CONNECTOR DEVICE
To facilitate radiation of heat of an IC incorporated in a connector.SOLUTION: A connector device 1 comprises a circuit board 10, and a connector 20 installed on the circuit board 10. The connector 20 has: an outer conductor 33 that can be conductive with a shield layer 91 of a shield wire 90; a sub...
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| creator | MIYAJO AKIRA IWAMOTO TAKUYA MASHITA MAKOTO MORIGUCHI MASAKATSU |
| description | To facilitate radiation of heat of an IC incorporated in a connector.SOLUTION: A connector device 1 comprises a circuit board 10, and a connector 20 installed on the circuit board 10. The connector 20 has: an outer conductor 33 that can be conductive with a shield layer 91 of a shield wire 90; a sub substrate 35; an IC 36 mounted on the sub substrate 35; and a heat transfer part (a heat radiation sheet 61, a metal plate 60, the outer conductor 33, and a sub ground circuit 52) that propagates heat of the IC 36 to the shield layer 91. Due to this configuration, the heat of the IC 36 can be propagated to the shield layer 91 of the shield wire 90 via the heat transfer part, which can facilitate radiation of heat of the IC 36.SELECTED DRAWING: Figure 4
【課題】コネクタに内蔵されるＩＣの熱を逃がしやすくする。【解決手段】コネクタ装置１は、回路基板１０と、回路基板１０に設置されるコネクタ２０と、を備えている。コネクタ２０は、シールド電線９０のシールド層９１と導通可能な外導体３３と、サブ基板３５と、サブ基板３５に実装されるＩＣ３６と、ＩＣ３６の熱をシールド層９１に伝える伝熱部（放熱シート６１、金属板６０、外導体３３、サブグランド回路５２）と、を有している。この構成によれば、ＩＣ３６の熱を、伝熱部を介してシールド電線９０のシールド層９１に伝えることができるため、ＩＣ３６の熱を逃がしやすい。【選択図】図４ |
| format | Patent |
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【課題】コネクタに内蔵されるＩＣの熱を逃がしやすくする。【解決手段】コネクタ装置１は、回路基板１０と、回路基板１０に設置されるコネクタ２０と、を備えている。コネクタ２０は、シールド電線９０のシールド層９１と導通可能な外導体３３と、サブ基板３５と、サブ基板３５に実装されるＩＣ３６と、ＩＣ３６の熱をシールド層９１に伝える伝熱部（放熱シート６１、金属板６０、外導体３３、サブグランド回路５２）と、を有している。この構成によれば、ＩＣ３６の熱を、伝熱部を介してシールド電線９０のシールド層９１に伝えることができるため、ＩＣ３６の熱を逃がしやすい。【選択図】図４</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=JP&NR=2024004882A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=JP&NR=2024004882A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAJO AKIRA</creatorcontrib><creatorcontrib>IWAMOTO TAKUYA</creatorcontrib><creatorcontrib>MASHITA MAKOTO</creatorcontrib><creatorcontrib>MORIGUCHI MASAKATSU</creatorcontrib><title>CONNECTOR DEVICE</title><description>To facilitate radiation of heat of an IC incorporated in a connector.SOLUTION: A connector device 1 comprises a circuit board 10, and a connector 20 installed on the circuit board 10. The connector 20 has: an outer conductor 33 that can be conductive with a shield layer 91 of a shield wire 90; a sub substrate 35; an IC 36 mounted on the sub substrate 35; and a heat transfer part (a heat radiation sheet 61, a metal plate 60, the outer conductor 33, and a sub ground circuit 52) that propagates heat of the IC 36 to the shield layer 91. Due to this configuration, the heat of the IC 36 can be propagated to the shield layer 91 of the shield wire 90 via the heat transfer part, which can facilitate radiation of heat of the IC 36.SELECTED DRAWING: Figure 4
【課題】コネクタに内蔵されるＩＣの熱を逃がしやすくする。【解決手段】コネクタ装置１は、回路基板１０と、回路基板１０に設置されるコネクタ２０と、を備えている。コネクタ２０は、シールド電線９０のシールド層９１と導通可能な外導体３３と、サブ基板３５と、サブ基板３５に実装されるＩＣ３６と、ＩＣ３６の熱をシールド層９１に伝える伝熱部（放熱シート６１、金属板６０、外導体３３、サブグランド回路５２）と、を有している。この構成によれば、ＩＣ３６の熱を、伝熱部を介してシールド電線９０のシールド層９１に伝えることができるため、ＩＣ３６の熱を逃がしやすい。【選択図】図４</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBw9vfzc3UO8Q9ScHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGJgYGJhYWRo7GRCkCADh4HeI</recordid><startdate>20240117</startdate><enddate>20240117</enddate><creator>MIYAJO AKIRA</creator><creator>IWAMOTO TAKUYA</creator><creator>MASHITA MAKOTO</creator><creator>MORIGUCHI MASAKATSU</creator><scope>EVB</scope></search><sort><creationdate>20240117</creationdate><title>CONNECTOR DEVICE</title><author>MIYAJO AKIRA ; IWAMOTO TAKUYA ; MASHITA MAKOTO ; MORIGUCHI MASAKATSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024004882A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAJO AKIRA</creatorcontrib><creatorcontrib>IWAMOTO TAKUYA</creatorcontrib><creatorcontrib>MASHITA MAKOTO</creatorcontrib><creatorcontrib>MORIGUCHI MASAKATSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAJO AKIRA</au><au>IWAMOTO TAKUYA</au><au>MASHITA MAKOTO</au><au>MORIGUCHI MASAKATSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONNECTOR DEVICE</title><date>2024-01-17</date><risdate>2024</risdate><abstract>To facilitate radiation of heat of an IC incorporated in a connector.SOLUTION: A connector device 1 comprises a circuit board 10, and a connector 20 installed on the circuit board 10. The connector 20 has: an outer conductor 33 that can be conductive with a shield layer 91 of a shield wire 90; a sub substrate 35; an IC 36 mounted on the sub substrate 35; and a heat transfer part (a heat radiation sheet 61, a metal plate 60, the outer conductor 33, and a sub ground circuit 52) that propagates heat of the IC 36 to the shield layer 91. Due to this configuration, the heat of the IC 36 can be propagated to the shield layer 91 of the shield wire 90 via the heat transfer part, which can facilitate radiation of heat of the IC 36.SELECTED DRAWING: Figure 4
【課題】コネクタに内蔵されるＩＣの熱を逃がしやすくする。【解決手段】コネクタ装置１は、回路基板１０と、回路基板１０に設置されるコネクタ２０と、を備えている。コネクタ２０は、シールド電線９０のシールド層９１と導通可能な外導体３３と、サブ基板３５と、サブ基板３５に実装されるＩＣ３６と、ＩＣ３６の熱をシールド層９１に伝える伝熱部（放熱シート６１、金属板６０、外導体３３、サブグランド回路５２）と、を有している。この構成によれば、ＩＣ３６の熱を、伝熱部を介してシールド電線９０のシールド層９１に伝えることができるため、ＩＣ３６の熱を逃がしやすい。【選択図】図４</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | CONNECTOR DEVICE |
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