POLISHING PAD AND MANUFACTURING METHOD OF THE SAME

To provide a polishing pad which has high stability of a temporal polishing rate, and excellent rise performance of the polishing rate, and a manufacturing method of the same.SOLUTION: A polishing pad includes a polyurethane resin sheet which is formed by a wet type film-forming method and includes...

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Bibliographische Detailangaben
Hauptverfasser: MIYAUCHI YOSHIKI, KIRAKU YOSHIE, NAKAMURA YUI, TEI WIN
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a polishing pad which has high stability of a temporal polishing rate, and excellent rise performance of the polishing rate, and a manufacturing method of the same.SOLUTION: A polishing pad includes a polyurethane resin sheet which is formed by a wet type film-forming method and includes a plurality of communication bubbles therein, as a polishing layer, wherein when abundance ratios of three components of a crystal phase, an intermediate phase and an amorphous phase, which are determined by a pulse NMR, are represented by A1, A2 and A3 (%), the polishing layer satisfies the following conditions: (i) a difference (A2wet-A2dry) of an intermediate phase component abundance ratio A2wet (%) when wetted to an intermediate phase component abundance ratio A2dry (%) when dried of -20% or more, and (ii) a difference (A3wet-A3dry) of an amorphous phase component abundance ratio A3wet (%) when wetted to an amorphous phase component abundance ratio A3dry (%) when dried and of 30% or less.SELECTED DRAWING: None 【課題】経時的な研磨レートの安定性が高く、また研磨レートの立ち上がり性能に優れた研磨パッド及びその製造方法を提供すること。【解決手段】湿式成膜法により形成され、複数の連通気泡が内在するポリウレタン樹脂シートを研磨層として含む研磨パッドであって、前記研磨層は、パルスNMRにより決定される、結晶相、中間相、非晶相の3成分の存在比をそれぞれA1、A2、A3(%)とした場合において、次の条件:(i) 乾燥時の中間相成分存在比A2dry(%)に対する湿潤時の中間相成分存在比A2wet(%)の差(A2wet-A2dry)が-20%以上、(ii) 乾燥時の非晶相成分存在比A3dry(%)に対する湿潤時の非晶相成分存在比A3wet(%)の差(A3wet-A3dry)が30%以下、を満たす研磨パッド。【選択図】なし