SUBSTRATE PROCESSING DEVICE AND BUBBLE REMOVING METHOD FOR FILTER
To provide a substrate processing device capable of suppressing a filter exchange frequency of a filter, and a bubble removing method for a filter.SOLUTION: A substrate processing device 100 includes a substrate processing unit 10, a pipe 32, a filter 141, an upstream side pipe 151, a downstream sid...
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| creator | NAGAO TAKASHI ISHIKAWA HIDEKAZU FUJII SADAMU TENG POH LING DOBASHI YUYA |
| description | To provide a substrate processing device capable of suppressing a filter exchange frequency of a filter, and a bubble removing method for a filter.SOLUTION: A substrate processing device 100 includes a substrate processing unit 10, a pipe 32, a filter 141, an upstream side pipe 151, a downstream side pipe 161, and a removing liquid supply part 165. The substrate processing unit 10 processes a substrate W. The pipe 32 feeds process liquid to the substrate processing unit 10. The filter 141 is disposed in the pipe 32. The upstream side pipe 151 is connected to the pipe 32 on an upstream side of the filter 141. The downstream side pipe 161 is connected to the pipe 32 on a downstream side of the filter 141. The removing liquid supply part 165 supplies bubble removing liquid to one of the upstream side pipe 151 and the downstream side pipe 161. The substrate processing device 100 makes the bubble removing liquid pass from one of the upstream side pipe 151 and the downstream side pipe 161 to the other of the upstream side pipe 151 and the downstream side pipe 161 via the filter 141.SELECTED DRAWING: Figure 3
【課題】フィルタの交換頻度を抑えることが可能な基板処理装置とフィルタの気泡除去方法とを提供する。【解決手段】基板処理装置１００は、基板処理ユニット１０と、配管３２と、フィルタ１４１と、上流側配管１５１と、下流側配管１６１と、除去液供給部１６５とを備える。基板処理ユニット１０は、基板Ｗを処理する。配管３２は、基板処理ユニット１０に処理液を流通する。フィルタ１４１は、配管３２に配置される。上流側配管１５１は、フィルタ１４１の上流側で配管３２に接続される。下流側配管１６１は、フィルタ１４１の下流側で配管３２に接続される。除去液供給部１６５は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方に供給する。基板処理装置１００は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方から、フィルタ１４１を介して上流側配管１５１および下流側配管１６１の他方に通過させる。【選択図】図３ |
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【課題】フィルタの交換頻度を抑えることが可能な基板処理装置とフィルタの気泡除去方法とを提供する。【解決手段】基板処理装置１００は、基板処理ユニット１０と、配管３２と、フィルタ１４１と、上流側配管１５１と、下流側配管１６１と、除去液供給部１６５とを備える。基板処理ユニット１０は、基板Ｗを処理する。配管３２は、基板処理ユニット１０に処理液を流通する。フィルタ１４１は、配管３２に配置される。上流側配管１５１は、フィルタ１４１の上流側で配管３２に接続される。下流側配管１６１は、フィルタ１４１の下流側で配管３２に接続される。除去液供給部１６５は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方に供給する。基板処理装置１００は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方から、フィルタ１４１を介して上流側配管１５１および下流側配管１６１の他方に通過させる。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240328&DB=EPODOC&CC=JP&NR=2024042242A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240328&DB=EPODOC&CC=JP&NR=2024042242A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAO TAKASHI</creatorcontrib><creatorcontrib>ISHIKAWA HIDEKAZU</creatorcontrib><creatorcontrib>FUJII SADAMU</creatorcontrib><creatorcontrib>TENG POH LING</creatorcontrib><creatorcontrib>DOBASHI YUYA</creatorcontrib><title>SUBSTRATE PROCESSING DEVICE AND BUBBLE REMOVING METHOD FOR FILTER</title><description>To provide a substrate processing device capable of suppressing a filter exchange frequency of a filter, and a bubble removing method for a filter.SOLUTION: A substrate processing device 100 includes a substrate processing unit 10, a pipe 32, a filter 141, an upstream side pipe 151, a downstream side pipe 161, and a removing liquid supply part 165. The substrate processing unit 10 processes a substrate W. The pipe 32 feeds process liquid to the substrate processing unit 10. The filter 141 is disposed in the pipe 32. The upstream side pipe 151 is connected to the pipe 32 on an upstream side of the filter 141. The downstream side pipe 161 is connected to the pipe 32 on a downstream side of the filter 141. The removing liquid supply part 165 supplies bubble removing liquid to one of the upstream side pipe 151 and the downstream side pipe 161. The substrate processing device 100 makes the bubble removing liquid pass from one of the upstream side pipe 151 and the downstream side pipe 161 to the other of the upstream side pipe 151 and the downstream side pipe 161 via the filter 141.SELECTED DRAWING: Figure 3
【課題】フィルタの交換頻度を抑えることが可能な基板処理装置とフィルタの気泡除去方法とを提供する。【解決手段】基板処理装置１００は、基板処理ユニット１０と、配管３２と、フィルタ１４１と、上流側配管１５１と、下流側配管１６１と、除去液供給部１６５とを備える。基板処理ユニット１０は、基板Ｗを処理する。配管３２は、基板処理ユニット１０に処理液を流通する。フィルタ１４１は、配管３２に配置される。上流側配管１５１は、フィルタ１４１の上流側で配管３２に接続される。下流側配管１６１は、フィルタ１４１の下流側で配管３２に接続される。除去液供給部１６５は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方に供給する。基板処理装置１００は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方から、フィルタ１４１を介して上流側配管１５１および下流側配管１６１の他方に通過させる。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMDnUKDglyDHFVCAjyd3YNDvb0c1dwcQ3zdHZVcPRzUXAKdXLycVUIcvX1DwNJ-bqGePi7KLj5Bym4efqEuAbxMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyMTAxMjIxMjR2OiFAEALaUrRg</recordid><startdate>20240328</startdate><enddate>20240328</enddate><creator>NAGAO TAKASHI</creator><creator>ISHIKAWA HIDEKAZU</creator><creator>FUJII SADAMU</creator><creator>TENG POH LING</creator><creator>DOBASHI YUYA</creator><scope>EVB</scope></search><sort><creationdate>20240328</creationdate><title>SUBSTRATE PROCESSING DEVICE AND BUBBLE REMOVING METHOD FOR FILTER</title><author>NAGAO TAKASHI ; ISHIKAWA HIDEKAZU ; FUJII SADAMU ; TENG POH LING ; DOBASHI YUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024042242A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAO TAKASHI</creatorcontrib><creatorcontrib>ISHIKAWA HIDEKAZU</creatorcontrib><creatorcontrib>FUJII SADAMU</creatorcontrib><creatorcontrib>TENG POH LING</creatorcontrib><creatorcontrib>DOBASHI YUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAO TAKASHI</au><au>ISHIKAWA HIDEKAZU</au><au>FUJII SADAMU</au><au>TENG POH LING</au><au>DOBASHI YUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING DEVICE AND BUBBLE REMOVING METHOD FOR FILTER</title><date>2024-03-28</date><risdate>2024</risdate><abstract>To provide a substrate processing device capable of suppressing a filter exchange frequency of a filter, and a bubble removing method for a filter.SOLUTION: A substrate processing device 100 includes a substrate processing unit 10, a pipe 32, a filter 141, an upstream side pipe 151, a downstream side pipe 161, and a removing liquid supply part 165. The substrate processing unit 10 processes a substrate W. The pipe 32 feeds process liquid to the substrate processing unit 10. The filter 141 is disposed in the pipe 32. The upstream side pipe 151 is connected to the pipe 32 on an upstream side of the filter 141. The downstream side pipe 161 is connected to the pipe 32 on a downstream side of the filter 141. The removing liquid supply part 165 supplies bubble removing liquid to one of the upstream side pipe 151 and the downstream side pipe 161. The substrate processing device 100 makes the bubble removing liquid pass from one of the upstream side pipe 151 and the downstream side pipe 161 to the other of the upstream side pipe 151 and the downstream side pipe 161 via the filter 141.SELECTED DRAWING: Figure 3
【課題】フィルタの交換頻度を抑えることが可能な基板処理装置とフィルタの気泡除去方法とを提供する。【解決手段】基板処理装置１００は、基板処理ユニット１０と、配管３２と、フィルタ１４１と、上流側配管１５１と、下流側配管１６１と、除去液供給部１６５とを備える。基板処理ユニット１０は、基板Ｗを処理する。配管３２は、基板処理ユニット１０に処理液を流通する。フィルタ１４１は、配管３２に配置される。上流側配管１５１は、フィルタ１４１の上流側で配管３２に接続される。下流側配管１６１は、フィルタ１４１の下流側で配管３２に接続される。除去液供給部１６５は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方に供給する。基板処理装置１００は、気泡除去液を、上流側配管１５１および下流側配管１６１の一方から、フィルタ１４１を介して上流側配管１５１および下流側配管１６１の他方に通過させる。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| title | SUBSTRATE PROCESSING DEVICE AND BUBBLE REMOVING METHOD FOR FILTER |
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