APPARATUS FOR MANUFACTURING PRINTED BOARD
PURPOSE:To manufacture a printed board during conveying without separating the printed board from a conveying device one by one, by suspending the printed board, and vibrating the printed board in the suspended state in a treating liquid cell. CONSTITUTION:When a treating liquid cell 1 is vibrated w...
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| creator | NIINAMI MASAYUKI ENDOU TOMOMICHI ONISHI TOSHIYUKI |
| description | PURPOSE:To manufacture a printed board during conveying without separating the printed board from a conveying device one by one, by suspending the printed board, and vibrating the printed board in the suspended state in a treating liquid cell. CONSTITUTION:When a treating liquid cell 1 is vibrated with a vibration generator 9, the inner surface of the treating liquid cell 1 comes into contact with a printed board 2 suspended from a freely moving suspending piece 4. Therefore, the printed board 2 is vibrated in the treating liquid cell 1. Thus, a plated film is positively formed in each small hole 3 of the printed board 2 under the suspended state from the suspending piece 4. When a container 11 is vibrated with a vibration generator 13, the container 11 comes into contact with the printed board 2 suspended from the freely moving suspending piece 4, and the printed board 2 is vibrated in the treating liquid cell 1. Therefore, the plated film is positively formed in each small hole 3 in the printed board under the suspended state from the suspending piece 4. |
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CONSTITUTION:When a treating liquid cell 1 is vibrated with a vibration generator 9, the inner surface of the treating liquid cell 1 comes into contact with a printed board 2 suspended from a freely moving suspending piece 4. Therefore, the printed board 2 is vibrated in the treating liquid cell 1. Thus, a plated film is positively formed in each small hole 3 of the printed board 2 under the suspended state from the suspending piece 4. When a container 11 is vibrated with a vibration generator 13, the container 11 comes into contact with the printed board 2 suspended from the freely moving suspending piece 4, and the printed board 2 is vibrated in the treating liquid cell 1. Therefore, the plated film is positively formed in each small hole 3 in the printed board under the suspended state from the suspending piece 4.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLEANING ; CLEANING IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891018&DB=EPODOC&CC=JP&NR=H01260887A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19891018&DB=EPODOC&CC=JP&NR=H01260887A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NIINAMI MASAYUKI</creatorcontrib><creatorcontrib>ENDOU TOMOMICHI</creatorcontrib><creatorcontrib>ONISHI TOSHIYUKI</creatorcontrib><title>APPARATUS FOR MANUFACTURING PRINTED BOARD</title><description>PURPOSE:To manufacture a printed board during conveying without separating the printed board from a conveying device one by one, by suspending the printed board, and vibrating the printed board in the suspended state in a treating liquid cell. CONSTITUTION:When a treating liquid cell 1 is vibrated with a vibration generator 9, the inner surface of the treating liquid cell 1 comes into contact with a printed board 2 suspended from a freely moving suspending piece 4. Therefore, the printed board 2 is vibrated in the treating liquid cell 1. Thus, a plated film is positively formed in each small hole 3 of the printed board 2 under the suspended state from the suspending piece 4. When a container 11 is vibrated with a vibration generator 13, the container 11 comes into contact with the printed board 2 suspended from the freely moving suspending piece 4, and the printed board 2 is vibrated in the treating liquid cell 1. Therefore, the plated film is positively formed in each small hole 3 in the printed board under the suspended state from the suspending piece 4.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0DAhwDHIMCQ1WcPMPUvB19At1c3QOCQ3y9HNXCACSIa4uCk7-jkEuPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3ivAw8DQyMzAwsLc0ZgYNQBCsCS8</recordid><startdate>19891018</startdate><enddate>19891018</enddate><creator>NIINAMI MASAYUKI</creator><creator>ENDOU TOMOMICHI</creator><creator>ONISHI TOSHIYUKI</creator><scope>EVB</scope></search><sort><creationdate>19891018</creationdate><title>APPARATUS FOR MANUFACTURING PRINTED BOARD</title><author>NIINAMI MASAYUKI ; ENDOU TOMOMICHI ; ONISHI TOSHIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH01260887A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NIINAMI MASAYUKI</creatorcontrib><creatorcontrib>ENDOU TOMOMICHI</creatorcontrib><creatorcontrib>ONISHI TOSHIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NIINAMI MASAYUKI</au><au>ENDOU TOMOMICHI</au><au>ONISHI TOSHIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR MANUFACTURING PRINTED BOARD</title><date>1989-10-18</date><risdate>1989</risdate><abstract>PURPOSE:To manufacture a printed board during conveying without separating the printed board from a conveying device one by one, by suspending the printed board, and vibrating the printed board in the suspended state in a treating liquid cell. CONSTITUTION:When a treating liquid cell 1 is vibrated with a vibration generator 9, the inner surface of the treating liquid cell 1 comes into contact with a printed board 2 suspended from a freely moving suspending piece 4. Therefore, the printed board 2 is vibrated in the treating liquid cell 1. Thus, a plated film is positively formed in each small hole 3 of the printed board 2 under the suspended state from the suspending piece 4. When a container 11 is vibrated with a vibration generator 13, the container 11 comes into contact with the printed board 2 suspended from the freely moving suspending piece 4, and the printed board 2 is vibrated in the treating liquid cell 1. Therefore, the plated film is positively formed in each small hole 3 in the printed board under the suspended state from the suspending piece 4.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING CLEANING IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | APPARATUS FOR MANUFACTURING PRINTED BOARD |
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