HOLDING SEMICONDUCTOR WAFER

PURPOSE:To enable adhering, fixing, and removing a wafer in a short time and by a simple method without deteriorating a holding jig, by fixing the water to a transparent plate with a film with viscous bond applied on both surfaces thereof interposed therebetween and removing said wafer by hardening...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKAHASHI AKITETSU, NAKAGAWA TETSUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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