RESIN FILM

To provide a resin film that is superior in flex resistance, impact resistance, flexibility, and elongation.SOLUTION: A resin film is formed by curing a resin composition including a polyisocyanate composition. The resin film has at least one of urethane, urea, and allophanate structures. The resin...

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Bibliographische Detailangaben
1. Verfasser:	HIGASHI MASATSUGU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a resin film that is superior in flex resistance, impact resistance, flexibility, and elongation.SOLUTION: A resin film is formed by curing a resin composition including a polyisocyanate composition. The resin film has at least one of urethane, urea, and allophanate structures. The resin film has a peak temperature of the loss elastic modulus E'' of -70°C or higher and 60°C or lower, as determined by dynamic viscoelasticity measurement, a storage elastic modulus E' of 5.0×104 Pa or more and 5.0×107 Pa or less at 23°C, and a peak value of tanδ of 0.5 or more.SELECTED DRAWING: None 【課題】耐屈曲性、耐衝撃性、柔軟性、及び伸び率に優れた樹脂膜の提供。【解決手段】ポリイソシアネート組成物を含む樹脂組成物を硬化させた樹脂膜であって、前記樹脂膜は、ウレタン構造、ウレア構造、アロファネート構造のうち、少なくとも１種以上の構造を有し、前記樹脂膜は、動的粘弾性測定により得られる損失弾性率Ｅ''のピーク温度が－７０℃以上６０℃以下であり、２３℃の貯蔵弾性率Ｅ'が５．０×１０４Ｐａ以上５．０×１０７Ｐａ以下であり、且つ、ｔａｎδのピーク値が０．５以上である、樹脂膜。【選択図】なし