WIRE BONDING EQUIPMENT

PURPOSE:To prevent the decrease of bondability due to attaching and depositing of scattered fine particles of a discharge electrode, by forming the discharge electrode to fuse-form a ball at the tip of a wire, by using a specified alloy. CONSTITUTION:A discharge electrode 16 to fuse-form a ball at t...

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Bibliographische Detailangaben
Hauptverfasser:	OHASHI YOSHIO, NAKAJIMA MAKOTO, KOIZUMI MASAHIRO, ICHIKAWA KIMINORI, CHUMA TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the decrease of bondability due to attaching and depositing of scattered fine particles of a discharge electrode, by forming the discharge electrode to fuse-form a ball at the tip of a wire, by using a specified alloy. CONSTITUTION:A discharge electrode 16 to fuse-form a ball at the tip of a wire is formed by using tungsten containing yttrium or tungsten containing lanthanum. Since a copper coating film is hardly formed on the surface of the discharge electrode 16 formed by using the above alloy, the decrease of arc-start is restricted or restrained, and therefore a suitable discharging state is maintained between the discharge electrode 16 and a wire 2. As a result, a specified discharging energy is maintained, so that an adequate ball 22 is formed and excellent bondability is obtained.