POLISHING LIQUID COMPOSITION FOR SILICON SUBSTRATE

To provide a polishing liquid composition for silicon substrates that can both improve polishing speed and storage stability of the concentrate, a method for polishing silicon substrates using the composition, and a method for manufacturing semiconductor substrates.SOLUTION: A polishing liquid composition for silicon substrates includes silica particles, a water-soluble polymer having an amino group to which a hydroxyalkyl group is attached, and water. In a silicon substrate polishing method in which the silicon substrate finishing and polishing steps 1 and 2 are performed in this order, the silicon substrate is polished in the finishing and polishing step 1 using this polishing liquid composition for silicon substrates. In the finishing and polishing step 2, the silicon substrate is polished using a polishing liquid composition containing silica particles and water-soluble polymers.SELECTED DRAWING: None 【課題】研磨速度の向上と濃縮物の保存安定性とを両立できるシリコン基板用研磨液組成物、これを用いたシリコン基板の研磨方法及び半導体基板の製造方法を提供する。【解決手段】シリコン基板用研磨液組成物は、シリカ粒子と、ヒドロキシアルキル基が結合したアミノ基を有する水溶性高分子と、水と、を含む。シリコン基板の仕上げ研磨工程１と、仕上げ研磨工程２とが、この順で行われるシリコン基板の研磨方法おいて、仕上げ研磨工程１では、このシリコン基板用研磨液組成物を用いて研磨磨する。仕上げ研磨工程２では、シリカ粒子及び水溶性高分子を含む研磨液組成物を用いて研磨する。【選択図】なし