FLUX AND SOLDER PASTE
To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hy...
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| creator | MIYAGI NANAKO MASAKI TSUYOSHI TAKEMASA TETSU TAKAGI KAZUNOBU HASHIMOTO YUTAKA HAYAKAWA MEGUMI KANEKO MUTSUKI SAITO RYO NAGAI TOMOKO |
| description | To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), wherein the amine hydriodide includes a complex alicyclic amine hydriodide. As the complex alicyclic amine hydriodide, at least one selected from the group consisting of piperidine hydriodide and pipecoline hydriodide is preferable.SELECTED DRAWING: None
【課題】はんだ付けの際にボイドの発生をより抑制することができるフラックス、及びこのフラックスを用いたソルダペーストを提供する。【解決手段】本発明のフラックスは、ロジンと、溶剤と、チキソ剤と、アミンヨウ化水素酸塩と、活性剤（ただし、アミンヨウ化水素酸塩を除く）とを含有し、アミンヨウ化水素酸塩が、複素脂環式アミンヨウ化水素酸塩を含むことを特徴とする。この複素脂環式アミンヨウ化水素酸塩としては、ピペリジンヨウ化水素酸塩及びピペコリンヨウ化水素酸塩からなる群より選択される少なくとも一種が好ましい。【選択図】なし |
| format | Patent |
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【課題】はんだ付けの際にボイドの発生をより抑制することができるフラックス、及びこのフラックスを用いたソルダペーストを提供する。【解決手段】本発明のフラックスは、ロジンと、溶剤と、チキソ剤と、アミンヨウ化水素酸塩と、活性剤（ただし、アミンヨウ化水素酸塩を除く）とを含有し、アミンヨウ化水素酸塩が、複素脂環式アミンヨウ化水素酸塩を含むことを特徴とする。この複素脂環式アミンヨウ化水素酸塩としては、ピペリジンヨウ化水素酸塩及びピペコリンヨウ化水素酸塩からなる群より選択される少なくとも一種が好ましい。【選択図】なし</description><language>eng ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240201&DB=EPODOC&CC=JP&NR=2024014538A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240201&DB=EPODOC&CC=JP&NR=2024014538A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAGI NANAKO</creatorcontrib><creatorcontrib>MASAKI TSUYOSHI</creatorcontrib><creatorcontrib>TAKEMASA TETSU</creatorcontrib><creatorcontrib>TAKAGI KAZUNOBU</creatorcontrib><creatorcontrib>HASHIMOTO YUTAKA</creatorcontrib><creatorcontrib>HAYAKAWA MEGUMI</creatorcontrib><creatorcontrib>KANEKO MUTSUKI</creatorcontrib><creatorcontrib>SAITO RYO</creatorcontrib><creatorcontrib>NAGAI TOMOKO</creatorcontrib><title>FLUX AND SOLDER PASTE</title><description>To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), wherein the amine hydriodide includes a complex alicyclic amine hydriodide. As the complex alicyclic amine hydriodide, at least one selected from the group consisting of piperidine hydriodide and pipecoline hydriodide is preferable.SELECTED DRAWING: None
【課題】はんだ付けの際にボイドの発生をより抑制することができるフラックス、及びこのフラックスを用いたソルダペーストを提供する。【解決手段】本発明のフラックスは、ロジンと、溶剤と、チキソ剤と、アミンヨウ化水素酸塩と、活性剤（ただし、アミンヨウ化水素酸塩を除く）とを含有し、アミンヨウ化水素酸塩が、複素脂環式アミンヨウ化水素酸塩を含むことを特徴とする。この複素脂環式アミンヨウ化水素酸塩としては、ピペリジンヨウ化水素酸塩及びピペコリンヨウ化水素酸塩からなる群より選択される少なくとも一種が好ましい。【選択図】なし</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB18wmNUHD0c1EI9vdxcQ1SCHAMDnHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkYmBoYmpsYWjsZEKQIAwlkfIg</recordid><startdate>20240201</startdate><enddate>20240201</enddate><creator>MIYAGI NANAKO</creator><creator>MASAKI TSUYOSHI</creator><creator>TAKEMASA TETSU</creator><creator>TAKAGI KAZUNOBU</creator><creator>HASHIMOTO YUTAKA</creator><creator>HAYAKAWA MEGUMI</creator><creator>KANEKO MUTSUKI</creator><creator>SAITO RYO</creator><creator>NAGAI TOMOKO</creator><scope>EVB</scope></search><sort><creationdate>20240201</creationdate><title>FLUX AND SOLDER PASTE</title><author>MIYAGI NANAKO ; MASAKI TSUYOSHI ; TAKEMASA TETSU ; TAKAGI KAZUNOBU ; HASHIMOTO YUTAKA ; HAYAKAWA MEGUMI ; KANEKO MUTSUKI ; SAITO RYO ; NAGAI TOMOKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024014538A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAGI NANAKO</creatorcontrib><creatorcontrib>MASAKI TSUYOSHI</creatorcontrib><creatorcontrib>TAKEMASA TETSU</creatorcontrib><creatorcontrib>TAKAGI KAZUNOBU</creatorcontrib><creatorcontrib>HASHIMOTO YUTAKA</creatorcontrib><creatorcontrib>HAYAKAWA MEGUMI</creatorcontrib><creatorcontrib>KANEKO MUTSUKI</creatorcontrib><creatorcontrib>SAITO RYO</creatorcontrib><creatorcontrib>NAGAI TOMOKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAGI NANAKO</au><au>MASAKI TSUYOSHI</au><au>TAKEMASA TETSU</au><au>TAKAGI KAZUNOBU</au><au>HASHIMOTO YUTAKA</au><au>HAYAKAWA MEGUMI</au><au>KANEKO MUTSUKI</au><au>SAITO RYO</au><au>NAGAI TOMOKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLUX AND SOLDER PASTE</title><date>2024-02-01</date><risdate>2024</risdate><abstract>To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), wherein the amine hydriodide includes a complex alicyclic amine hydriodide. As the complex alicyclic amine hydriodide, at least one selected from the group consisting of piperidine hydriodide and pipecoline hydriodide is preferable.SELECTED DRAWING: None
【課題】はんだ付けの際にボイドの発生をより抑制することができるフラックス、及びこのフラックスを用いたソルダペーストを提供する。【解決手段】本発明のフラックスは、ロジンと、溶剤と、チキソ剤と、アミンヨウ化水素酸塩と、活性剤（ただし、アミンヨウ化水素酸塩を除く）とを含有し、アミンヨウ化水素酸塩が、複素脂環式アミンヨウ化水素酸塩を含むことを特徴とする。この複素脂環式アミンヨウ化水素酸塩としては、ピペリジンヨウ化水素酸塩及びピペコリンヨウ化水素酸塩からなる群より選択される少なくとも一種が好ましい。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | FLUX AND SOLDER PASTE |
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