SUBSTRATE PROCESSING DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND PROGRAM

To provide a substrate processing device, a manufacturing method for a semiconductor device, a substrate processing method, and a program to shorten the cooling time of an insulation part.SOLUTION: The substrate processing device includes a processing chamber 21 for processing a substrate, a lid that closes a lower opening of the processing chamber, an elevator for moving the lid up and down, a heat insulating part 33 that is installed between the lid and the substrate and has a cylindrical part formed in the shape of a tube with a closed upper end, and a cooling gas supply part 44 that supplies purge gas from a discharge port in the cylindrical part to purge the inside of the insulation part while the lid is closing the opening and supplies cooling gas from the discharge port when the lid is not blocking the opening to cool the insulation part.SELECTED DRAWING: Figure 2 【課題】断熱部の冷却時間を短縮させる基板処理装置、半導体装置の製造方法、基板処理方法及びプログラムを提供する。【解決手段】基板処理装置は、基板を処理する処理室２１と、処理室の下方の開口を閉塞する蓋と、該蓋を上下に移動させるエレベータと、蓋と基板との間に設置され、上端が閉塞した筒形状に形成された筒部を備えた断熱部３３と、蓋が開口を閉塞している状態で筒部内の吐出口からパージガスを供給して断熱部内をパージし、且つ、蓋が開口を閉塞していない状態で吐出口から冷却ガスを供給して前記断熱部を冷却する冷却ガス供給部４４と、を備える。【選択図】図２