OPTICAL SEMICONDUCTOR DEVICE
PURPOSE:To prevent welding spatters at the welding of a can so as to obtain an element excellent in reliability by a method wherein a ring-like groove where a flange of the can is fitted is formed at the position on a primary face of a package where the can is welded. CONSTITUTION:A can 10 is welded...
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| creator | SOGO TOSHIO ISHII MITSUO |
| description | PURPOSE:To prevent welding spatters at the welding of a can so as to obtain an element excellent in reliability by a method wherein a ring-like groove where a flange of the can is fitted is formed at the position on a primary face of a package where the can is welded. CONSTITUTION:A can 10 is welded to a primary face of a package 8 through the intermediary of a flange 14 of the can 10 covering a laser diode chip 1. Here, as a groove 9, whose width is a little larger than that of the flange 14 of the can 10, is provided to the primary face of the package 8 surrounding the center of the package 8 in a ring, welding spatters occurring at the welding of the can 10 can be absorbed by the groove 9. By these processes, welding spatters can be prevented at the welding of a can, so that an optical semiconductor device excellent in reliability can be obtained. |
| format | Patent |
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CONSTITUTION:A can 10 is welded to a primary face of a package 8 through the intermediary of a flange 14 of the can 10 covering a laser diode chip 1. Here, as a groove 9, whose width is a little larger than that of the flange 14 of the can 10, is provided to the primary face of the package 8 surrounding the center of the package 8 in a ring, welding spatters occurring at the welding of the can 10 can be absorbed by the groove 9. By these processes, welding spatters can be prevented at the welding of a can, so that an optical semiconductor device excellent in reliability can be obtained.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890921&DB=EPODOC&CC=JP&NR=H01236675A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890921&DB=EPODOC&CC=JP&NR=H01236675A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SOGO TOSHIO</creatorcontrib><creatorcontrib>ISHII MITSUO</creatorcontrib><title>OPTICAL SEMICONDUCTOR DEVICE</title><description>PURPOSE:To prevent welding spatters at the welding of a can so as to obtain an element excellent in reliability by a method wherein a ring-like groove where a flange of the can is fitted is formed at the position on a primary face of a package where the can is welded. CONSTITUTION:A can 10 is welded to a primary face of a package 8 through the intermediary of a flange 14 of the can 10 covering a laser diode chip 1. Here, as a groove 9, whose width is a little larger than that of the flange 14 of the can 10, is provided to the primary face of the package 8 surrounding the center of the package 8 in a ring, welding spatters occurring at the welding of the can 10 can be absorbed by the groove 9. By these processes, welding spatters can be prevented at the welding of a can, so that an optical semiconductor device excellent in reliability can be obtained.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDxDwjxdHb0UQh29fV09vdzCXUO8Q9ScHEN83R25WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaGRsZmZuamjsbEqAEAgZchHA</recordid><startdate>19890921</startdate><enddate>19890921</enddate><creator>SOGO TOSHIO</creator><creator>ISHII MITSUO</creator><scope>EVB</scope></search><sort><creationdate>19890921</creationdate><title>OPTICAL SEMICONDUCTOR DEVICE</title><author>SOGO TOSHIO ; ISHII MITSUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH01236675A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SOGO TOSHIO</creatorcontrib><creatorcontrib>ISHII MITSUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SOGO TOSHIO</au><au>ISHII MITSUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL SEMICONDUCTOR DEVICE</title><date>1989-09-21</date><risdate>1989</risdate><abstract>PURPOSE:To prevent welding spatters at the welding of a can so as to obtain an element excellent in reliability by a method wherein a ring-like groove where a flange of the can is fitted is formed at the position on a primary face of a package where the can is welded. CONSTITUTION:A can 10 is welded to a primary face of a package 8 through the intermediary of a flange 14 of the can 10 covering a laser diode chip 1. Here, as a groove 9, whose width is a little larger than that of the flange 14 of the can 10, is provided to the primary face of the package 8 surrounding the center of the package 8 in a ring, welding spatters occurring at the welding of the can 10 can be absorbed by the groove 9. By these processes, welding spatters can be prevented at the welding of a can, so that an optical semiconductor device excellent in reliability can be obtained.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | OPTICAL SEMICONDUCTOR DEVICE |
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