WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT
To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: In a wiring structure 1 of electronic components, a flexible wiring element 4 having conductive wiring portions formed on the surface of a protrus...
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| creator | MAEDA SHINICHI MIYASATO KEITA |
| description | To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: In a wiring structure 1 of electronic components, a flexible wiring element 4 having conductive wiring portions formed on the surface of a protrusion protruding in a direction different from a height direction of a side surface among the surfaces of a third electronic component included in any of one or more electronic components, which is further stacked and installed on a first electronic component installed on a substrate and electrically connected to the substrate, is arranged apart from the substrate, and the wiring portion in the flexible wiring element 4 is electrically connected with the third electronic component. The third electronic component outputs signals to one other electronic component via the substrate and the flexible wiring element 4.SELECTED DRAWING: Figure 26
【課題】高速大容量の高速伝送システムにおいて伝送損失の低減を図り、さらに基板の放熱性の向上を図る。【解決手段】電子部品の配線構造１は、基板上に設置され当該基板と電気的に接続される第１電子部品の上にさらに積層されて設置される、１以上の電子部品の何れかに含まれる第３電子部品の表面上のうち、側面に有する高さ方向とは異なる方向に突出した突出部の表面上に、導電性の配線部が形成された柔軟性を有する柔軟配線体４を、基板から離間して配置させ、柔軟配線体４における配線部は、第３電子部品と電気的に接続されることを特徴とする。第３電子部品は、基板と柔軟配線体４とを介して、一の他の電子部品に対して、信号を出力する。【選択図】図２６ |
| format | Patent |
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【課題】高速大容量の高速伝送システムにおいて伝送損失の低減を図り、さらに基板の放熱性の向上を図る。【解決手段】電子部品の配線構造１は、基板上に設置され当該基板と電気的に接続される第１電子部品の上にさらに積層されて設置される、１以上の電子部品の何れかに含まれる第３電子部品の表面上のうち、側面に有する高さ方向とは異なる方向に突出した突出部の表面上に、導電性の配線部が形成された柔軟性を有する柔軟配線体４を、基板から離間して配置させ、柔軟配線体４における配線部は、第３電子部品と電気的に接続されることを特徴とする。第３電子部品は、基板と柔軟配線体４とを介して、一の他の電子部品に対して、信号を出力する。【選択図】図２６</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240522&DB=EPODOC&CC=JP&NR=2024070266A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240522&DB=EPODOC&CC=JP&NR=2024070266A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAEDA SHINICHI</creatorcontrib><creatorcontrib>MIYASATO KEITA</creatorcontrib><title>WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT</title><description>To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: In a wiring structure 1 of electronic components, a flexible wiring element 4 having conductive wiring portions formed on the surface of a protrusion protruding in a direction different from a height direction of a side surface among the surfaces of a third electronic component included in any of one or more electronic components, which is further stacked and installed on a first electronic component installed on a substrate and electrically connected to the substrate, is arranged apart from the substrate, and the wiring portion in the flexible wiring element 4 is electrically connected with the third electronic component. The third electronic component outputs signals to one other electronic component via the substrate and the flexible wiring element 4.SELECTED DRAWING: Figure 26
【課題】高速大容量の高速伝送システムにおいて伝送損失の低減を図り、さらに基板の放熱性の向上を図る。【解決手段】電子部品の配線構造１は、基板上に設置され当該基板と電気的に接続される第１電子部品の上にさらに積層されて設置される、１以上の電子部品の何れかに含まれる第３電子部品の表面上のうち、側面に有する高さ方向とは異なる方向に突出した突出部の表面上に、導電性の配線部が形成された柔軟性を有する柔軟配線体４を、基板から離間して配置させ、柔軟配線体４における配線部は、第３電子部品と電気的に接続されることを特徴とする。第３電子部品は、基板と柔軟配線体４とを介して、一の他の電子部品に対して、信号を出力する。【選択図】図２６</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgL9wzy9HNXCA4JCnUOCQ1yVfB3U3D1cXUOCfL383RWcPb3DfD3c_ULUXD0cwHy_PyAUp7-fgq-riEe_i64VPMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDIxMDcwMjMzNHY6IUAQAftjFw</recordid><startdate>20240522</startdate><enddate>20240522</enddate><creator>MAEDA SHINICHI</creator><creator>MIYASATO KEITA</creator><scope>EVB</scope></search><sort><creationdate>20240522</creationdate><title>WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT</title><author>MAEDA SHINICHI ; MIYASATO KEITA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024070266A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MAEDA SHINICHI</creatorcontrib><creatorcontrib>MIYASATO KEITA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAEDA SHINICHI</au><au>MIYASATO KEITA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT</title><date>2024-05-22</date><risdate>2024</risdate><abstract>To reduce transmission loss in large-capacity, high-speed transmission systems, and furthermore, to improve the heat dissipation of a substrate.SOLUTION: In a wiring structure 1 of electronic components, a flexible wiring element 4 having conductive wiring portions formed on the surface of a protrusion protruding in a direction different from a height direction of a side surface among the surfaces of a third electronic component included in any of one or more electronic components, which is further stacked and installed on a first electronic component installed on a substrate and electrically connected to the substrate, is arranged apart from the substrate, and the wiring portion in the flexible wiring element 4 is electrically connected with the third electronic component. The third electronic component outputs signals to one other electronic component via the substrate and the flexible wiring element 4.SELECTED DRAWING: Figure 26
【課題】高速大容量の高速伝送システムにおいて伝送損失の低減を図り、さらに基板の放熱性の向上を図る。【解決手段】電子部品の配線構造１は、基板上に設置され当該基板と電気的に接続される第１電子部品の上にさらに積層されて設置される、１以上の電子部品の何れかに含まれる第３電子部品の表面上のうち、側面に有する高さ方向とは異なる方向に突出した突出部の表面上に、導電性の配線部が形成された柔軟性を有する柔軟配線体４を、基板から離間して配置させ、柔軟配線体４における配線部は、第３電子部品と電気的に接続されることを特徴とする。第３電子部品は、基板と柔軟配線体４とを介して、一の他の電子部品に対して、信号を出力する。【選択図】図２６</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | WIRING STRUCTURE OF ELECTRONIC COMPONENT AND CONNECTION METHOD OF ELECTRONIC COMPONENT |
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