JP2548602B

A semiconductor chip module has semiconductor chips (12) each having contacts on its entire front face, and a multi-layered organic circuit board (15) having a small dielectric constant intermediate ceramic substrates (11) having the same thermal expansion coefficient as that of the semiconductor ch...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SOGA TASAO, TAKAHASHI KEN, OGIWARA SATORU, MYAZAKI KUNIO, NUMATA SHUNICHI, YOKOYAMA TAKASHI, YAMADA KAZUJI, SUZUKI HIDEO, SHINOHARA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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