RESIN WITH ACID RADICAL AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST AND RESIST MEMBER
To provide a resin that exhibits superior alkali developability and yields a cured product with low elasticity and high adhesion, and to provide a curable resin composition, a cured product, an insulating material, a resin material for solder resist and a resist member, each including the same.SOLUT...
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| creator | HIROTA YOSUKE YAMADA SHUNSUKE |
| description | To provide a resin that exhibits superior alkali developability and yields a cured product with low elasticity and high adhesion, and to provide a curable resin composition, a cured product, an insulating material, a resin material for solder resist and a resist member, each including the same.SOLUTION: The present invention provides a resin with an acid radical and a polymerizable unsaturated group. This resin includes, as essential reactive raw materials: an epoxy resin (A), which is a glycidyl ether product of a polyhydroxy resin (A') derived from reactive raw materials (A1), consisting of an aromatic compound (Aa) with a phenolic hydroxyl group bonded to an aromatic ring and at least one monovalent hydrocarbon group at the meta position of the aromatic ring, and an aromatic divinyl compound (Ab1); an unsaturated monobasic acid (B) and a polybasic acid anhydride (C).SELECTED DRAWING: None
【課題】優れたアルカリ現像性を有し、硬化物における低弾性及び高密着性を有する樹脂、及びこれを用いた硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材を提供する。【解決手段】フェノール性水酸基が結合された芳香環及び前記芳香環のメタ位に一価の炭化水素基を少なくとも１つ有する芳香族化合物（Ａａ）と、芳香族ジビニル化合物（Ａｂ１）と、を反応原料（Ａ１）とする多価ヒドロキシ樹脂（Ａ'）のグリシジルエーテル化物であるエポキシ樹脂（Ａ）と、不飽和一塩基酸（Ｂ）と、多塩基酸無水物（Ｃ）とを必須の反応原料とすることを特徴とする酸基及び重合性不飽和基を有する樹脂。【選択図】なし |
| format | Patent |
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【課題】優れたアルカリ現像性を有し、硬化物における低弾性及び高密着性を有する樹脂、及びこれを用いた硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材を提供する。【解決手段】フェノール性水酸基が結合された芳香環及び前記芳香環のメタ位に一価の炭化水素基を少なくとも１つ有する芳香族化合物（Ａａ）と、芳香族ジビニル化合物（Ａｂ１）と、を反応原料（Ａ１）とする多価ヒドロキシ樹脂（Ａ'）のグリシジルエーテル化物であるエポキシ樹脂（Ａ）と、不飽和一塩基酸（Ｂ）と、多塩基酸無水物（Ｃ）とを必須の反応原料とすることを特徴とする酸基及び重合性不飽和基を有する樹脂。【選択図】なし</description><language>eng ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=JP&NR=2024085775A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=JP&NR=2024085775A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIROTA YOSUKE</creatorcontrib><creatorcontrib>YAMADA SHUNSUKE</creatorcontrib><title>RESIN WITH ACID RADICAL AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST AND RESIST MEMBER</title><description>To provide a resin that exhibits superior alkali developability and yields a cured product with low elasticity and high adhesion, and to provide a curable resin composition, a cured product, an insulating material, a resin material for solder resist and a resist member, each including the same.SOLUTION: The present invention provides a resin with an acid radical and a polymerizable unsaturated group. This resin includes, as essential reactive raw materials: an epoxy resin (A), which is a glycidyl ether product of a polyhydroxy resin (A') derived from reactive raw materials (A1), consisting of an aromatic compound (Aa) with a phenolic hydroxyl group bonded to an aromatic ring and at least one monovalent hydrocarbon group at the meta position of the aromatic ring, and an aromatic divinyl compound (Ab1); an unsaturated monobasic acid (B) and a polybasic acid anhydride (C).SELECTED DRAWING: None
【課題】優れたアルカリ現像性を有し、硬化物における低弾性及び高密着性を有する樹脂、及びこれを用いた硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材を提供する。【解決手段】フェノール性水酸基が結合された芳香環及び前記芳香環のメタ位に一価の炭化水素基を少なくとも１つ有する芳香族化合物（Ａａ）と、芳香族ジビニル化合物（Ａｂ１）と、を反応原料（Ａ１）とする多価ヒドロキシ樹脂（Ａ'）のグリシジルエーテル化物であるエポキシ樹脂（Ａ）と、不飽和一塩基酸（Ｂ）と、多塩基酸無水物（Ｃ）とを必須の反応原料とすることを特徴とする酸基及び重合性不飽和基を有する樹脂。【選択図】なし</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjs0OAUEQhPfiIHiHjvNKxE-4tplBy_ylZybCRUTGSZDwXJ7RWuvuVF35qirdLl6sAlnYUlwDCpLAKEmgBrQSvNM7o5j2uNAKkg0YE2NUElbski9BVPaDviPCGe8CRXK2RlXOs5NJxBLIhqQxkl2BqRaYUJdN7edh6RiC01JxTUKsn2hOo8xCcbdonY-XR-412in6SxXFepDvt0N-3I-nfM3Pw8aPhqPJcD6dzaY4_iv0BuwASUk</recordid><startdate>20240627</startdate><enddate>20240627</enddate><creator>HIROTA YOSUKE</creator><creator>YAMADA SHUNSUKE</creator><scope>EVB</scope></search><sort><creationdate>20240627</creationdate><title>RESIN WITH ACID RADICAL AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST AND RESIST MEMBER</title><author>HIROTA YOSUKE ; YAMADA SHUNSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024085775A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HIROTA YOSUKE</creatorcontrib><creatorcontrib>YAMADA SHUNSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIROTA YOSUKE</au><au>YAMADA SHUNSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN WITH ACID RADICAL AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST AND RESIST MEMBER</title><date>2024-06-27</date><risdate>2024</risdate><abstract>To provide a resin that exhibits superior alkali developability and yields a cured product with low elasticity and high adhesion, and to provide a curable resin composition, a cured product, an insulating material, a resin material for solder resist and a resist member, each including the same.SOLUTION: The present invention provides a resin with an acid radical and a polymerizable unsaturated group. This resin includes, as essential reactive raw materials: an epoxy resin (A), which is a glycidyl ether product of a polyhydroxy resin (A') derived from reactive raw materials (A1), consisting of an aromatic compound (Aa) with a phenolic hydroxyl group bonded to an aromatic ring and at least one monovalent hydrocarbon group at the meta position of the aromatic ring, and an aromatic divinyl compound (Ab1); an unsaturated monobasic acid (B) and a polybasic acid anhydride (C).SELECTED DRAWING: None
【課題】優れたアルカリ現像性を有し、硬化物における低弾性及び高密着性を有する樹脂、及びこれを用いた硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材を提供する。【解決手段】フェノール性水酸基が結合された芳香環及び前記芳香環のメタ位に一価の炭化水素基を少なくとも１つ有する芳香族化合物（Ａａ）と、芳香族ジビニル化合物（Ａｂ１）と、を反応原料（Ａ１）とする多価ヒドロキシ樹脂（Ａ'）のグリシジルエーテル化物であるエポキシ樹脂（Ａ）と、不飽和一塩基酸（Ｂ）と、多塩基酸無水物（Ｃ）とを必須の反応原料とすることを特徴とする酸基及び重合性不飽和基を有する樹脂。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | RESIN WITH ACID RADICAL AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST AND RESIST MEMBER |
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