SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS THEREOF
To provide a substrate heating apparatus and a substrate processing apparatus using the same, and more specifically, a substrate heating apparatus having an improved structure so as to efficiently cool a terminal block, and a substrate processing apparatus using the same.SOLUTION: A substrate heatin...
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| creator | YUN KANG SEOP LEE YOUNG IL SONG SOO HAN KANG MIN OK CHOI JUNG BONG |
| description | To provide a substrate heating apparatus and a substrate processing apparatus using the same, and more specifically, a substrate heating apparatus having an improved structure so as to efficiently cool a terminal block, and a substrate processing apparatus using the same.SOLUTION: A substrate heating apparatus according to the present invention that heats a substrate includes a heating unit that is a heat source disposed below the substrate, a cooling plate disposed below the heating unit and providing cold air, and a terminal block that supplies power to the heating unit and whose lower end is in contact with the cooling plate.SELECTED DRAWING: Figure 2
【課題】基板加熱装置及びそれを用いた基板処理装置に係り、さらに詳しくは、端子台を効率よく冷却することができるように構造が改善された基板加熱装置、及びそれを用いた基板処理装置に関する。【解決手段】本発明は、基板を加熱するための基板加熱装置であって、前記基板の下部に配置される熱源である加熱部と、前記加熱部の下方に配置され、冷気を提供する冷却プレートと、前記加熱部に電力を供給し、下端部が前記冷却プレートと接する端子台と、を備えることを特徴とする、基板加熱装置を提供する。【選択図】図２ |
| format | Patent |
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【課題】基板加熱装置及びそれを用いた基板処理装置に係り、さらに詳しくは、端子台を効率よく冷却することができるように構造が改善された基板加熱装置、及びそれを用いた基板処理装置に関する。【解決手段】本発明は、基板を加熱するための基板加熱装置であって、前記基板の下部に配置される熱源である加熱部と、前記加熱部の下方に配置され、冷気を提供する冷却プレートと、前記加熱部に電力を供給し、下端部が前記冷却プレートと接する端子台と、を備えることを特徴とする、基板加熱装置を提供する。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240329&DB=EPODOC&CC=JP&NR=2024043452A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240329&DB=EPODOC&CC=JP&NR=2024043452A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUN KANG SEOP</creatorcontrib><creatorcontrib>LEE YOUNG IL</creatorcontrib><creatorcontrib>SONG SOO HAN</creatorcontrib><creatorcontrib>KANG MIN OK</creatorcontrib><creatorcontrib>CHOI JUNG BONG</creatorcontrib><title>SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS THEREOF</title><description>To provide a substrate heating apparatus and a substrate processing apparatus using the same, and more specifically, a substrate heating apparatus having an improved structure so as to efficiently cool a terminal block, and a substrate processing apparatus using the same.SOLUTION: A substrate heating apparatus according to the present invention that heats a substrate includes a heating unit that is a heat source disposed below the substrate, a cooling plate disposed below the heating unit and providing cold air, and a terminal block that supplies power to the heating unit and whose lower end is in contact with the cooling plate.SELECTED DRAWING: Figure 2
【課題】基板加熱装置及びそれを用いた基板処理装置に係り、さらに詳しくは、端子台を効率よく冷却することができるように構造が改善された基板加熱装置、及びそれを用いた基板処理装置に関する。【解決手段】本発明は、基板を加熱するための基板加熱装置であって、前記基板の下部に配置される熱源である加熱部と、前記加熱部の下方に配置され、冷気を提供する冷却プレートと、前記加熱部に電力を供給し、下端部が前記冷却プレートと接する端子台と、を備えることを特徴とする、基板加熱装置を提供する。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALDnUKDglyDHFV8HB1DPH0c1dwDAhwBAqEBis4-rkoIOQDgvydXYODUZWEeLgGufq78TCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMjEwMTYxNTI0djohQBAEEwLS4</recordid><startdate>20240329</startdate><enddate>20240329</enddate><creator>YUN KANG SEOP</creator><creator>LEE YOUNG IL</creator><creator>SONG SOO HAN</creator><creator>KANG MIN OK</creator><creator>CHOI JUNG BONG</creator><scope>EVB</scope></search><sort><creationdate>20240329</creationdate><title>SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS THEREOF</title><author>YUN KANG SEOP ; LEE YOUNG IL ; SONG SOO HAN ; KANG MIN OK ; CHOI JUNG BONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024043452A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YUN KANG SEOP</creatorcontrib><creatorcontrib>LEE YOUNG IL</creatorcontrib><creatorcontrib>SONG SOO HAN</creatorcontrib><creatorcontrib>KANG MIN OK</creatorcontrib><creatorcontrib>CHOI JUNG BONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUN KANG SEOP</au><au>LEE YOUNG IL</au><au>SONG SOO HAN</au><au>KANG MIN OK</au><au>CHOI JUNG BONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS THEREOF</title><date>2024-03-29</date><risdate>2024</risdate><abstract>To provide a substrate heating apparatus and a substrate processing apparatus using the same, and more specifically, a substrate heating apparatus having an improved structure so as to efficiently cool a terminal block, and a substrate processing apparatus using the same.SOLUTION: A substrate heating apparatus according to the present invention that heats a substrate includes a heating unit that is a heat source disposed below the substrate, a cooling plate disposed below the heating unit and providing cold air, and a terminal block that supplies power to the heating unit and whose lower end is in contact with the cooling plate.SELECTED DRAWING: Figure 2
【課題】基板加熱装置及びそれを用いた基板処理装置に係り、さらに詳しくは、端子台を効率よく冷却することができるように構造が改善された基板加熱装置、及びそれを用いた基板処理装置に関する。【解決手段】本発明は、基板を加熱するための基板加熱装置であって、前記基板の下部に配置される熱源である加熱部と、前記加熱部の下方に配置され、冷気を提供する冷却プレートと、前記加熱部に電力を供給し、下端部が前記冷却プレートと接する端子台と、を備えることを特徴とする、基板加熱装置を提供する。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS THEREOF |
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