LIGHT EMISSION DEVICE, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC APPARATUS, ILLUMINATION APPARATUS, MOVABLE BODY, AND MANUFACTURING METHOD OF LIGHT EMISSION DEVICE

To provide a technique that is advantageous for increasing the density of a light emission element.SOLUTION: A light emission device includes a structure in which a first substrate and a second substrate are laminated, and includes a light emission element and a drive circuit for driving the light e...

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Hauptverfasser: OKABAYASHI DAISUKE, YAMAGUCHI JUN
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description To provide a technique that is advantageous for increasing the density of a light emission element.SOLUTION: A light emission device includes a structure in which a first substrate and a second substrate are laminated, and includes a light emission element and a drive circuit for driving the light emission element. The first substrate is arranged between the light emission element and the second substrate, and has a first surface opposed to the second substrate and a second surface arranged on the opposite side to the first surface. The drive circuit includes a first element arranged on the first surface and a second element arranged on the second substrate. A conductive path for electrically connecting the light emission element with the first element is provided in a through hole that penetrates the first substrate on the first substrate. The opening area on the second surface of the through hole is greater than the opening area on the first surface of the through hole.SELECTED DRAWING: Figure 2 【課題】発光素子の高密度化に有利な技術を提供する。【解決手段】第1基板と第2基板とが積層された構造を備え、発光素子と前記発光素子を駆動するための駆動回路とを含む発光装置であって、前記第1基板は、前記発光素子と前記第2基板との間に配され、前記第2基板に対向する第1面および前記第1面とは反対側に配された第2面を備え、前記駆動回路は、前記第1面に配された第1素子と、前記第2基板に配された第2素子と、を含み、前記第1基板には、前記第1基板を貫通する貫通孔に、前記発光素子と前記第1素子とを電気的に接続するための導電経路が設けられており、前記貫通孔の前記第2面における開口面積が、前記貫通孔の前記第1面における開口面積よりも大きい。【選択図】図2
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The first substrate is arranged between the light emission element and the second substrate, and has a first surface opposed to the second substrate and a second surface arranged on the opposite side to the first surface. The drive circuit includes a first element arranged on the first surface and a second element arranged on the second substrate. A conductive path for electrically connecting the light emission element with the first element is provided in a through hole that penetrates the first substrate on the first substrate. The opening area on the second surface of the through hole is greater than the opening area on the first surface of the through hole.SELECTED DRAWING: Figure 2 【課題】発光素子の高密度化に有利な技術を提供する。【解決手段】第1基板と第2基板とが積層された構造を備え、発光素子と前記発光素子を駆動するための駆動回路とを含む発光装置であって、前記第1基板は、前記発光素子と前記第2基板との間に配され、前記第2基板に対向する第1面および前記第1面とは反対側に配された第2面を備え、前記駆動回路は、前記第1面に配された第1素子と、前記第2基板に配された第2素子と、を含み、前記第1基板には、前記第1基板を貫通する貫通孔に、前記発光素子と前記第1素子とを電気的に接続するための導電経路が設けられており、前記貫通孔の前記第2面における開口面積が、前記貫通孔の前記第1面における開口面積よりも大きい。【選択図】図2</abstract><oa>free_for_read</oa></addata></record>
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subjects ADVERTISING
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRICITY
LABELS OR NAME-PLATES
PHYSICS
SEALS
SIGNS
title LIGHT EMISSION DEVICE, DISPLAY APPARATUS, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC APPARATUS, ILLUMINATION APPARATUS, MOVABLE BODY, AND MANUFACTURING METHOD OF LIGHT EMISSION DEVICE
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