COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD AND COMPONENT POSITIONING METHOD
To provide a component mounting device that can simplify the procedure for positioning an electronic component at a target position.SOLUTION: On the basis of pattern design information, a mounting nozzle can hold an electronic component provided with multiple patterns on a pattern surface. A camera...
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| creator | AOIKE MASAYUKI SATAKE YOSHIAKI FUNAKI TATSUYA |
| description | To provide a component mounting device that can simplify the procedure for positioning an electronic component at a target position.SOLUTION: On the basis of pattern design information, a mounting nozzle can hold an electronic component provided with multiple patterns on a pattern surface. A camera images the pattern surface of the electronic component, and it is possible to control the mounting nozzle and a movement mechanism of the mounting nozzle. Positional relationship information 34 that shows the positional relationship based on pattern design information between the position of a registration pattern representative point identified from at least one registration pattern selected from the multiple patterns provided on the pattern surface and the position of the positioning reference point which becomes the reference for positioning when mounting the electronic component on a component mounting spot is stored. In addition, an image obtained by imaging the pattern surface of the electronic component by the camera is acquired. The image is analyzed to determine the position of the registration pattern representative point. The positioning reference point is determined from the position of the registration pattern representative point and the positional relationship information, and the electronic component is mounted at the target position.SELECTED DRAWING: Figure 5
【課題】電子部品を目標位置に位置決めする手順を簡素化することが可能な部品搭載装置を提供する。【解決手段】パターン設計情報に基づいて、パターン面に、複数のパターンが設けられた電子部品を搭載ノズルが保持可能である。カメラが電子部品のパターン面の撮影を行い、搭載ノズル及び搭載ノズルの移動機構を制御可能である。パターン面に設けられた複数のパターンから選択された少なくとも１つの登録パターンから特定される登録パターン代表点の位置と、電子部品を部品搭載場所に搭載するときの位置決めの基準となる位置決め基準点の位置との、パターン設計情報に基づく位置関係を示す位置関係情報３４を記憶する。さらに、電子部品のパターン面をカメラで撮影した画像を取得する。画像を解析して、登録パターン代表点の位置を求める。登録パターン代表点の位置と位置関係情報とから位置決め基準点を求め、目標位置に電子部品を搭載する。【選択図】図５ |
| format | Patent |
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【課題】電子部品を目標位置に位置決めする手順を簡素化することが可能な部品搭載装置を提供する。【解決手段】パターン設計情報に基づいて、パターン面に、複数のパターンが設けられた電子部品を搭載ノズルが保持可能である。カメラが電子部品のパターン面の撮影を行い、搭載ノズル及び搭載ノズルの移動機構を制御可能である。パターン面に設けられた複数のパターンから選択された少なくとも１つの登録パターンから特定される登録パターン代表点の位置と、電子部品を部品搭載場所に搭載するときの位置決めの基準となる位置決め基準点の位置との、パターン設計情報に基づく位置関係を示す位置関係情報３４を記憶する。さらに、電子部品のパターン面をカメラで撮影した画像を取得する。画像を解析して、登録パターン代表点の位置を求める。登録パターン代表点の位置と位置関係情報とから位置決め基準点を求め、目標位置に電子部品を搭載する。【選択図】図５</description><language>eng ; jpn</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; PRINTED CIRCUITS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240520&DB=EPODOC&CC=JP&NR=2024068395A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240520&DB=EPODOC&CC=JP&NR=2024068395A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOIKE MASAYUKI</creatorcontrib><creatorcontrib>SATAKE YOSHIAKI</creatorcontrib><creatorcontrib>FUNAKI TATSUYA</creatorcontrib><title>COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD AND COMPONENT POSITIONING METHOD</title><description>To provide a component mounting device that can simplify the procedure for positioning an electronic component at a target position.SOLUTION: On the basis of pattern design information, a mounting nozzle can hold an electronic component provided with multiple patterns on a pattern surface. A camera images the pattern surface of the electronic component, and it is possible to control the mounting nozzle and a movement mechanism of the mounting nozzle. Positional relationship information 34 that shows the positional relationship based on pattern design information between the position of a registration pattern representative point identified from at least one registration pattern selected from the multiple patterns provided on the pattern surface and the position of the positioning reference point which becomes the reference for positioning when mounting the electronic component on a component mounting spot is stored. In addition, an image obtained by imaging the pattern surface of the electronic component by the camera is acquired. The image is analyzed to determine the position of the registration pattern representative point. The positioning reference point is determined from the position of the registration pattern representative point and the positional relationship information, and the electronic component is mounted at the target position.SELECTED DRAWING: Figure 5
【課題】電子部品を目標位置に位置決めする手順を簡素化することが可能な部品搭載装置を提供する。【解決手段】パターン設計情報に基づいて、パターン面に、複数のパターンが設けられた電子部品を搭載ノズルが保持可能である。カメラが電子部品のパターン面の撮影を行い、搭載ノズル及び搭載ノズルの移動機構を制御可能である。パターン面に設けられた複数のパターンから選択された少なくとも１つの登録パターンから特定される登録パターン代表点の位置と、電子部品を部品搭載場所に搭載するときの位置決めの基準となる位置決め基準点の位置との、パターン設計情報に基づく位置関係を示す位置関係情報３４を記憶する。さらに、電子部品のパターン面をカメラで撮影した画像を取得する。画像を解析して、登録パターン代表点の位置を求める。登録パターン代表点の位置と位置関係情報とから位置決め基準点を求め、目標位置に電子部品を搭載する。【選択図】図５</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh19vcN8Pdz9QtR8PUP9Qvx9HNXcHEN83R21VHAIuXrGuLh76Lg6OeCJBvgH-wZ4unvh1DAw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDIxMDMwsjC1NHY2JUgQA_ZkxXQ</recordid><startdate>20240520</startdate><enddate>20240520</enddate><creator>AOIKE MASAYUKI</creator><creator>SATAKE YOSHIAKI</creator><creator>FUNAKI TATSUYA</creator><scope>EVB</scope></search><sort><creationdate>20240520</creationdate><title>COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD AND COMPONENT POSITIONING METHOD</title><author>AOIKE MASAYUKI ; SATAKE YOSHIAKI ; FUNAKI TATSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024068395A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>AOIKE MASAYUKI</creatorcontrib><creatorcontrib>SATAKE YOSHIAKI</creatorcontrib><creatorcontrib>FUNAKI TATSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AOIKE MASAYUKI</au><au>SATAKE YOSHIAKI</au><au>FUNAKI TATSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD AND COMPONENT POSITIONING METHOD</title><date>2024-05-20</date><risdate>2024</risdate><abstract>To provide a component mounting device that can simplify the procedure for positioning an electronic component at a target position.SOLUTION: On the basis of pattern design information, a mounting nozzle can hold an electronic component provided with multiple patterns on a pattern surface. A camera images the pattern surface of the electronic component, and it is possible to control the mounting nozzle and a movement mechanism of the mounting nozzle. Positional relationship information 34 that shows the positional relationship based on pattern design information between the position of a registration pattern representative point identified from at least one registration pattern selected from the multiple patterns provided on the pattern surface and the position of the positioning reference point which becomes the reference for positioning when mounting the electronic component on a component mounting spot is stored. In addition, an image obtained by imaging the pattern surface of the electronic component by the camera is acquired. The image is analyzed to determine the position of the registration pattern representative point. The positioning reference point is determined from the position of the registration pattern representative point and the positional relationship information, and the electronic component is mounted at the target position.SELECTED DRAWING: Figure 5
【課題】電子部品を目標位置に位置決めする手順を簡素化することが可能な部品搭載装置を提供する。【解決手段】パターン設計情報に基づいて、パターン面に、複数のパターンが設けられた電子部品を搭載ノズルが保持可能である。カメラが電子部品のパターン面の撮影を行い、搭載ノズル及び搭載ノズルの移動機構を制御可能である。パターン面に設けられた複数のパターンから選択された少なくとも１つの登録パターンから特定される登録パターン代表点の位置と、電子部品を部品搭載場所に搭載するときの位置決めの基準となる位置決め基準点の位置との、パターン設計情報に基づく位置関係を示す位置関係情報３４を記憶する。さらに、電子部品のパターン面をカメラで撮影した画像を取得する。画像を解析して、登録パターン代表点の位置を求める。登録パターン代表点の位置と位置関係情報とから位置決め基準点を求め、目標位置に電子部品を搭載する。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS TESTING |
| title | COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD AND COMPONENT POSITIONING METHOD |
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