COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD, AND COMPONENT MOUNTING SYSTEM

To provide a component mounting device, a component mounting method, and a component mounting system that can appropriately detect contact between a component and a board.SOLUTION: A component mounting device includes an elevating step (ST1 to ST12) of elevating and lowering a component mounting uni...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ISHIKAWA AKIHIRO, KOSHIO TEPPEI, SONODA TOMOYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!