GOLD POWDER, PRODUCTION METHOD OF THE SAME, AND GOLD PASTE
To provide gold powder and a gold paste which are subjected to various processes such as, joining, electrode formation, encapsulation and the like, the gold powder and gold paste being improved in characteristics, and to provide a production method.SOLUTION: There is provided gold powder whose purit...
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| creator | INOUE KENICHI OKADA YOHEI NAKAMURA NORIAKI MAKITA YUICHI SHIRATORI HARUKI MURAI HIROSHI KOIZUMI TERUAKI KAMIYA HIDEHIRO OGAWA KOHEI |
| description | To provide gold powder and a gold paste which are subjected to various processes such as, joining, electrode formation, encapsulation and the like, the gold powder and gold paste being improved in characteristics, and to provide a production method.SOLUTION: There is provided gold powder whose purity is 99.9 mass% or more, the gold powder has an average particle diameter of 0.1 μm or more and 0.5 μm or less, and a variation coefficient of the particle diameter is 18% or less. The gold powder of the invention is formed by a wet reduction method including: a gold colloid synthesizing step for mixing in a solvent, a gold salt, a reductant, and a dispersant, for synthesizing gold colloid particles; and a gold powder granulating step for adding the gold salt and the reductant to a reaction solution including the gold colloid particles which are generated in the gold colloid synthesis, for making the gold colloid particles into gold powder. As the dispersant mixed in the gold colloid synthesizing step, a dispersant including a surfactant which includes an alkyl group having C16-C18, is applied.SELECTED DRAWING: Figure 2
【課題】接合・電極形成・封止等の各種プロセスに供される金粉末及び金ペーストに関し、より特性改善がなされたもの及びその製造方法を提供する。【解決手段】本発明は、純度９９．９質量％以上の金からなる金粉末において、 平均粒子径が０．１μｍ以上０．５μｍ以下であり、且つ、粒子径の変動係数が１８％以下であることを特徴とする金粉末である。本発明に係る金粉末は、溶媒中で金塩と還元剤と分散剤とを混合することで金コロイド粒子を合成する金コロイド合成工程と、前記金コロイド合成で生成した前記金コロイド粒子を含む反応液に、金塩と還元剤とを添加し、前記金コロイド粒子を金粉末とする金粉末造粒工程とを含む湿式還元法で製造される。そして、前記金コロイド合成工程で混合する分散剤として、炭素数が１６以上１８以下のアルキル基を有する界面活性剤を含む分散剤を適用する。【選択図】図２ |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2024065140A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2024065140A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2024065140A3</originalsourceid><addsrcrecordid>eNrjZLBy9_dxUQjwD3dxDdJRCAjydwl1DvH091PwdQ3x8HdR8HdTCPFwVQh29HXVUXD0c1GAqHcMDnHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkYmBmamhiYGjsZEKQIAxAIozg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GOLD POWDER, PRODUCTION METHOD OF THE SAME, AND GOLD PASTE</title><source>esp@cenet</source><creator>INOUE KENICHI ; OKADA YOHEI ; NAKAMURA NORIAKI ; MAKITA YUICHI ; SHIRATORI HARUKI ; MURAI HIROSHI ; KOIZUMI TERUAKI ; KAMIYA HIDEHIRO ; OGAWA KOHEI</creator><creatorcontrib>INOUE KENICHI ; OKADA YOHEI ; NAKAMURA NORIAKI ; MAKITA YUICHI ; SHIRATORI HARUKI ; MURAI HIROSHI ; KOIZUMI TERUAKI ; KAMIYA HIDEHIRO ; OGAWA KOHEI</creatorcontrib><description>To provide gold powder and a gold paste which are subjected to various processes such as, joining, electrode formation, encapsulation and the like, the gold powder and gold paste being improved in characteristics, and to provide a production method.SOLUTION: There is provided gold powder whose purity is 99.9 mass% or more, the gold powder has an average particle diameter of 0.1 μm or more and 0.5 μm or less, and a variation coefficient of the particle diameter is 18% or less. The gold powder of the invention is formed by a wet reduction method including: a gold colloid synthesizing step for mixing in a solvent, a gold salt, a reductant, and a dispersant, for synthesizing gold colloid particles; and a gold powder granulating step for adding the gold salt and the reductant to a reaction solution including the gold colloid particles which are generated in the gold colloid synthesis, for making the gold colloid particles into gold powder. As the dispersant mixed in the gold colloid synthesizing step, a dispersant including a surfactant which includes an alkyl group having C16-C18, is applied.SELECTED DRAWING: Figure 2
【課題】接合・電極形成・封止等の各種プロセスに供される金粉末及び金ペーストに関し、より特性改善がなされたもの及びその製造方法を提供する。【解決手段】本発明は、純度９９．９質量％以上の金からなる金粉末において、 平均粒子径が０．１μｍ以上０．５μｍ以下であり、且つ、粒子径の変動係数が１８％以下であることを特徴とする金粉末である。本発明に係る金粉末は、溶媒中で金塩と還元剤と分散剤とを混合することで金コロイド粒子を合成する金コロイド合成工程と、前記金コロイド合成で生成した前記金コロイド粒子を含む反応液に、金塩と還元剤とを添加し、前記金コロイド粒子を金粉末とする金粉末造粒工程とを含む湿式還元法で製造される。そして、前記金コロイド合成工程で混合する分散剤として、炭素数が１６以上１８以下のアルキル基を有する界面活性剤を含む分散剤を適用する。【選択図】図２</description><language>eng ; jpn</language><subject>CASTING ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; PERFORMING OPERATIONS ; POWDER METALLURGY ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240515&DB=EPODOC&CC=JP&NR=2024065140A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240515&DB=EPODOC&CC=JP&NR=2024065140A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOUE KENICHI</creatorcontrib><creatorcontrib>OKADA YOHEI</creatorcontrib><creatorcontrib>NAKAMURA NORIAKI</creatorcontrib><creatorcontrib>MAKITA YUICHI</creatorcontrib><creatorcontrib>SHIRATORI HARUKI</creatorcontrib><creatorcontrib>MURAI HIROSHI</creatorcontrib><creatorcontrib>KOIZUMI TERUAKI</creatorcontrib><creatorcontrib>KAMIYA HIDEHIRO</creatorcontrib><creatorcontrib>OGAWA KOHEI</creatorcontrib><title>GOLD POWDER, PRODUCTION METHOD OF THE SAME, AND GOLD PASTE</title><description>To provide gold powder and a gold paste which are subjected to various processes such as, joining, electrode formation, encapsulation and the like, the gold powder and gold paste being improved in characteristics, and to provide a production method.SOLUTION: There is provided gold powder whose purity is 99.9 mass% or more, the gold powder has an average particle diameter of 0.1 μm or more and 0.5 μm or less, and a variation coefficient of the particle diameter is 18% or less. The gold powder of the invention is formed by a wet reduction method including: a gold colloid synthesizing step for mixing in a solvent, a gold salt, a reductant, and a dispersant, for synthesizing gold colloid particles; and a gold powder granulating step for adding the gold salt and the reductant to a reaction solution including the gold colloid particles which are generated in the gold colloid synthesis, for making the gold colloid particles into gold powder. As the dispersant mixed in the gold colloid synthesizing step, a dispersant including a surfactant which includes an alkyl group having C16-C18, is applied.SELECTED DRAWING: Figure 2
【課題】接合・電極形成・封止等の各種プロセスに供される金粉末及び金ペーストに関し、より特性改善がなされたもの及びその製造方法を提供する。【解決手段】本発明は、純度９９．９質量％以上の金からなる金粉末において、 平均粒子径が０．１μｍ以上０．５μｍ以下であり、且つ、粒子径の変動係数が１８％以下であることを特徴とする金粉末である。本発明に係る金粉末は、溶媒中で金塩と還元剤と分散剤とを混合することで金コロイド粒子を合成する金コロイド合成工程と、前記金コロイド合成で生成した前記金コロイド粒子を含む反応液に、金塩と還元剤とを添加し、前記金コロイド粒子を金粉末とする金粉末造粒工程とを含む湿式還元法で製造される。そして、前記金コロイド合成工程で混合する分散剤として、炭素数が１６以上１８以下のアルキル基を有する界面活性剤を含む分散剤を適用する。【選択図】図２</description><subject>CASTING</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBy9_dxUQjwD3dxDdJRCAjydwl1DvH091PwdQ3x8HdR8HdTCPFwVQh29HXVUXD0c1GAqHcMDnHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkYmBmamhiYGjsZEKQIAxAIozg</recordid><startdate>20240515</startdate><enddate>20240515</enddate><creator>INOUE KENICHI</creator><creator>OKADA YOHEI</creator><creator>NAKAMURA NORIAKI</creator><creator>MAKITA YUICHI</creator><creator>SHIRATORI HARUKI</creator><creator>MURAI HIROSHI</creator><creator>KOIZUMI TERUAKI</creator><creator>KAMIYA HIDEHIRO</creator><creator>OGAWA KOHEI</creator><scope>EVB</scope></search><sort><creationdate>20240515</creationdate><title>GOLD POWDER, PRODUCTION METHOD OF THE SAME, AND GOLD PASTE</title><author>INOUE KENICHI ; OKADA YOHEI ; NAKAMURA NORIAKI ; MAKITA YUICHI ; SHIRATORI HARUKI ; MURAI HIROSHI ; KOIZUMI TERUAKI ; KAMIYA HIDEHIRO ; OGAWA KOHEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024065140A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CASTING</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>INOUE KENICHI</creatorcontrib><creatorcontrib>OKADA YOHEI</creatorcontrib><creatorcontrib>NAKAMURA NORIAKI</creatorcontrib><creatorcontrib>MAKITA YUICHI</creatorcontrib><creatorcontrib>SHIRATORI HARUKI</creatorcontrib><creatorcontrib>MURAI HIROSHI</creatorcontrib><creatorcontrib>KOIZUMI TERUAKI</creatorcontrib><creatorcontrib>KAMIYA HIDEHIRO</creatorcontrib><creatorcontrib>OGAWA KOHEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INOUE KENICHI</au><au>OKADA YOHEI</au><au>NAKAMURA NORIAKI</au><au>MAKITA YUICHI</au><au>SHIRATORI HARUKI</au><au>MURAI HIROSHI</au><au>KOIZUMI TERUAKI</au><au>KAMIYA HIDEHIRO</au><au>OGAWA KOHEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GOLD POWDER, PRODUCTION METHOD OF THE SAME, AND GOLD PASTE</title><date>2024-05-15</date><risdate>2024</risdate><abstract>To provide gold powder and a gold paste which are subjected to various processes such as, joining, electrode formation, encapsulation and the like, the gold powder and gold paste being improved in characteristics, and to provide a production method.SOLUTION: There is provided gold powder whose purity is 99.9 mass% or more, the gold powder has an average particle diameter of 0.1 μm or more and 0.5 μm or less, and a variation coefficient of the particle diameter is 18% or less. The gold powder of the invention is formed by a wet reduction method including: a gold colloid synthesizing step for mixing in a solvent, a gold salt, a reductant, and a dispersant, for synthesizing gold colloid particles; and a gold powder granulating step for adding the gold salt and the reductant to a reaction solution including the gold colloid particles which are generated in the gold colloid synthesis, for making the gold colloid particles into gold powder. As the dispersant mixed in the gold colloid synthesizing step, a dispersant including a surfactant which includes an alkyl group having C16-C18, is applied.SELECTED DRAWING: Figure 2
【課題】接合・電極形成・封止等の各種プロセスに供される金粉末及び金ペーストに関し、より特性改善がなされたもの及びその製造方法を提供する。【解決手段】本発明は、純度９９．９質量％以上の金からなる金粉末において、 平均粒子径が０．１μｍ以上０．５μｍ以下であり、且つ、粒子径の変動係数が１８％以下であることを特徴とする金粉末である。本発明に係る金粉末は、溶媒中で金塩と還元剤と分散剤とを混合することで金コロイド粒子を合成する金コロイド合成工程と、前記金コロイド合成で生成した前記金コロイド粒子を含む反応液に、金塩と還元剤とを添加し、前記金コロイド粒子を金粉末とする金粉末造粒工程とを含む湿式還元法で製造される。そして、前記金コロイド合成工程で混合する分散剤として、炭素数が１６以上１８以下のアルキル基を有する界面活性剤を含む分散剤を適用する。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING WORKING METALLIC POWDER |
| title | GOLD POWDER, PRODUCTION METHOD OF THE SAME, AND GOLD PASTE |
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