RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME
To provide a resin composition for sealing that exhibits high fluidity and superior moldability during molding, while demonstrating high thermal conductivity and superior heat dissipation during curing, and a method for producing the same.SOLUTION: A resin composition for semiconductor sealing compr...
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| creator | MIZOHATA KEN MAE HIDEO INO HARUKA NOGAMI OSAMU MIYAZAKI SHOGO |
| description | To provide a resin composition for sealing that exhibits high fluidity and superior moldability during molding, while demonstrating high thermal conductivity and superior heat dissipation during curing, and a method for producing the same.SOLUTION: A resin composition for semiconductor sealing comprises an epoxy resin and a surface-treated alumina filler. The surface-treated alumina filler is an alumina filler combined with a hydroxy acid compound having a carboxy group and a hydroxy group.SELECTED DRAWING: None
【課題】成形時において流動性が高く成形性に優れるとともに、硬化時において熱伝導率が高く放熱性に優れた封止用樹脂組成物、およびその製造方法を提供する。【解決手段】半導体封止用の樹脂組成物であって、エポキシ樹脂と、表面処理されたアルミナフィラーと、を含み、前記表面処理されたアルミナフィラーは、カルボキシ基とヒドロキシ基とを有するヒドロキシ酸化合物が付着したアルミナフィラーである、樹脂組成物。【選択図】なし |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2024073100A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2024073100A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2024073100A3</originalsourceid><addsrcrecordid>eNrjZPANcg329FNw9vcN8A_2DPH091Nw8w9SCHb19XT293MJdQ4B8xx9PP3cFRz9XBR8XUM8_F3AigKC_IEKQBIhHq4KwY6-rjwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMjAyMTA3NjQwMDRmChFAFInLpk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME</title><source>esp@cenet</source><creator>MIZOHATA KEN ; MAE HIDEO ; INO HARUKA ; NOGAMI OSAMU ; MIYAZAKI SHOGO</creator><creatorcontrib>MIZOHATA KEN ; MAE HIDEO ; INO HARUKA ; NOGAMI OSAMU ; MIYAZAKI SHOGO</creatorcontrib><description>To provide a resin composition for sealing that exhibits high fluidity and superior moldability during molding, while demonstrating high thermal conductivity and superior heat dissipation during curing, and a method for producing the same.SOLUTION: A resin composition for semiconductor sealing comprises an epoxy resin and a surface-treated alumina filler. The surface-treated alumina filler is an alumina filler combined with a hydroxy acid compound having a carboxy group and a hydroxy group.SELECTED DRAWING: None
【課題】成形時において流動性が高く成形性に優れるとともに、硬化時において熱伝導率が高く放熱性に優れた封止用樹脂組成物、およびその製造方法を提供する。【解決手段】半導体封止用の樹脂組成物であって、エポキシ樹脂と、表面処理されたアルミナフィラーと、を含み、前記表面処理されたアルミナフィラーは、カルボキシ基とヒドロキシ基とを有するヒドロキシ酸化合物が付着したアルミナフィラーである、樹脂組成物。【選択図】なし</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240529&DB=EPODOC&CC=JP&NR=2024073100A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240529&DB=EPODOC&CC=JP&NR=2024073100A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIZOHATA KEN</creatorcontrib><creatorcontrib>MAE HIDEO</creatorcontrib><creatorcontrib>INO HARUKA</creatorcontrib><creatorcontrib>NOGAMI OSAMU</creatorcontrib><creatorcontrib>MIYAZAKI SHOGO</creatorcontrib><title>RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME</title><description>To provide a resin composition for sealing that exhibits high fluidity and superior moldability during molding, while demonstrating high thermal conductivity and superior heat dissipation during curing, and a method for producing the same.SOLUTION: A resin composition for semiconductor sealing comprises an epoxy resin and a surface-treated alumina filler. The surface-treated alumina filler is an alumina filler combined with a hydroxy acid compound having a carboxy group and a hydroxy group.SELECTED DRAWING: None
【課題】成形時において流動性が高く成形性に優れるとともに、硬化時において熱伝導率が高く放熱性に優れた封止用樹脂組成物、およびその製造方法を提供する。【解決手段】半導体封止用の樹脂組成物であって、エポキシ樹脂と、表面処理されたアルミナフィラーと、を含み、前記表面処理されたアルミナフィラーは、カルボキシ基とヒドロキシ基とを有するヒドロキシ酸化合物が付着したアルミナフィラーである、樹脂組成物。【選択図】なし</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPANcg329FNw9vcN8A_2DPH091Nw8w9SCHb19XT293MJdQ4B8xx9PP3cFRz9XBR8XUM8_F3AigKC_IEKQBIhHq4KwY6-rjwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMjAyMTA3NjQwMDRmChFAFInLpk</recordid><startdate>20240529</startdate><enddate>20240529</enddate><creator>MIZOHATA KEN</creator><creator>MAE HIDEO</creator><creator>INO HARUKA</creator><creator>NOGAMI OSAMU</creator><creator>MIYAZAKI SHOGO</creator><scope>EVB</scope></search><sort><creationdate>20240529</creationdate><title>RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME</title><author>MIZOHATA KEN ; MAE HIDEO ; INO HARUKA ; NOGAMI OSAMU ; MIYAZAKI SHOGO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024073100A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>MIZOHATA KEN</creatorcontrib><creatorcontrib>MAE HIDEO</creatorcontrib><creatorcontrib>INO HARUKA</creatorcontrib><creatorcontrib>NOGAMI OSAMU</creatorcontrib><creatorcontrib>MIYAZAKI SHOGO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIZOHATA KEN</au><au>MAE HIDEO</au><au>INO HARUKA</au><au>NOGAMI OSAMU</au><au>MIYAZAKI SHOGO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME</title><date>2024-05-29</date><risdate>2024</risdate><abstract>To provide a resin composition for sealing that exhibits high fluidity and superior moldability during molding, while demonstrating high thermal conductivity and superior heat dissipation during curing, and a method for producing the same.SOLUTION: A resin composition for semiconductor sealing comprises an epoxy resin and a surface-treated alumina filler. The surface-treated alumina filler is an alumina filler combined with a hydroxy acid compound having a carboxy group and a hydroxy group.SELECTED DRAWING: None
【課題】成形時において流動性が高く成形性に優れるとともに、硬化時において熱伝導率が高く放熱性に優れた封止用樹脂組成物、およびその製造方法を提供する。【解決手段】半導体封止用の樹脂組成物であって、エポキシ樹脂と、表面処理されたアルミナフィラーと、を含み、前記表面処理されたアルミナフィラーは、カルボキシ基とヒドロキシ基とを有するヒドロキシ酸化合物が付着したアルミナフィラーである、樹脂組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR PRODUCING THE SAME |
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