CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER
To provide a curable resin composition which has high photosensitivity and excellent alkali developability and is capable of forming a cured product excellent in heat resistance, low linear expansion, and dielectric characteristics, and to provide a cured product of the curable resin composition, an...
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| creator | YAMADA SHUNSUKE KAMEYAMA YASUSHI |
| description | To provide a curable resin composition which has high photosensitivity and excellent alkali developability and is capable of forming a cured product excellent in heat resistance, low linear expansion, and dielectric characteristics, and to provide a cured product of the curable resin composition, an insulating material, and a resist member.SOLUTION: The curable resin composition contains: a resin (A) having an acid group and a polymerizable unsaturated group; and a curable resin (B) having a structure represented by the following general formula (1) and having at least one polymerizable unsaturated group at a molecular terminal. [In the formula (1), Ra and Rb are each independently a C1-12 alkyl group, an aryl group, an aralkyl group or a cycloalkyl group; X is a C1-50 hydrocarbon group; l is an integer of 0-3; m is an integer of 2-20; and n is an integer of 2-20.]SELECTED DRAWING: None
【課題】高い光感度及び優れたアルカリ現像性を有し、耐熱性、低線膨張性及び誘電特性に優れた硬化物を形成可能な硬化性樹脂組成物、前記硬化性樹脂組成物の硬化物、絶縁材料及びレジスト部材を提供する。【解決手段】酸基及び重合性不飽和基を有する樹脂（Ａ）と、下記一般式（１）で表される構造及び分子末端に少なくとも１つの重合性不飽和基を有する硬化性樹脂（Ｂ）とを含有すること特徴とする硬化性樹脂組成物。【化１】TIFF2023183616000019.tif32109［式（１）中、Ｒａ及びＲｂは、それぞれ独立して、炭素原子数１～１２のアルキル基、アリール基、アラルキル基、又はシクロアルキル基の何れかである。Ｘは、炭素原子数１～５０の炭化水素基であり、ｌは、０～３の整数であり、ｍは、２～２０の整数であり、ｎは、２～２０の整数である。］【選択図】なし |
| format | Patent |
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【課題】高い光感度及び優れたアルカリ現像性を有し、耐熱性、低線膨張性及び誘電特性に優れた硬化物を形成可能な硬化性樹脂組成物、前記硬化性樹脂組成物の硬化物、絶縁材料及びレジスト部材を提供する。【解決手段】酸基及び重合性不飽和基を有する樹脂（Ａ）と、下記一般式（１）で表される構造及び分子末端に少なくとも１つの重合性不飽和基を有する硬化性樹脂（Ｂ）とを含有すること特徴とする硬化性樹脂組成物。【化１】TIFF2023183616000019.tif32109［式（１）中、Ｒａ及びＲｂは、それぞれ独立して、炭素原子数１～１２のアルキル基、アリール基、アラルキル基、又はシクロアルキル基の何れかである。Ｘは、炭素原子数１～５０の炭化水素基であり、ｌは、０～３の整数であり、ｍは、２～２０の整数であり、ｎは、２～２０の整数である。］【選択図】なし</description><language>eng ; jpn</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231228&DB=EPODOC&CC=JP&NR=2023183616A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231228&DB=EPODOC&CC=JP&NR=2023183616A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMADA SHUNSUKE</creatorcontrib><creatorcontrib>KAMEYAMA YASUSHI</creatorcontrib><title>CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER</title><description>To provide a curable resin composition which has high photosensitivity and excellent alkali developability and is capable of forming a cured product excellent in heat resistance, low linear expansion, and dielectric characteristics, and to provide a cured product of the curable resin composition, an insulating material, and a resist member.SOLUTION: The curable resin composition contains: a resin (A) having an acid group and a polymerizable unsaturated group; and a curable resin (B) having a structure represented by the following general formula (1) and having at least one polymerizable unsaturated group at a molecular terminal. [In the formula (1), Ra and Rb are each independently a C1-12 alkyl group, an aryl group, an aralkyl group or a cycloalkyl group; X is a C1-50 hydrocarbon group; l is an integer of 0-3; m is an integer of 2-20; and n is an integer of 2-20.]SELECTED DRAWING: None
【課題】高い光感度及び優れたアルカリ現像性を有し、耐熱性、低線膨張性及び誘電特性に優れた硬化物を形成可能な硬化性樹脂組成物、前記硬化性樹脂組成物の硬化物、絶縁材料及びレジスト部材を提供する。【解決手段】酸基及び重合性不飽和基を有する樹脂（Ａ）と、下記一般式（１）で表される構造及び分子末端に少なくとも１つの重合性不飽和基を有する硬化性樹脂（Ｂ）とを含有すること特徴とする硬化性樹脂組成物。【化１】TIFF2023183616000019.tif32109［式（１）中、Ｒａ及びＲｂは、それぞれ独立して、炭素原子数１～１２のアルキル基、アリール基、アラルキル基、又はシクロアルキル基の何れかである。Ｘは、炭素原子数１～５０の炭化水素基であり、ｌは、０～３の整数であり、ｍは、２～２０の整数であり、ｎは、２～２０の整数である。］【選択図】なし</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7sKwjAUQLM4iPoPF-cItoHimiZXjeRFcjOXInESLdT_RxE_wOkM55wli6ok2VuEhNl4UMHFkA2Z4Dl8FGqIKeiiiIPxuVhJxp_AScJkpOUgvf6umcCh6zGt2eI23ue6-XHFtkckdd7V6TnUeRqv9VFfwyW2-1Y0B9E1nRR_RW_K-S9o</recordid><startdate>20231228</startdate><enddate>20231228</enddate><creator>YAMADA SHUNSUKE</creator><creator>KAMEYAMA YASUSHI</creator><scope>EVB</scope></search><sort><creationdate>20231228</creationdate><title>CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER</title><author>YAMADA SHUNSUKE ; KAMEYAMA YASUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023183616A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMADA SHUNSUKE</creatorcontrib><creatorcontrib>KAMEYAMA YASUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMADA SHUNSUKE</au><au>KAMEYAMA YASUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER</title><date>2023-12-28</date><risdate>2023</risdate><abstract>To provide a curable resin composition which has high photosensitivity and excellent alkali developability and is capable of forming a cured product excellent in heat resistance, low linear expansion, and dielectric characteristics, and to provide a cured product of the curable resin composition, an insulating material, and a resist member.SOLUTION: The curable resin composition contains: a resin (A) having an acid group and a polymerizable unsaturated group; and a curable resin (B) having a structure represented by the following general formula (1) and having at least one polymerizable unsaturated group at a molecular terminal. [In the formula (1), Ra and Rb are each independently a C1-12 alkyl group, an aryl group, an aralkyl group or a cycloalkyl group; X is a C1-50 hydrocarbon group; l is an integer of 0-3; m is an integer of 2-20; and n is an integer of 2-20.]SELECTED DRAWING: None
【課題】高い光感度及び優れたアルカリ現像性を有し、耐熱性、低線膨張性及び誘電特性に優れた硬化物を形成可能な硬化性樹脂組成物、前記硬化性樹脂組成物の硬化物、絶縁材料及びレジスト部材を提供する。【解決手段】酸基及び重合性不飽和基を有する樹脂（Ａ）と、下記一般式（１）で表される構造及び分子末端に少なくとも１つの重合性不飽和基を有する硬化性樹脂（Ｂ）とを含有すること特徴とする硬化性樹脂組成物。【化１】TIFF2023183616000019.tif32109［式（１）中、Ｒａ及びＲｂは、それぞれ独立して、炭素原子数１～１２のアルキル基、アリール基、アラルキル基、又はシクロアルキル基の何れかである。Ｘは、炭素原子数１～５０の炭化水素基であり、ｌは、０～３の整数であり、ｍは、２～２０の整数であり、ｎは、２～２０の整数である。］【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER |
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