PROCESSING DEVICE
To make dirt less likely to accumulate near a spindle and achieve simplification of device assembly work.SOLUTION: A processing device includes: a spindle 212; a mount fixed to a tip of the spindle 212; and a processing tool fixed to the mount. The processing device includes a block 50 which is disp...
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| creator | FUJIE KENICHI NAKANISHI YUJI |
| description | To make dirt less likely to accumulate near a spindle and achieve simplification of device assembly work.SOLUTION: A processing device includes: a spindle 212; a mount fixed to a tip of the spindle 212; and a processing tool fixed to the mount. The processing device includes a block 50 which is disposed adjacent to a spindle housing 211 of the spindle 212 and formed with a plurality of through holes 53. The through holes 53 serve as supply passages 501, 502, 503 for supplying at least one of fluid, light, and electric current.SELECTED DRAWING: Figure 3
【課題】スピンドルの近傍の汚れが溜まりにくく、かつ装置組み立ての作業を簡単化すること。【解決手段】加工装置は、スピンドル２１２と、該スピンドル２１２の先端に固定されるマウントと、該マウントに固定される加工工具と、を備える加工装置であって、該スピンドル２１２のスピンドルハウジング２１１に隣接して配置され、複数の貫通孔５３が形成されたブロック５０を備え、該貫通孔５３が流体、光、電流の少なくともいずれかを供給する供給路５０１，５０２，５０３となる。【選択図】図３ |
| format | Patent |
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【課題】スピンドルの近傍の汚れが溜まりにくく、かつ装置組み立ての作業を簡単化すること。【解決手段】加工装置は、スピンドル２１２と、該スピンドル２１２の先端に固定されるマウントと、該マウントに固定される加工工具と、を備える加工装置であって、該スピンドル２１２のスピンドルハウジング２１１に隣接して配置され、複数の貫通孔５３が形成されたブロック５０を備え、該貫通孔５３が流体、光、電流の少なくともいずれかを供給する供給路５０１，５０２，５０３となる。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240607&DB=EPODOC&CC=JP&NR=2024077213A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240607&DB=EPODOC&CC=JP&NR=2024077213A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJIE KENICHI</creatorcontrib><creatorcontrib>NAKANISHI YUJI</creatorcontrib><title>PROCESSING DEVICE</title><description>To make dirt less likely to accumulate near a spindle and achieve simplification of device assembly work.SOLUTION: A processing device includes: a spindle 212; a mount fixed to a tip of the spindle 212; and a processing tool fixed to the mount. The processing device includes a block 50 which is disposed adjacent to a spindle housing 211 of the spindle 212 and formed with a plurality of through holes 53. The through holes 53 serve as supply passages 501, 502, 503 for supplying at least one of fluid, light, and electric current.SELECTED DRAWING: Figure 3
【課題】スピンドルの近傍の汚れが溜まりにくく、かつ装置組み立ての作業を簡単化すること。【解決手段】加工装置は、スピンドル２１２と、該スピンドル２１２の先端に固定されるマウントと、該マウントに固定される加工工具と、を備える加工装置であって、該スピンドル２１２のスピンドルハウジング２１１に隣接して配置され、複数の貫通孔５３が形成されたブロック５０を備え、該貫通孔５３が流体、光、電流の少なくともいずれかを供給する供給路５０１，５０２，５０３となる。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</subject><subject>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINE TOOLS</subject><subject>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMCPJ3dg0O9vRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRiYG5uZGhsaOxkQpAgBbWh4x</recordid><startdate>20240607</startdate><enddate>20240607</enddate><creator>FUJIE KENICHI</creator><creator>NAKANISHI YUJI</creator><scope>EVB</scope></search><sort><creationdate>20240607</creationdate><title>PROCESSING DEVICE</title><author>FUJIE KENICHI ; NAKANISHI YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024077213A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</topic><topic>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINE TOOLS</topic><topic>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJIE KENICHI</creatorcontrib><creatorcontrib>NAKANISHI YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJIE KENICHI</au><au>NAKANISHI YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESSING DEVICE</title><date>2024-06-07</date><risdate>2024</risdate><abstract>To make dirt less likely to accumulate near a spindle and achieve simplification of device assembly work.SOLUTION: A processing device includes: a spindle 212; a mount fixed to a tip of the spindle 212; and a processing tool fixed to the mount. The processing device includes a block 50 which is disposed adjacent to a spindle housing 211 of the spindle 212 and formed with a plurality of through holes 53. The through holes 53 serve as supply passages 501, 502, 503 for supplying at least one of fluid, light, and electric current.SELECTED DRAWING: Figure 3
【課題】スピンドルの近傍の汚れが溜まりにくく、かつ装置組み立ての作業を簡単化すること。【解決手段】加工装置は、スピンドル２１２と、該スピンドル２１２の先端に固定されるマウントと、該マウントに固定される加工工具と、を備える加工装置であって、該スピンドル２１２のスピンドルハウジング２１１に隣接して配置され、複数の貫通孔５３が形成されたブロック５０を備え、該貫通孔５３が流体、光、電流の少なくともいずれかを供給する供給路５０１，５０２，５０３となる。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | PROCESSING DEVICE |
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