FLUX AND SOLDER PASTE

To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hy...

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Bibliographische Detailangaben
Hauptverfasser: MIYAGI NANAKO, MASAKI TSUYOSHI, TAKEMASA TETSU, TAKAGI KAZUNOBU, HASHIMOTO YUTAKA, HAYAKAWA MEGUMI, KANEKO MUTSUKI, SAITO RYO, NAGAI TOMOKO
Format: Patent
Sprache:eng ; jpn
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