CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
To provide a printed circuit board and a method of manufacturing the printed circuit board.SOLUTION: A circuit board includes: a first insulating layer; a second insulating layer positioned on the first insulating layer; and a first pad portion and a second pad portion which are partially buried in...
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| creator | LEE KYE HWAN |
| description | To provide a printed circuit board and a method of manufacturing the printed circuit board.SOLUTION: A circuit board includes: a first insulating layer; a second insulating layer positioned on the first insulating layer; and a first pad portion and a second pad portion which are partially buried in the first insulating layer, protrude from the second insulating layer, and have different thicknesses. The first pad portion and the second pad portion each include a first layer and a second layer positioned on the first layer, and heights of the first layer of the first pad portion and the first layer of the second pad portion are lower than a height of the first insulating layer.SELECTED DRAWING: Figure 1
【課題】プリント回路基板及びプリント回路基板の製造方法を提供する。【解決手段】本発明による回路基板は、第１絶縁層と、第１絶縁層上に位置する第２絶縁層と、第１絶縁層内に一部分埋込まれ、第２絶縁層から突出し、厚さが互いに異なる第１パッド部および第２パッド部とを含み、第１パッド部と第２パッド部はそれぞれ、第１層と、第１層上に位置する第２層とを含み、第１パッド部の第１層と第２パッド部の第１層の高さは、第１絶縁層の高さよりも低い。【選択図】図１ |
| format | Patent |
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【課題】プリント回路基板及びプリント回路基板の製造方法を提供する。【解決手段】本発明による回路基板は、第１絶縁層と、第１絶縁層上に位置する第２絶縁層と、第１絶縁層内に一部分埋込まれ、第２絶縁層から突出し、厚さが互いに異なる第１パッド部および第２パッド部とを含み、第１パッド部と第２パッド部はそれぞれ、第１層と、第１層上に位置する第２層とを含み、第１パッド部の第１層と第２パッド部の第１層の高さは、第１絶縁層の高さよりも低い。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240610&DB=EPODOC&CC=JP&NR=2024078417A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240610&DB=EPODOC&CC=JP&NR=2024078417A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE KYE HWAN</creatorcontrib><title>CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><description>To provide a printed circuit board and a method of manufacturing the printed circuit board.SOLUTION: A circuit board includes: a first insulating layer; a second insulating layer positioned on the first insulating layer; and a first pad portion and a second pad portion which are partially buried in the first insulating layer, protrude from the second insulating layer, and have different thicknesses. The first pad portion and the second pad portion each include a first layer and a second layer positioned on the first layer, and heights of the first layer of the first pad portion and the first layer of the second pad portion are lower than a height of the first insulating layer.SELECTED DRAWING: Figure 1
【課題】プリント回路基板及びプリント回路基板の製造方法を提供する。【解決手段】本発明による回路基板は、第１絶縁層と、第１絶縁層上に位置する第２絶縁層と、第１絶縁層内に一部分埋込まれ、第２絶縁層から突出し、厚さが互いに異なる第１パッド部および第２パッド部とを含み、第１パッド部と第２パッド部はそれぞれ、第１層と、第１層上に位置する第２層とを含み、第１パッド部の第１層と第２パッド部の第１層の高さは、第１絶縁層の高さよりも低い。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB39gxyDvUMUXDydwxyUXD0c1HwdQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1dAUcnDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMjEwMzC1MDM0djYlSBABswihr</recordid><startdate>20240610</startdate><enddate>20240610</enddate><creator>LEE KYE HWAN</creator><scope>EVB</scope></search><sort><creationdate>20240610</creationdate><title>CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><author>LEE KYE HWAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024078417A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE KYE HWAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE KYE HWAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><date>2024-06-10</date><risdate>2024</risdate><abstract>To provide a printed circuit board and a method of manufacturing the printed circuit board.SOLUTION: A circuit board includes: a first insulating layer; a second insulating layer positioned on the first insulating layer; and a first pad portion and a second pad portion which are partially buried in the first insulating layer, protrude from the second insulating layer, and have different thicknesses. The first pad portion and the second pad portion each include a first layer and a second layer positioned on the first layer, and heights of the first layer of the first pad portion and the first layer of the second pad portion are lower than a height of the first insulating layer.SELECTED DRAWING: Figure 1
【課題】プリント回路基板及びプリント回路基板の製造方法を提供する。【解決手段】本発明による回路基板は、第１絶縁層と、第１絶縁層上に位置する第２絶縁層と、第１絶縁層内に一部分埋込まれ、第２絶縁層から突出し、厚さが互いに異なる第１パッド部および第２パッド部とを含み、第１パッド部と第２パッド部はそれぞれ、第１層と、第１層上に位置する第２層とを含み、第１パッド部の第１層と第２パッド部の第１層の高さは、第１絶縁層の高さよりも低い。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD |
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