MODULE-TYPE HIGH-FREQUENCY SOURCE
To provide a module-type high-frequency sending source.SOLUTION: The present invention relates to a module-type high-frequency sending source having a plurality of high-frequency sending modules. Each high-module sending module includes: an oscillation module having a voltage control circuit and a v...
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| creator | KALLOL BERA CHUA THAI CHENG CHRISTIAN AMORMINO NGUYEN HAHN PHILIP ALLAN KRAUS |
| description | To provide a module-type high-frequency sending source.SOLUTION: The present invention relates to a module-type high-frequency sending source having a plurality of high-frequency sending modules. Each high-module sending module includes: an oscillation module having a voltage control circuit and a voltage control target oscillation circuit; an amplification module connected to the oscillation module; and an applicator connected to the amplification module.SELECTED DRAWING: None
【課題】モジュール型高周波発出源を提供する。【解決手段】複数の高周波発出モジュールを備える、モジュール型高周波発出源であって、各高周波発出モジュールが、電圧制御回路及び電圧被制御発振器を備える発振モジュールと、前記発振モジュールに連結されている増幅モジュールと、前記増幅モジュールに連結されているアプリケータとを備える、モジュール型高周波発出源。【選択図】なし |
| format | Patent |
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【課題】モジュール型高周波発出源を提供する。【解決手段】複数の高周波発出モジュールを備える、モジュール型高周波発出源であって、各高周波発出モジュールが、電圧制御回路及び電圧被制御発振器を備える発振モジュールと、前記発振モジュールに連結されている増幅モジュールと、前記増幅モジュールに連結されているアプリケータとを備える、モジュール型高周波発出源。【選択図】なし</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PLASMA TECHNIQUE ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240821&DB=EPODOC&CC=JP&NR=2024112845A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240821&DB=EPODOC&CC=JP&NR=2024112845A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KALLOL BERA</creatorcontrib><creatorcontrib>CHUA THAI CHENG</creatorcontrib><creatorcontrib>CHRISTIAN AMORMINO</creatorcontrib><creatorcontrib>NGUYEN HAHN</creatorcontrib><creatorcontrib>PHILIP ALLAN KRAUS</creatorcontrib><title>MODULE-TYPE HIGH-FREQUENCY SOURCE</title><description>To provide a module-type high-frequency sending source.SOLUTION: The present invention relates to a module-type high-frequency sending source having a plurality of high-frequency sending modules. Each high-module sending module includes: an oscillation module having a voltage control circuit and a voltage control target oscillation circuit; an amplification module connected to the oscillation module; and an applicator connected to the amplification module.SELECTED DRAWING: None
【課題】モジュール型高周波発出源を提供する。【解決手段】複数の高周波発出モジュールを備える、モジュール型高周波発出源であって、各高周波発出モジュールが、電圧制御回路及び電圧被制御発振器を備える発振モジュールと、前記発振モジュールに連結されている増幅モジュールと、前記増幅モジュールに連結されているアプリケータとを備える、モジュール型高周波発出源。【選択図】なし</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PLASMA TECHNIQUE</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD09XcJ9XHVDYkMcFXw8HT30HULcg0MdfVzjlQI9g8NcnblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkYmhoZGFiamjsZEKQIAZ_Iiuw</recordid><startdate>20240821</startdate><enddate>20240821</enddate><creator>KALLOL BERA</creator><creator>CHUA THAI CHENG</creator><creator>CHRISTIAN AMORMINO</creator><creator>NGUYEN HAHN</creator><creator>PHILIP ALLAN KRAUS</creator><scope>EVB</scope></search><sort><creationdate>20240821</creationdate><title>MODULE-TYPE HIGH-FREQUENCY SOURCE</title><author>KALLOL BERA ; CHUA THAI CHENG ; CHRISTIAN AMORMINO ; NGUYEN HAHN ; PHILIP ALLAN KRAUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024112845A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PLASMA TECHNIQUE</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KALLOL BERA</creatorcontrib><creatorcontrib>CHUA THAI CHENG</creatorcontrib><creatorcontrib>CHRISTIAN AMORMINO</creatorcontrib><creatorcontrib>NGUYEN HAHN</creatorcontrib><creatorcontrib>PHILIP ALLAN KRAUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KALLOL BERA</au><au>CHUA THAI CHENG</au><au>CHRISTIAN AMORMINO</au><au>NGUYEN HAHN</au><au>PHILIP ALLAN KRAUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MODULE-TYPE HIGH-FREQUENCY SOURCE</title><date>2024-08-21</date><risdate>2024</risdate><abstract>To provide a module-type high-frequency sending source.SOLUTION: The present invention relates to a module-type high-frequency sending source having a plurality of high-frequency sending modules. Each high-module sending module includes: an oscillation module having a voltage control circuit and a voltage control target oscillation circuit; an amplification module connected to the oscillation module; and an applicator connected to the amplification module.SELECTED DRAWING: None
【課題】モジュール型高周波発出源を提供する。【解決手段】複数の高周波発出モジュールを備える、モジュール型高周波発出源であって、各高周波発出モジュールが、電圧制御回路及び電圧被制御発振器を備える発振モジュールと、前記発振モジュールに連結されている増幅モジュールと、前記増幅モジュールに連結されているアプリケータとを備える、モジュール型高周波発出源。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | MODULE-TYPE HIGH-FREQUENCY SOURCE |
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