RADIATION-SENSITIVE COMPOSITION AND METHOD FOR PRODUCING CURED FILM
To provide a radiation-sensitive composition capable of forming a cured film excellent in storage stability and chemical resistance.SOLUTION: A radiation-sensitive composition comprises: a polymer component containing a first structural unit having an oxiranyl group and a second structural unit havi...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HONDA AKIHISA NAKANISHI TAKUYA KURATA RYOHEI YOSHIDA CHIKA YASHIRO TAKAO MIMURA TOKIO |
| description | To provide a radiation-sensitive composition capable of forming a cured film excellent in storage stability and chemical resistance.SOLUTION: A radiation-sensitive composition comprises: a polymer component containing a first structural unit having an oxiranyl group and a second structural unit having a carboxyl group; a photosensitizer; at least one compound selected from the group consisting of an amine compound, an imidazole compound, and an isocyanate compound; and a solvent, a content ratio of the first structural unit is more than 20 mass% and 65 mass% or less with respect to a total structural units constituting the polymer component, and a content ratio of the second structural unit is more than 5 mass% and 25 mass% or less with respect to a total structural units constituting the polymer component, and the solvent contains a high dH solvent, in which the hydrogen bond term dH of the Hansen solubility parameter is 10.0 or more, of more than 20 mass% with respect to the total amount of the solvent contained in the radiation-sensitive composition and the contained amount of a low boiling point solvent with a boiling point of 160°C. or less is more than 50 mass% based on the total amount of the solvent.SELECTED DRAWING: None
【課題】保存安定性に優れ、かつ耐薬品性に優れた硬化膜を形成することができる感放射線性組成物を提供すること。【解決手段】オキシラニル基を有する第１構造単位と、カルボキシ基を有する第２構造単位とを含む重合体成分と、感光剤と、アミン系化合物、イミダゾール系化合物及びイソシアネート系化合物よりなる群から選択される少なくとも１種の化合物と、溶剤とを含有し、第１構造単位の含有割合が重合体成分を構成する全構造単位に対して２０質量％を超え６５質量％以下であり、第２構造単位の含有割合が重合体成分を構成する全構造単位に対して５質量％を超え２５質量％以下であり、溶剤は、ハンセン溶解度パラメータの水素結合項ｄＨが１０．０以上である高ｄＨ溶媒を、感放射線性組成物に含まれる溶剤の全量に対して２０質量％以上含み、かつ沸点が１６０℃以下である低沸点溶媒を、前記溶剤の全量に対して５０質量％よりも多く含む感放射線性組成物とする。【選択図】なし |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2024036513A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2024036513A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2024036513A3</originalsourceid><addsrcrecordid>eNrjZHAOcnTxdAzx9PfTDXb1C_YM8QxzVXD29w3wB7H9_RQc_VwUfF1DPPxdFNz8gxQCgvxdQp09_dwVnEODXIFinj6-PAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDIxMDYzNTQ2NGYKEUAnaksCQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RADIATION-SENSITIVE COMPOSITION AND METHOD FOR PRODUCING CURED FILM</title><source>esp@cenet</source><creator>HONDA AKIHISA ; NAKANISHI TAKUYA ; KURATA RYOHEI ; YOSHIDA CHIKA ; YASHIRO TAKAO ; MIMURA TOKIO</creator><creatorcontrib>HONDA AKIHISA ; NAKANISHI TAKUYA ; KURATA RYOHEI ; YOSHIDA CHIKA ; YASHIRO TAKAO ; MIMURA TOKIO</creatorcontrib><description>To provide a radiation-sensitive composition capable of forming a cured film excellent in storage stability and chemical resistance.SOLUTION: A radiation-sensitive composition comprises: a polymer component containing a first structural unit having an oxiranyl group and a second structural unit having a carboxyl group; a photosensitizer; at least one compound selected from the group consisting of an amine compound, an imidazole compound, and an isocyanate compound; and a solvent, a content ratio of the first structural unit is more than 20 mass% and 65 mass% or less with respect to a total structural units constituting the polymer component, and a content ratio of the second structural unit is more than 5 mass% and 25 mass% or less with respect to a total structural units constituting the polymer component, and the solvent contains a high dH solvent, in which the hydrogen bond term dH of the Hansen solubility parameter is 10.0 or more, of more than 20 mass% with respect to the total amount of the solvent contained in the radiation-sensitive composition and the contained amount of a low boiling point solvent with a boiling point of 160°C. or less is more than 50 mass% based on the total amount of the solvent.SELECTED DRAWING: None
【課題】保存安定性に優れ、かつ耐薬品性に優れた硬化膜を形成することができる感放射線性組成物を提供すること。【解決手段】オキシラニル基を有する第１構造単位と、カルボキシ基を有する第２構造単位とを含む重合体成分と、感光剤と、アミン系化合物、イミダゾール系化合物及びイソシアネート系化合物よりなる群から選択される少なくとも１種の化合物と、溶剤とを含有し、第１構造単位の含有割合が重合体成分を構成する全構造単位に対して２０質量％を超え６５質量％以下であり、第２構造単位の含有割合が重合体成分を構成する全構造単位に対して５質量％を超え２５質量％以下であり、溶剤は、ハンセン溶解度パラメータの水素結合項ｄＨが１０．０以上である高ｄＨ溶媒を、感放射線性組成物に含まれる溶剤の全量に対して２０質量％以上含み、かつ沸点が１６０℃以下である低沸点溶媒を、前記溶剤の全量に対して５０質量％よりも多く含む感放射線性組成物とする。【選択図】なし</description><language>eng ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240315&DB=EPODOC&CC=JP&NR=2024036513A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240315&DB=EPODOC&CC=JP&NR=2024036513A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONDA AKIHISA</creatorcontrib><creatorcontrib>NAKANISHI TAKUYA</creatorcontrib><creatorcontrib>KURATA RYOHEI</creatorcontrib><creatorcontrib>YOSHIDA CHIKA</creatorcontrib><creatorcontrib>YASHIRO TAKAO</creatorcontrib><creatorcontrib>MIMURA TOKIO</creatorcontrib><title>RADIATION-SENSITIVE COMPOSITION AND METHOD FOR PRODUCING CURED FILM</title><description>To provide a radiation-sensitive composition capable of forming a cured film excellent in storage stability and chemical resistance.SOLUTION: A radiation-sensitive composition comprises: a polymer component containing a first structural unit having an oxiranyl group and a second structural unit having a carboxyl group; a photosensitizer; at least one compound selected from the group consisting of an amine compound, an imidazole compound, and an isocyanate compound; and a solvent, a content ratio of the first structural unit is more than 20 mass% and 65 mass% or less with respect to a total structural units constituting the polymer component, and a content ratio of the second structural unit is more than 5 mass% and 25 mass% or less with respect to a total structural units constituting the polymer component, and the solvent contains a high dH solvent, in which the hydrogen bond term dH of the Hansen solubility parameter is 10.0 or more, of more than 20 mass% with respect to the total amount of the solvent contained in the radiation-sensitive composition and the contained amount of a low boiling point solvent with a boiling point of 160°C. or less is more than 50 mass% based on the total amount of the solvent.SELECTED DRAWING: None
【課題】保存安定性に優れ、かつ耐薬品性に優れた硬化膜を形成することができる感放射線性組成物を提供すること。【解決手段】オキシラニル基を有する第１構造単位と、カルボキシ基を有する第２構造単位とを含む重合体成分と、感光剤と、アミン系化合物、イミダゾール系化合物及びイソシアネート系化合物よりなる群から選択される少なくとも１種の化合物と、溶剤とを含有し、第１構造単位の含有割合が重合体成分を構成する全構造単位に対して２０質量％を超え６５質量％以下であり、第２構造単位の含有割合が重合体成分を構成する全構造単位に対して５質量％を超え２５質量％以下であり、溶剤は、ハンセン溶解度パラメータの水素結合項ｄＨが１０．０以上である高ｄＨ溶媒を、感放射線性組成物に含まれる溶剤の全量に対して２０質量％以上含み、かつ沸点が１６０℃以下である低沸点溶媒を、前記溶剤の全量に対して５０質量％よりも多く含む感放射線性組成物とする。【選択図】なし</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOcnTxdAzx9PfTDXb1C_YM8QxzVXD29w3wB7H9_RQc_VwUfF1DPPxdFNz8gxQCgvxdQp09_dwVnEODXIFinj6-PAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDIxMDYzNTQ2NGYKEUAnaksCQ</recordid><startdate>20240315</startdate><enddate>20240315</enddate><creator>HONDA AKIHISA</creator><creator>NAKANISHI TAKUYA</creator><creator>KURATA RYOHEI</creator><creator>YOSHIDA CHIKA</creator><creator>YASHIRO TAKAO</creator><creator>MIMURA TOKIO</creator><scope>EVB</scope></search><sort><creationdate>20240315</creationdate><title>RADIATION-SENSITIVE COMPOSITION AND METHOD FOR PRODUCING CURED FILM</title><author>HONDA AKIHISA ; NAKANISHI TAKUYA ; KURATA RYOHEI ; YOSHIDA CHIKA ; YASHIRO TAKAO ; MIMURA TOKIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024036513A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HONDA AKIHISA</creatorcontrib><creatorcontrib>NAKANISHI TAKUYA</creatorcontrib><creatorcontrib>KURATA RYOHEI</creatorcontrib><creatorcontrib>YOSHIDA CHIKA</creatorcontrib><creatorcontrib>YASHIRO TAKAO</creatorcontrib><creatorcontrib>MIMURA TOKIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONDA AKIHISA</au><au>NAKANISHI TAKUYA</au><au>KURATA RYOHEI</au><au>YOSHIDA CHIKA</au><au>YASHIRO TAKAO</au><au>MIMURA TOKIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RADIATION-SENSITIVE COMPOSITION AND METHOD FOR PRODUCING CURED FILM</title><date>2024-03-15</date><risdate>2024</risdate><abstract>To provide a radiation-sensitive composition capable of forming a cured film excellent in storage stability and chemical resistance.SOLUTION: A radiation-sensitive composition comprises: a polymer component containing a first structural unit having an oxiranyl group and a second structural unit having a carboxyl group; a photosensitizer; at least one compound selected from the group consisting of an amine compound, an imidazole compound, and an isocyanate compound; and a solvent, a content ratio of the first structural unit is more than 20 mass% and 65 mass% or less with respect to a total structural units constituting the polymer component, and a content ratio of the second structural unit is more than 5 mass% and 25 mass% or less with respect to a total structural units constituting the polymer component, and the solvent contains a high dH solvent, in which the hydrogen bond term dH of the Hansen solubility parameter is 10.0 or more, of more than 20 mass% with respect to the total amount of the solvent contained in the radiation-sensitive composition and the contained amount of a low boiling point solvent with a boiling point of 160°C. or less is more than 50 mass% based on the total amount of the solvent.SELECTED DRAWING: None
【課題】保存安定性に優れ、かつ耐薬品性に優れた硬化膜を形成することができる感放射線性組成物を提供すること。【解決手段】オキシラニル基を有する第１構造単位と、カルボキシ基を有する第２構造単位とを含む重合体成分と、感光剤と、アミン系化合物、イミダゾール系化合物及びイソシアネート系化合物よりなる群から選択される少なくとも１種の化合物と、溶剤とを含有し、第１構造単位の含有割合が重合体成分を構成する全構造単位に対して２０質量％を超え６５質量％以下であり、第２構造単位の含有割合が重合体成分を構成する全構造単位に対して５質量％を超え２５質量％以下であり、溶剤は、ハンセン溶解度パラメータの水素結合項ｄＨが１０．０以上である高ｄＨ溶媒を、感放射線性組成物に含まれる溶剤の全量に対して２０質量％以上含み、かつ沸点が１６０℃以下である低沸点溶媒を、前記溶剤の全量に対して５０質量％よりも多く含む感放射線性組成物とする。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2024036513A |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | RADIATION-SENSITIVE COMPOSITION AND METHOD FOR PRODUCING CURED FILM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T08%3A08%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HONDA%20AKIHISA&rft.date=2024-03-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2024036513A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |