FLUX AND SOLDER PASTE
To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hy...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!