RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME

To provide a resin composition for sealing that exhibits high fluidity and superior moldability during molding, while demonstrating high thermal conductivity and superior heat dissipation during curing, and a method for producing the same.SOLUTION: A resin composition for semiconductor sealing compr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIZOHATA KEN, MAE HIDEO, INO HARUKA, NOGAMI OSAMU, MIYAZAKI SHOGO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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