WATER-PROOF STRUCTURE OF HOUSING AND METHOD FOR MANUFACTURING PACKING
To provide a water-proof structure which is desirable for a relatively large housing and can improve the quality and design of a product.SOLUTION: A housing formed by joining a plurality of case bodies together includes: an inner arrangement member attached to the inside of the housing; and a packin...
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| creator | ICHIHASHI RYOGO TAKAO AKIRA |
| description | To provide a water-proof structure which is desirable for a relatively large housing and can improve the quality and design of a product.SOLUTION: A housing formed by joining a plurality of case bodies together includes: an inner arrangement member attached to the inside of the housing; and a packing formed in a round shape to be arranged along the boundary of joint of the case bodies. The packing is pressed against the case bodies along the joint boundary part by the inner arrangement member.SELECTED DRAWING: Figure 7
【課題】比較的大型の筐体にも好適で製品品質や意匠性の向上を可能とする防水構造の提供。【解決手段】複数のケース体が接合されて形成される筐体内において、筐体内に取り付けられる内部配置部材と、複数のケース体の接合境界に沿って配置可能な環状に形成されるパッキンとを備える。そして内部配置部材によってパッキンが接合境界箇所に沿って複数のケース体に押しつけられる構造とする。【選択図】図７ |
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【課題】比較的大型の筐体にも好適で製品品質や意匠性の向上を可能とする防水構造の提供。【解決手段】複数のケース体が接合されて形成される筐体内において、筐体内に取り付けられる内部配置部材と、複数のケース体の接合境界に沿って配置可能な環状に形成されるパッキンとを備える。そして内部配置部材によってパッキンが接合境界箇所に沿って複数のケース体に押しつけられる構造とする。【選択図】図７</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240425&DB=EPODOC&CC=JP&NR=2024057905A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240425&DB=EPODOC&CC=JP&NR=2024057905A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHIHASHI RYOGO</creatorcontrib><creatorcontrib>TAKAO AKIRA</creatorcontrib><title>WATER-PROOF STRUCTURE OF HOUSING AND METHOD FOR MANUFACTURING PACKING</title><description>To provide a water-proof structure which is desirable for a relatively large housing and can improve the quality and design of a product.SOLUTION: A housing formed by joining a plurality of case bodies together includes: an inner arrangement member attached to the inside of the housing; and a packing formed in a round shape to be arranged along the boundary of joint of the case bodies. The packing is pressed against the case bodies along the joint boundary part by the inner arrangement member.SELECTED DRAWING: Figure 7
【課題】比較的大型の筐体にも好適で製品品質や意匠性の向上を可能とする防水構造の提供。【解決手段】複数のケース体が接合されて形成される筐体内において、筐体内に取り付けられる内部配置部材と、複数のケース体の接合境界に沿って配置可能な環状に形成されるパッキンとを備える。そして内部配置部材によってパッキンが接合境界箇所に沿って複数のケース体に押しつけられる構造とする。【選択図】図７</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHANdwxxDdINCPL3d1MIDgkKdQ4JDXJVAHI8_EODPf3cFRz9XBR8XUM8_F0U3PyDFHwd_ULdHEGqQJIBjs7eQJqHgTUtMac4lRdKczMoubmGOHvophbkx6cWFyQmp-allsR7BRgZGJkYmJpbGpg6GhOlCAD1Dyyp</recordid><startdate>20240425</startdate><enddate>20240425</enddate><creator>ICHIHASHI RYOGO</creator><creator>TAKAO AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20240425</creationdate><title>WATER-PROOF STRUCTURE OF HOUSING AND METHOD FOR MANUFACTURING PACKING</title><author>ICHIHASHI RYOGO ; TAKAO AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024057905A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ICHIHASHI RYOGO</creatorcontrib><creatorcontrib>TAKAO AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ICHIHASHI RYOGO</au><au>TAKAO AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WATER-PROOF STRUCTURE OF HOUSING AND METHOD FOR MANUFACTURING PACKING</title><date>2024-04-25</date><risdate>2024</risdate><abstract>To provide a water-proof structure which is desirable for a relatively large housing and can improve the quality and design of a product.SOLUTION: A housing formed by joining a plurality of case bodies together includes: an inner arrangement member attached to the inside of the housing; and a packing formed in a round shape to be arranged along the boundary of joint of the case bodies. The packing is pressed against the case bodies along the joint boundary part by the inner arrangement member.SELECTED DRAWING: Figure 7
【課題】比較的大型の筐体にも好適で製品品質や意匠性の向上を可能とする防水構造の提供。【解決手段】複数のケース体が接合されて形成される筐体内において、筐体内に取り付けられる内部配置部材と、複数のケース体の接合境界に沿って配置可能な環状に形成されるパッキンとを備える。そして内部配置部材によってパッキンが接合境界箇所に沿って複数のケース体に押しつけられる構造とする。【選択図】図７</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | WATER-PROOF STRUCTURE OF HOUSING AND METHOD FOR MANUFACTURING PACKING |
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