and rare earth elements and the balance consisting of Cu with inevitable impurities is prepd. By this method, the alloy having excellent electric and heat conductivity, heat resistance, workability, plating adhesion, solderability, corrosion resistance, etc., as a copper alloy for a lead material of a semiconductor device can be obtd. at low cost.
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CONSTITUTION:A Cu-Zn alloy contg., by weight, 2.0-7.0% Zn and total 0.01-1.0% of one or more kinds selected from the group of P, B, Al, Fe, Cr, Co, Ni, Mn, Si, Mg, Be, Ti, Zr, In, Te, Y and rare earth elements and the balance consisting of Cu with inevitable impurities is prepd. By this method, the alloy having excellent electric and heat conductivity, heat resistance, workability, plating adhesion, solderability, corrosion resistance, etc., as a copper alloy for a lead material of a semiconductor device can be obtd. at low cost.</description><language>eng</language><subject>ALLOYS ; CHEMISTRY ; FERROUS OR NON-FERROUS ALLOYS ; METALLURGY ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891026&DB=EPODOC&CC=JP&NR=H01268833A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891026&DB=EPODOC&CC=JP&NR=H01268833A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUJI MASAHIRO</creatorcontrib><creatorcontrib>TOE TAMIO</creatorcontrib><title>COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR DEVICE</title><description>PURPOSE:To manufacture the title copper alloy having excellent mechanical characteristics, heat resistance, corrosion resistance, etc., by adding each specific amt. of Zn and specific elements such as Mg and B to Cu. 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CONSTITUTION:A Cu-Zn alloy contg., by weight, 2.0-7.0% Zn and total 0.01-1.0% of one or more kinds selected from the group of P, B, Al, Fe, Cr, Co, Ni, Mn, Si, Mg, Be, Ti, Zr, In, Te, Y and rare earth elements and the balance consisting of Cu with inevitable impurities is prepd. By this method, the alloy having excellent electric and heat conductivity, heat resistance, workability, plating adhesion, solderability, corrosion resistance, etc., as a copper alloy for a lead material of a semiconductor device can be obtd. at low cost.</abstract><oa>free_for_read</oa></addata></record>
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subjects	ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS METALLURGY TREATMENT OF ALLOYS OR NON-FERROUS METALS
title	COPPER ALLOY FOR LEAD MATERIAL OF SEMICONDUCTOR DEVICE
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