HEAT CONDUCTIVE SILICONE COMPOSITION

To provide a heat conductive silicone composition having excellent displacement resistance without requiring special storage conditions.SOLUTION: There is provided a heat conductive silicone composition which comprises a component (A): 100 pts.mass of an organopolysiloxane represented by the general...

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1. Verfasser:	TSUJI KENICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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creator	TSUJI KENICHI
description	To provide a heat conductive silicone composition having excellent displacement resistance without requiring special storage conditions.SOLUTION: There is provided a heat conductive silicone composition which comprises a component (A): 100 pts.mass of an organopolysiloxane represented by the general formula (1), a component (B): 2 to 100 pts.mass of a diorganopolysiloxane having a hydroxyl group and/or a hydrolyzable silyl group bonded to a silicon atom at both ends of the molecular chain and having a kinematic viscosity of 5 to 10000 mm2/s at 25°C, a component (C): 10 to 250 pts.mass of an organopolysiloxane having a kinematic viscosity of 100 to 100000 mm2/s at 25°C represented by the general formula (4) other than the component (A) and the component (B), R5dSiO(4-d)/2 (4) and a component (D): 500 to 3000 pts.mass of a thermally conductive filler having a thermal conductivity of 10 W/m °C or more based on 100 pts.mass of the total of the component (A), the component (B) and the component (C).SELECTED DRAWING: None 【課題】特別な保管条件を必要とせず、耐ズレ性に優れる熱伝導性シリコーン組成物を提供する。【解決手段】（Ａ）成分：一般式（１）で表されるオルガノポリシロキサン：１００質量部、TIFF2024114083000015.tif2389（Ｂ）成分：ケイ素原子に結合した水酸基及び／又は加水分解性シリル基を分子鎖両末端に有し、２５℃における動粘度が５～１０，０００ｍｍ２／ｓであるジオルガノポリシロキサン：２～１００質量部、（Ｃ）成分：（Ａ）成分、（Ｂ）成分以外の一般式（４）で表される２５℃における動粘度が１００～１００，０００ｍｍ２／ｓのオルガノポリシロキサン：１０～２５０質量部、Ｒ５ｄＳｉＯ（４-ｄ）／２（４）（Ｄ）成分：１０Ｗ／ｍ・℃以上の熱伝導率を有する熱伝導性充填材：（Ａ）成分と（Ｂ）成分と（Ｃ）成分の合計１００質量部に対して５００～３，０００質量部、を含むことを特徴とする熱伝導性シリコーン組成物。【選択図】なし
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jpn</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUJI KENICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUJI KENICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT CONDUCTIVE SILICONE COMPOSITION</title><date>2024-08-23</date><risdate>2024</risdate><abstract>To provide a heat conductive silicone composition having excellent displacement resistance without requiring special storage conditions.SOLUTION: There is provided a heat conductive silicone composition which comprises a component (A): 100 pts.mass of an organopolysiloxane represented by the general formula (1), a component (B): 2 to 100 pts.mass of a diorganopolysiloxane having a hydroxyl group and/or a hydrolyzable silyl group bonded to a silicon atom at both ends of the molecular chain and having a kinematic viscosity of 5 to 10000 mm2/s at 25°C, a component (C): 10 to 250 pts.mass of an organopolysiloxane having a kinematic viscosity of 100 to 100000 mm2/s at 25°C represented by the general formula (4) other than the component (A) and the component (B), R5dSiO(4-d)/2 (4) and a component (D): 500 to 3000 pts.mass of a thermally conductive filler having a thermal conductivity of 10 W/m °C or more based on 100 pts.mass of the total of the component (A), the component (B) and the component (C).SELECTED DRAWING: None 【課題】特別な保管条件を必要とせず、耐ズレ性に優れる熱伝導性シリコーン組成物を提供する。【解決手段】（Ａ）成分：一般式（１）で表されるオルガノポリシロキサン：１００質量部、TIFF2024114083000015.tif2389（Ｂ）成分：ケイ素原子に結合した水酸基及び／又は加水分解性シリル基を分子鎖両末端に有し、２５℃における動粘度が５～１０，０００ｍｍ２／ｓであるジオルガノポリシロキサン：２～１００質量部、（Ｃ）成分：（Ａ）成分、（Ｂ）成分以外の一般式（４）で表される２５℃における動粘度が１００～１００，０００ｍｍ２／ｓのオルガノポリシロキサン：１０～２５０質量部、Ｒ５ｄＳｉＯ（４-ｄ）／２（４）（Ｄ）成分：１０Ｗ／ｍ・℃以上の熱伝導率を有する熱伝導性充填材：（Ａ）成分と（Ｂ）成分と（Ｃ）成分の合計１００質量部に対して５００～３，０００質量部、を含むことを特徴とする熱伝導性シリコーン組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record>
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subjects	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title	HEAT CONDUCTIVE SILICONE COMPOSITION
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