COMPOSITION OF POLISHING SOLUTION
To provide a composition of a polishing solution having a stable polishing performance in an embodiment.SOLUTION: The present disclosure relates to a composition of a polishing solution in an embodiment including: a cerium-containing particle (component A); a chemical compound (component B) which ca...
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| creator | YAMAGUCHI TETSUSHI INOUE MASAKI MORIIKE TAKANAO |
| description | To provide a composition of a polishing solution having a stable polishing performance in an embodiment.SOLUTION: The present disclosure relates to a composition of a polishing solution in an embodiment including: a cerium-containing particle (component A); a chemical compound (component B) which can be coordinated in a cerium ion; and water, or relates to a concentrated material of the composition of a polishing solution. The amount of cerium ions in the composition of a polishing solution or the concentrated material of the composition of a polishing solution is 125 ppm at most.SELECTED DRAWING: None
【課題】一態様において、安定した研磨性能を有する研磨液組成物を提供する。【解決手段】本開示は、一態様において、セリウム含有粒子（成分Ａ）と、セリウムイオンに配位可能な化合物（成分Ｂ）と、水とを含有する研磨液組成物又はその濃縮物であって、研磨液組成物又はその濃縮物中のセリウムイオン量が１２５ｐｐｍ以下である、研磨液組成物に関する。【選択図】なし |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2024085787A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2024085787A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2024085787A3</originalsourceid><addsrcrecordid>eNrjZFB09vcN8A_2DPH091Pwd1MI8PfxDPbw9HNXCPb3CQWJ8jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMjEwMLU3MLc0djohQBAH26IwU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMPOSITION OF POLISHING SOLUTION</title><source>esp@cenet</source><creator>YAMAGUCHI TETSUSHI ; INOUE MASAKI ; MORIIKE TAKANAO</creator><creatorcontrib>YAMAGUCHI TETSUSHI ; INOUE MASAKI ; MORIIKE TAKANAO</creatorcontrib><description>To provide a composition of a polishing solution having a stable polishing performance in an embodiment.SOLUTION: The present disclosure relates to a composition of a polishing solution in an embodiment including: a cerium-containing particle (component A); a chemical compound (component B) which can be coordinated in a cerium ion; and water, or relates to a concentrated material of the composition of a polishing solution. The amount of cerium ions in the composition of a polishing solution or the concentrated material of the composition of a polishing solution is 125 ppm at most.SELECTED DRAWING: None
【課題】一態様において、安定した研磨性能を有する研磨液組成物を提供する。【解決手段】本開示は、一態様において、セリウム含有粒子（成分Ａ）と、セリウムイオンに配位可能な化合物（成分Ｂ）と、水とを含有する研磨液組成物又はその濃縮物であって、研磨液組成物又はその濃縮物中のセリウムイオン量が１２５ｐｐｍ以下である、研磨液組成物に関する。【選択図】なし</description><language>eng ; jpn</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POLISHING ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SEMICONDUCTOR DEVICES ; SKI WAXES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=JP&NR=2024085787A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=JP&NR=2024085787A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAGUCHI TETSUSHI</creatorcontrib><creatorcontrib>INOUE MASAKI</creatorcontrib><creatorcontrib>MORIIKE TAKANAO</creatorcontrib><title>COMPOSITION OF POLISHING SOLUTION</title><description>To provide a composition of a polishing solution having a stable polishing performance in an embodiment.SOLUTION: The present disclosure relates to a composition of a polishing solution in an embodiment including: a cerium-containing particle (component A); a chemical compound (component B) which can be coordinated in a cerium ion; and water, or relates to a concentrated material of the composition of a polishing solution. The amount of cerium ions in the composition of a polishing solution or the concentrated material of the composition of a polishing solution is 125 ppm at most.SELECTED DRAWING: None
【課題】一態様において、安定した研磨性能を有する研磨液組成物を提供する。【解決手段】本開示は、一態様において、セリウム含有粒子（成分Ａ）と、セリウムイオンに配位可能な化合物（成分Ｂ）と、水とを含有する研磨液組成物又はその濃縮物であって、研磨液組成物又はその濃縮物中のセリウムイオン量が１２５ｐｐｍ以下である、研磨液組成物に関する。【選択図】なし</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SKI WAXES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB09vcN8A_2DPH091Pwd1MI8PfxDPbw9HNXCPb3CQWJ8jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMjEwMLU3MLc0djohQBAH26IwU</recordid><startdate>20240627</startdate><enddate>20240627</enddate><creator>YAMAGUCHI TETSUSHI</creator><creator>INOUE MASAKI</creator><creator>MORIIKE TAKANAO</creator><scope>EVB</scope></search><sort><creationdate>20240627</creationdate><title>COMPOSITION OF POLISHING SOLUTION</title><author>YAMAGUCHI TETSUSHI ; INOUE MASAKI ; MORIIKE TAKANAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024085787A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POLISHING</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SKI WAXES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAGUCHI TETSUSHI</creatorcontrib><creatorcontrib>INOUE MASAKI</creatorcontrib><creatorcontrib>MORIIKE TAKANAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAGUCHI TETSUSHI</au><au>INOUE MASAKI</au><au>MORIIKE TAKANAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION OF POLISHING SOLUTION</title><date>2024-06-27</date><risdate>2024</risdate><abstract>To provide a composition of a polishing solution having a stable polishing performance in an embodiment.SOLUTION: The present disclosure relates to a composition of a polishing solution in an embodiment including: a cerium-containing particle (component A); a chemical compound (component B) which can be coordinated in a cerium ion; and water, or relates to a concentrated material of the composition of a polishing solution. The amount of cerium ions in the composition of a polishing solution or the concentrated material of the composition of a polishing solution is 125 ppm at most.SELECTED DRAWING: None
【課題】一態様において、安定した研磨性能を有する研磨液組成物を提供する。【解決手段】本開示は、一態様において、セリウム含有粒子（成分Ａ）と、セリウムイオンに配位可能な化合物（成分Ｂ）と、水とを含有する研磨液組成物又はその濃縮物であって、研磨液組成物又はその濃縮物中のセリウムイオン量が１２５ｐｐｍ以下である、研磨液組成物に関する。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING |
| title | COMPOSITION OF POLISHING SOLUTION |
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