JP2834821B
PURPOSE:To form the title electronic part mounting substrate having excellent radiating capacity as well as water resistance by a method wherein metallic radiating layers are provided between lands and then these metallic radiating layers are connected to a radiating plate while electric insulating...
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| creator | TAKADA MASATOME HAYASHI TERUO |
| description | PURPOSE:To form the title electronic part mounting substrate having excellent radiating capacity as well as water resistance by a method wherein metallic radiating layers are provided between lands and then these metallic radiating layers are connected to a radiating plate while electric insulating gaps are made between the radiating layers and the lands. CONSTITUTION:A part mounting substrate 10 is composed of an electronic part mounting part provided on one side of an insulating base material 91, a radiating plate 8 provided on the opposite side to said mounting part, multiwired through holes 95 and the lands 93 provided in the openings of the holes 95. Besides, diamond type metallic radiating layers 1 are provided between respective lands 93 while connecting an inner square part 11 of the radiating layers 1 to the radiating plate 8. Both of these elements are connected by a metallic plating 35 applied on the radiating plate 8 including the surface thereof. Furthermore, a linear heat transfer layer 12 is provided between the lands 93 between the radiating layers 1. Accordingly, the radiation capacity can be augmented. Furthermore, the surface of the base metal 91 being coated with the metallic radiating layers 1, the permeation of moisture into the base material 91 can be avoided thereby giving the excellent water resistance to the base material 91. |
| format | Patent |
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CONSTITUTION:A part mounting substrate 10 is composed of an electronic part mounting part provided on one side of an insulating base material 91, a radiating plate 8 provided on the opposite side to said mounting part, multiwired through holes 95 and the lands 93 provided in the openings of the holes 95. Besides, diamond type metallic radiating layers 1 are provided between respective lands 93 while connecting an inner square part 11 of the radiating layers 1 to the radiating plate 8. Both of these elements are connected by a metallic plating 35 applied on the radiating plate 8 including the surface thereof. Furthermore, a linear heat transfer layer 12 is provided between the lands 93 between the radiating layers 1. Accordingly, the radiation capacity can be augmented. Furthermore, the surface of the base metal 91 being coated with the metallic radiating layers 1, the permeation of moisture into the base material 91 can be avoided thereby giving the excellent water resistance to the base material 91.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19981214&DB=EPODOC&CC=JP&NR=2834821B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19981214&DB=EPODOC&CC=JP&NR=2834821B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKADA MASATOME</creatorcontrib><creatorcontrib>HAYASHI TERUO</creatorcontrib><title>JP2834821B</title><description>PURPOSE:To form the title electronic part mounting substrate having excellent radiating capacity as well as water resistance by a method wherein metallic radiating layers are provided between lands and then these metallic radiating layers are connected to a radiating plate while electric insulating gaps are made between the radiating layers and the lands. CONSTITUTION:A part mounting substrate 10 is composed of an electronic part mounting part provided on one side of an insulating base material 91, a radiating plate 8 provided on the opposite side to said mounting part, multiwired through holes 95 and the lands 93 provided in the openings of the holes 95. Besides, diamond type metallic radiating layers 1 are provided between respective lands 93 while connecting an inner square part 11 of the radiating layers 1 to the radiating plate 8. Both of these elements are connected by a metallic plating 35 applied on the radiating plate 8 including the surface thereof. Furthermore, a linear heat transfer layer 12 is provided between the lands 93 between the radiating layers 1. Accordingly, the radiation capacity can be augmented. Furthermore, the surface of the base metal 91 being coated with the metallic radiating layers 1, the permeation of moisture into the base material 91 can be avoided thereby giving the excellent water resistance to the base material 91.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODyCjCyMDaxMDJ04mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8QgNTkbGxKgBACZPG20</recordid><startdate>19981214</startdate><enddate>19981214</enddate><creator>TAKADA MASATOME</creator><creator>HAYASHI TERUO</creator><scope>EVB</scope></search><sort><creationdate>19981214</creationdate><title>JP2834821B</title><author>TAKADA MASATOME ; HAYASHI TERUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2834821BB23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKADA MASATOME</creatorcontrib><creatorcontrib>HAYASHI TERUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKADA MASATOME</au><au>HAYASHI TERUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JP2834821B</title><date>1998-12-14</date><risdate>1998</risdate><abstract>PURPOSE:To form the title electronic part mounting substrate having excellent radiating capacity as well as water resistance by a method wherein metallic radiating layers are provided between lands and then these metallic radiating layers are connected to a radiating plate while electric insulating gaps are made between the radiating layers and the lands. CONSTITUTION:A part mounting substrate 10 is composed of an electronic part mounting part provided on one side of an insulating base material 91, a radiating plate 8 provided on the opposite side to said mounting part, multiwired through holes 95 and the lands 93 provided in the openings of the holes 95. Besides, diamond type metallic radiating layers 1 are provided between respective lands 93 while connecting an inner square part 11 of the radiating layers 1 to the radiating plate 8. Both of these elements are connected by a metallic plating 35 applied on the radiating plate 8 including the surface thereof. Furthermore, a linear heat transfer layer 12 is provided between the lands 93 between the radiating layers 1. Accordingly, the radiation capacity can be augmented. Furthermore, the surface of the base metal 91 being coated with the metallic radiating layers 1, the permeation of moisture into the base material 91 can be avoided thereby giving the excellent water resistance to the base material 91.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | JP2834821B |
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