MANUFACTURE OF HYBRID IC

PURPOSE:To extremely simply perform multilayer interconnections by integrally coupling upper and lower boards having an interconnection pattern through a meshlike shielding member, selecting the intersections of the mesh of the member or space face of the mesh in accordance with the object of electr...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HORII KATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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