CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING THE SAME, AND CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

To provide an adhesive film for circuit connection which contains satisfactorily dispersed conductive particles and can improve insulation properties between adjacent electrodes in a connection structure and capturing properties of the conductive particles, and conductive particles which are used in the adhesive film for circuit connection.SOLUTION: Conductive particles P that are used in manufacture of an adhesive film for circuit connection having a mono-dispersion rate of 90.0% or more include a conductive mother particle 31, and child particles 32 coating the surface of the mother particle 31, wherein when the particle radius and the particle diameter of the child particles 32 determined through observation at a magnitude of 30,000 times by SEM are represented by rX and dX, and the average particle diameter of the child particles 32 that is the average value of the particle diameter dX is represented by dY, the modified profile of the child particles 32 determined by the following expression (1) is 2.0 or less. Modified profile=D/rY×100. In the expression (1), rY represents a radius of a virtual ball with a diameter equal to dY, and D represents an average value of an absolute difference between the particle radius rX of the child particles 32 and the radius rY of the virtual ball.SELECTED DRAWING: Figure 1 【課題】 良好に分散された導電粒子を含み、接続構造体における隣り合う電極間の絶縁性と導電粒子の捕捉性を向上させることができる回路接続用接着フィルム、及び、該回路接続用接着フィルムに用いられる導電粒子を提供すること。【解決手段】 単分散率が９０．０％以上である回路接続用接着フィルムの製造に用いられる導電粒子であって、導電性の母粒子３１と、該母粒子３１の表面を被覆する子粒子３２と、を備え、ＳＥＭにより倍率３００００倍で観察して求められる子粒子３２の粒子半径及び粒子直径をそれぞれｒＸ及びｄＸとし、該粒子直径ｄＸの平均値である子粒子３２の平均粒子径をｄＹとすると、下記式（１）で求められる子粒子３２の異形度が２．０以下である、導電粒子Ｐ。異形度＝Ｄ／ｒＹ×１００ （１）［式（１）中、ｒＹは、直径がｄＹに等しい仮想球の半径を示し、Ｄは、子粒子３２の粒子半径ｒＸと仮想球の半径ｒＹとの絶対差の平均値を示す。］【選択図】図１