MANUFACTURE OF HYBRID IC

PURPOSE:To extremely simply perform multilayer interconnections by integrally coupling upper and lower boards having an interconnection pattern through a meshlike shielding member, selecting the intersections of the mesh of the member or space face of the mesh in accordance with the object of electric interconnections of the upper and lower interconnection patterns, and forming through holes at upper and lower boards. CONSTITUTION:Upper and lower boards 1, 2 are integrally, clamped by a meshlike shielding member 3 made of longitudinal and lateral interconnections 31, 32. In a step of electrically conducting upper and lower interconnection patterns 11, 21, through holes 41 are opened at the boards 1, 2 (including the patterns 11, 21) corresponding to the space face 34 of the mesh of the member 3 (the face surrounded by the interconnections 31, 32),i.e., to the space 34 of the mesh. A plating layer 42 is formed in the holes 41 as designated by a sectional view taken along the line I-I, and through holes 4 (for electrically connecting) are formed. Thus, the patterns 11, 21 are electrically connected.