PROTECTION FILM AND ATTACHMENT METHOD OF THE SAME AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT

To provide an attachment method of a protection film which can inhibit occurrence of failure caused by a step on a major surface of a semiconductor wafer, and to provide a manufacturing method of the semiconductor component.SOLUTION: An attachment method includes: an arrangement step S1 in which a protection film 20 is disposed so as to cover a major surface 10A of a semiconductor wafer 10; and an attachment step S2 in which the protection film 20 is pressed against the major surface 10A to be attached thereto. The major surface 10A has: a first area 12 in which bumps 11 are disposed; and a second area 13 which includes at least a part of a peripheral edge of the major surface 10A and in which the bumps 11 are not disposed. The attachment step S2 includes a compression step S3 in which the protection film 20 is compressed in a thickness direction. The compression step S3 is performed using a pressing member 32 for pressing the protection film 20 against the major surface 10A and a support member 33 installed along an outer peripheral edge of the second area 13.SELECTED DRAWING: Figure 6 【課題】半導体ウエハの主面の段差に起因する不具合の発生を抑制することができる保護フィルムの貼着方法、及び、半導体部品の製造方法を提供する。【解決手段】本貼着方法は、半導体ウエハ１０の主面１０Ａを覆うように保護フィルム２０を配する配置工程Ｓ１と、保護フィルム２０を主面１０Ａに押し付けて貼着する貼着工程Ｓ２と、を備え、主面１０Ａは、バンプ１１が配された第１領域１２と、主面１０Ａの周縁の少なくとも一部を含む領域であるとともに、バンプ１１が配されていない領域である第２領域１３と、を有し、貼着工程Ｓ２は、保護フィルム２０をその厚さ方向へ圧縮する圧縮工程Ｓ３を含み、圧縮工程Ｓ３は、保護フィルム２０を主面１０Ａへ押し付けるための押圧部材３２と、第２領域１３の外周縁に沿って設置される支持部材３３とを使用して行われる。【選択図】図６