COMPONENT MOUNTING DEVICE, COMPONENT MOUNTING METHOD, AND COMPONENT MOUNTING SYSTEM

To provide a component mounting device, a component mounting method, and a component mounting system that can appropriately detect contact between a component and a board.SOLUTION: A component mounting device includes an elevating step (ST1 to ST12) of elevating and lowering a component mounting unit that mounts a component D to be held onto a board 2, a measurement step (ST2 to ST6) of measuring physical quantities when the component mounting unit moves up and down in the elevating and lowering step (ST1 to ST12), and a determination step (ST3, ST5) of determining contact between the component D and the board 2 on the basis of a change in measured physical quantities.SELECTED DRAWING: Figure 5 【課題】部品と基板の接触を適切に検出することができる部品装着装置および部品装着方法ならびに部品装着システムを提供する。【解決手段】部品装着方法は、保持する部品Ｄを基板２に装着する部品装着部を昇降させる昇降工程（ＳＴ１～ＳＴ１２）と、昇降工程（ＳＴ１～ＳＴ１２）において部品装着部が昇降する際の物理量を計測する計測工程（ＳＴ２～ＳＴ６）と、計測された物理量の変化に基づき部品Ｄと基板２の接触を判定する判定工程（ＳＴ３，ＳＴ５）と、を含む。【選択図】図５