JP2947409B

PROBLEM TO BE SOLVED: To shorten the conveying path of a body to be processed, to make the configuration compact and to make it possible to perform mounting in a short time by arranging the first processing part and the second processing part around a conveying path extending into the vertical direction, and inputting and outputting the body to be processed for the respective processing mechanisms of the first and second processing parts by a mounting mechanism. SOLUTION: A resist applying mechanism, a prebaking mechanism, which processes the heating and evaporation of solvent remaining in the applied photoresist, a developing mechanism 10, which develops the resist of the exposed wafer, and a post-bake mechanism 11 for reinforcing the adhesion of the wafer and the photoresist are provided on the approximately same plane. Furthermore, the planes of the respective processing mechanisms 10, 11 and the like are overlapped in multiple stages and constituted. Two sets of wafer mounting mechanisms 12, which input and output the wafer between the respective processing mechanisms 10, 11 and the like and an alignment stage part, are provided in the up and down directions.