WORKPIECE GRINDING METHOD
To provide a workpiece grinding method which can accelerate the spontaneous blade generation of each of a plurality of grinding whetstones without weakening the holding power of an abrasive-holding binder.SOLUTION: A workpiece grinding method of this invention, which enables a recess having a circul...
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| creator | KAKEFUDA MASAKI |
| description | To provide a workpiece grinding method which can accelerate the spontaneous blade generation of each of a plurality of grinding whetstones without weakening the holding power of an abrasive-holding binder.SOLUTION: A workpiece grinding method of this invention, which enables a recess having a circular bottom to be formed by grinding one face side of the central region of a workpiece, includes: a groove-forming step for forming a groove with a depth which does not reach a recess depth by using a cutting blade to cut one face side of the central region; and a grinding step for removing a part which demarcates the groove and forming a recess by using, after the groove-forming step, a grinding wheel having a plurality of grinding whetstones to grind one face side of the central region.SELECTED DRAWING: Figure 2
【課題】砥粒を保持する結合材の保持力を弱くすることなく、複数の研削砥石のそれぞれの自生発刃を促進することが可能な被加工物の研削方法を提供する。【解決手段】被加工物の中央領域の一面側を研削して円形の底面を有する凹部を形成する被加工物の研削方法であって、切削ブレードを使用して中央領域の一面側を切削することによって凹部の深さに至らない深さの溝を形成する溝形成ステップと、溝形成ステップの後に、円環状に配列されている複数の研削砥石を有する研削ホイールを使用して中央領域の一面側を研削することによって溝を画定する部分を除去するとともに凹部を形成する研削ステップと、を備える。【選択図】図２ |
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【課題】砥粒を保持する結合材の保持力を弱くすることなく、複数の研削砥石のそれぞれの自生発刃を促進することが可能な被加工物の研削方法を提供する。【解決手段】被加工物の中央領域の一面側を研削して円形の底面を有する凹部を形成する被加工物の研削方法であって、切削ブレードを使用して中央領域の一面側を切削することによって凹部の深さに至らない深さの溝を形成する溝形成ステップと、溝形成ステップの後に、円環状に配列されている複数の研削砥石を有する研削ホイールを使用して中央領域の一面側を研削することによって溝を画定する部分を除去するとともに凹部を形成する研削ステップと、を備える。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240610&DB=EPODOC&CC=JP&NR=2024077677A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240610&DB=EPODOC&CC=JP&NR=2024077677A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAKEFUDA MASAKI</creatorcontrib><title>WORKPIECE GRINDING METHOD</title><description>To provide a workpiece grinding method which can accelerate the spontaneous blade generation of each of a plurality of grinding whetstones without weakening the holding power of an abrasive-holding binder.SOLUTION: A workpiece grinding method of this invention, which enables a recess having a circular bottom to be formed by grinding one face side of the central region of a workpiece, includes: a groove-forming step for forming a groove with a depth which does not reach a recess depth by using a cutting blade to cut one face side of the central region; and a grinding step for removing a part which demarcates the groove and forming a recess by using, after the groove-forming step, a grinding wheel having a plurality of grinding whetstones to grind one face side of the central region.SELECTED DRAWING: Figure 2
【課題】砥粒を保持する結合材の保持力を弱くすることなく、複数の研削砥石のそれぞれの自生発刃を促進することが可能な被加工物の研削方法を提供する。【解決手段】被加工物の中央領域の一面側を研削して円形の底面を有する凹部を形成する被加工物の研削方法であって、切削ブレードを使用して中央領域の一面側を切削することによって凹部の深さに至らない深さの溝を形成する溝形成ステップと、溝形成ステップの後に、円環状に配列されている複数の研削砥石を有する研削ホイールを使用して中央領域の一面側を研削することによって溝を画定する部分を除去するとともに凹部を形成する研削ステップと、を備える。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAM9w_yDvB0dXZVcA_y9HPx9HNX8HUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGJgbm5mbm5o7GRCkCAFbBIIQ</recordid><startdate>20240610</startdate><enddate>20240610</enddate><creator>KAKEFUDA MASAKI</creator><scope>EVB</scope></search><sort><creationdate>20240610</creationdate><title>WORKPIECE GRINDING METHOD</title><author>KAKEFUDA MASAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024077677A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KAKEFUDA MASAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAKEFUDA MASAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WORKPIECE GRINDING METHOD</title><date>2024-06-10</date><risdate>2024</risdate><abstract>To provide a workpiece grinding method which can accelerate the spontaneous blade generation of each of a plurality of grinding whetstones without weakening the holding power of an abrasive-holding binder.SOLUTION: A workpiece grinding method of this invention, which enables a recess having a circular bottom to be formed by grinding one face side of the central region of a workpiece, includes: a groove-forming step for forming a groove with a depth which does not reach a recess depth by using a cutting blade to cut one face side of the central region; and a grinding step for removing a part which demarcates the groove and forming a recess by using, after the groove-forming step, a grinding wheel having a plurality of grinding whetstones to grind one face side of the central region.SELECTED DRAWING: Figure 2
【課題】砥粒を保持する結合材の保持力を弱くすることなく、複数の研削砥石のそれぞれの自生発刃を促進することが可能な被加工物の研削方法を提供する。【解決手段】被加工物の中央領域の一面側を研削して円形の底面を有する凹部を形成する被加工物の研削方法であって、切削ブレードを使用して中央領域の一面側を切削することによって凹部の深さに至らない深さの溝を形成する溝形成ステップと、溝形成ステップの後に、円環状に配列されている複数の研削砥石を有する研削ホイールを使用して中央領域の一面側を研削することによって溝を画定する部分を除去するとともに凹部を形成する研削ステップと、を備える。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | WORKPIECE GRINDING METHOD |
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