PROCESSING DEVICE
To omit change work for a position of a suction cup of a carrier pad due to manual work of a worker by automatically adjusting the position of the suction cup.SOLUTION: A control section 120 of a cutting device (processing device) 1 performs control in such a manner that, based on an outer dimension...
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| creator | YONEYA MASANORI |
| description | To omit change work for a position of a suction cup of a carrier pad due to manual work of a worker by automatically adjusting the position of the suction cup.SOLUTION: A control section 120 of a cutting device (processing device) 1 performs control in such a manner that, based on an outer dimension which is set by an outer dimension setting section 130, a suction cup 95 and a plate 93 are settled in an interval between a pair of frame guides 41 by moving a carrier pad 92 downward, and moved in a direction of narrowing the interval of the frame guides 41, and the suction cup 95 and the plate 93 are moved close to a position corresponding to an outer dimension of a ring frame F along a rail 94 by the frame guides. Based on the outer dimension which is set by the outer dimension setting section 130, the suction cup 95 and the plate 93 are settled outside of the interval between the pair of frame guides 41 by moving the carrier pad 92 downward and moved in a direction of widening the interval of the frame guides 41, and the suction cup 95 and the plate 93 are moved separate from the position corresponding to the outer dimension of the ring frame F along the rail 94 by the frame guides 41.SELECTED DRAWING: Figure 5
【課題】搬送パッドの吸盤の位置を自動調整して作業者の手作業による吸盤の位置の変更作業を省略すること。【解決手段】切削装置（加工装置）１の制御部１２０は、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔内に吸盤９５およびフレームガイド４１を入れ、フレームガイド４１の間隔を狭める方向に移動させ、該フレームガイドで吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に接近移動させることと、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔外に吸盤９５およびプレート９３を入れ、フレームガイド４１の間隔を広げる方向に移動させ、該フレームガイド４１で吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に離間移動させること、を制御する。【選択図】図５ |
| format | Patent |
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【課題】搬送パッドの吸盤の位置を自動調整して作業者の手作業による吸盤の位置の変更作業を省略すること。【解決手段】切削装置（加工装置）１の制御部１２０は、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔内に吸盤９５およびフレームガイド４１を入れ、フレームガイド４１の間隔を狭める方向に移動させ、該フレームガイドで吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に接近移動させることと、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔外に吸盤９５およびプレート９３を入れ、フレームガイド４１の間隔を広げる方向に移動させ、該フレームガイド４１で吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に離間移動させること、を制御する。【選択図】図５</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HAND TOOLS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MANIPULATORS ; PERFORMING OPERATIONS ; POLISHING ; PORTABLE POWER-DRIVEN TOOLS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240326&DB=EPODOC&CC=JP&NR=2024040887A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240326&DB=EPODOC&CC=JP&NR=2024040887A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YONEYA MASANORI</creatorcontrib><title>PROCESSING DEVICE</title><description>To omit change work for a position of a suction cup of a carrier pad due to manual work of a worker by automatically adjusting the position of the suction cup.SOLUTION: A control section 120 of a cutting device (processing device) 1 performs control in such a manner that, based on an outer dimension which is set by an outer dimension setting section 130, a suction cup 95 and a plate 93 are settled in an interval between a pair of frame guides 41 by moving a carrier pad 92 downward, and moved in a direction of narrowing the interval of the frame guides 41, and the suction cup 95 and the plate 93 are moved close to a position corresponding to an outer dimension of a ring frame F along a rail 94 by the frame guides. Based on the outer dimension which is set by the outer dimension setting section 130, the suction cup 95 and the plate 93 are settled outside of the interval between the pair of frame guides 41 by moving the carrier pad 92 downward and moved in a direction of widening the interval of the frame guides 41, and the suction cup 95 and the plate 93 are moved separate from the position corresponding to the outer dimension of the ring frame F along the rail 94 by the frame guides 41.SELECTED DRAWING: Figure 5
【課題】搬送パッドの吸盤の位置を自動調整して作業者の手作業による吸盤の位置の変更作業を省略すること。【解決手段】切削装置（加工装置）１の制御部１２０は、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔内に吸盤９５およびフレームガイド４１を入れ、フレームガイド４１の間隔を狭める方向に移動させ、該フレームガイドで吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に接近移動させることと、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔外に吸盤９５およびプレート９３を入れ、フレームガイド４１の間隔を広げる方向に移動させ、該フレームガイド４１で吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に離間移動させること、を制御する。【選択図】図５</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHAMBERS PROVIDED WITH MANIPULATION DEVICES</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>HAND TOOLS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MANIPULATORS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>PORTABLE POWER-DRIVEN TOOLS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMCPJ3dg0O9vRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRiYGJgYWFuaOxkQpAgBcax4_</recordid><startdate>20240326</startdate><enddate>20240326</enddate><creator>YONEYA MASANORI</creator><scope>EVB</scope></search><sort><creationdate>20240326</creationdate><title>PROCESSING DEVICE</title><author>YONEYA MASANORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024040887A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHAMBERS PROVIDED WITH MANIPULATION DEVICES</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>HAND TOOLS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MANIPULATORS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>PORTABLE POWER-DRIVEN TOOLS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YONEYA MASANORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YONEYA MASANORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESSING DEVICE</title><date>2024-03-26</date><risdate>2024</risdate><abstract>To omit change work for a position of a suction cup of a carrier pad due to manual work of a worker by automatically adjusting the position of the suction cup.SOLUTION: A control section 120 of a cutting device (processing device) 1 performs control in such a manner that, based on an outer dimension which is set by an outer dimension setting section 130, a suction cup 95 and a plate 93 are settled in an interval between a pair of frame guides 41 by moving a carrier pad 92 downward, and moved in a direction of narrowing the interval of the frame guides 41, and the suction cup 95 and the plate 93 are moved close to a position corresponding to an outer dimension of a ring frame F along a rail 94 by the frame guides. Based on the outer dimension which is set by the outer dimension setting section 130, the suction cup 95 and the plate 93 are settled outside of the interval between the pair of frame guides 41 by moving the carrier pad 92 downward and moved in a direction of widening the interval of the frame guides 41, and the suction cup 95 and the plate 93 are moved separate from the position corresponding to the outer dimension of the ring frame F along the rail 94 by the frame guides 41.SELECTED DRAWING: Figure 5
【課題】搬送パッドの吸盤の位置を自動調整して作業者の手作業による吸盤の位置の変更作業を省略すること。【解決手段】切削装置（加工装置）１の制御部１２０は、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔内に吸盤９５およびフレームガイド４１を入れ、フレームガイド４１の間隔を狭める方向に移動させ、該フレームガイドで吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に接近移動させることと、外寸設定部１３０に設定された外寸をもとに、搬送パッド９２を下降させて一対のフレームガイド４１の間隔外に吸盤９５およびプレート９３を入れ、フレームガイド４１の間隔を広げる方向に移動させ、該フレームガイド４１で吸盤９５およびプレート９３をレール９４に沿ってリングフレームＦの外寸に対応する位置に離間移動させること、を制御する。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HAND TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANIPULATORS PERFORMING OPERATIONS POLISHING PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | PROCESSING DEVICE |
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